CLINTON, NY – As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 9-11, in Nuremberg, Germany.

Tuesday, May 9

• Materials for Low Warpage Power Module Assembly: Energy and C02 Reduction Through Low-Temperature Processes by Regional Technical Manager and Technologist – Advanced Applications Andreas Karch
  • • This presentation examines different material properties, such as CTE (coefficient of thermal expansion), which cause assembly difficulties at higher process temperatures. Lowering peak temperature during soldering counteracts this and saves additional energy.
    • The presentation will be given in German.

Wednesday, May 10

• Power Electronics Materials and Process Optimization by Product Manager – ESM/Power Electronics Joe Hertline
  • This presentation will analyze key power module packaging architectures and corresponding soldering, sintering, thermal interface, and assembly materials solutions that can increase product life, enable manufacturing scalability, and reduce cost of ownership.
• The Role of Sintering Materials Technology in EV Power Module Applications by Product Manager – Semiconductor Dean Payne
  • In this presentation, Dean will examine how sintering is used in die-attach and substrate-attach applications and how technological advancement of this material enables a more efficient manufacturing process in EV power module assembly.

Click here for additional information, including times and locations for all Indium Corporation presentations at PCIM. All presentations will be given in English unless otherwise noted.

Andreas provides technical support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials for customers in Germany, Austria, and Switzerland. Products include solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Andreas is an ECQA-certified integrated design engineer and earned his Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforces Indium Corporation’s commitment to providing world-class service to our customers in Europe.

Joe is responsible for driving the growth of Indium Corporation’s power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Joe also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. He earned a bachelor’s degree in mechanical engineering and an MBA from Clarkson University and is a Certified SMT Process Engineer (CSMTPE).

Dean is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which includes high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Dean holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.

To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM in hall 6, stand #460.

NEWMAN LAKE, WA – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Rochester Electronics has purchased a Photon steam aging system.

The Photon steam aging system is used for accelerated life testing to simulate elongated storage conditions for high-reliability applications. These steam aging systems complement the Odyssey component lead tinning machines specifically designed to perform component re- tinning, tin whisker mitigation, gold removal and BGA de-balling for high reliability and military application in accordance with all relevant GEIA- STD-0006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards.

CHINO, CA – Scienscope International, a prominent supplier of cabinet-style micro-focus X-ray systems in the United States, announces its participation in the upcoming TechDay events on April 25, 2023, in Tallinn, Estonia, and April 27, 2023, in Örebro, Sweden. The Scienscope team will showcase its Complete Component Solutions, representing the latest technological advancements at the event.

Scienscope is proud to partner with ESD Center, a well-established company with over 40 years of experience in the industry, in this venture. The recent opening of the ESD Center in Tallinn, Estonia, presents a unique opportunity for Scienscope to collaborate with a reputed industry player and establish a strong foothold in the European market. The team at Scienscope is thrilled to participate in this event and looks forward to engaging with the attendees and exploring potential business opportunities.

The AXC-800 III is a state-of-the-art X-ray system that provides real-count imaging of electronic components, PCBs, and other critical components. It features a high-resolution detector, advanced image processing software, and a user-friendly interface that makes it easy for novice and experienced users.

The IMS-100 features a high-resolution barcode camera system with an image-based algorithm that reads any barcode, even with defects. It simultaneously reads and stores the information of four 7”, 13”, and 15” reels. As one reel is removed, a unique identification number label is printed, archiving reliable data that can be easily and conveniently traced.

The Smart Storage Rack is an innovative storage solution to streamline electronics manufacturing. It features an RFID-based inventory management system that tracks components and materials in real time, reducing the risk of errors and ensuring that materials are always available when needed.

AUSTIN, TX – Kodiak Assembly Solutions LLLP, a leading contract electronic manufacturer, has announced the acquisition of a MIRTEC 3D MV-6 OMNI AOI system, furthering its commitment to investing in the latest technologies to provide superior quality control for customers.

The MIRTEC 3D MV-6 OMNI AOI system is a state-of-the-art machine that utilizes 15 mega pixel 3D inspection technology, providing unparalleled inspection capabilities with superior speed and accuracy. The system is capable of inspecting components as small as 01005, while providing exceptional defect coverage across a wide range of assembly types.

"We are extremely excited to add the MIRTEC 3D MV-6 OMNI AOI system to our arsenal of advanced equipment," said John K. Kampfer, President of Kodiak Assembly. "This acquisition reaffirms our commitment to providing our customers with the highest level of quality control possible."

Kodiak Assembly has built a reputation on delivering excellence in electronic contract manufacturing services, and their investment in the MIRTEC 3D MV-6 OMNI AOI system further solidifies their position as an industry leader. The new system will allow them to increase their inspection capabilities, provide faster inspection times, and improve overall product quality.

The MIRTEC 3D MV-6 OMNI AOI system is now fully operational at Kodiak’s Austin facility. The company looks forward to continuing to provide their customers with exceptional service and quality products as they move forward with this exciting investment.

For more information on Kodiak Assembly and their electronic contract manufacturing services, please visit their website at www.kodiakassembly.com