Press Releases
WASHINGTON – The Printed Circuit Board Association of America welcomes the CHIPS for America program action to make available $300 million via a Notice of Funding Opportunity (NOFO) for domestic research and development activities to accelerate domestic capacity for advanced packaging substrates and substrate materials.
Integrated circuit substrates are a critical part of the technology stack that powers the microelectronics that make modern life possible. Semiconductors, substrates and printed circuit boards (PCBs) make up the stack that every electronic device needs to function.
PCBAA Executive Director David Schild said, “This is an important expansion of the work being done at the CHIPS program to reshore the industries we invented here in America but long ago offshored. To build a secure and resilient supply chain for all elements of the technology stack, we need a robust American capacity to manufacture all three: semiconductors, IC substrates and PCBs. That’s why we say ‘Chips Don’t Float’. The third element of the technology stack also needs government investment. We are calling on Congress to pass H.R. 3249, the Protecting Circuit Boards and Substrates Act, which would provide $3 billion to fund factory construction, workforce development and R&D along with a 25% tax credit for purchasers of American-made PCBs and substrates.”
PLYMOUTH, WI – Kurtz Ersa Inc., a leading supplier of electronics production equipment, is excited to announce its participation alongside Comtree at EPTECH Toronto, scheduled to take place Wednesday, April 17, 2024 at the Sheraton Parkway Toronto North. As trusted partners, representatives from Comtree will be on hand to engage with attendees and discuss Ersa's comprehensive range of solutions tailored for the electronics manufacturing industry.
A key highlight of Kurtz Ersa's offerings at EPTECH Toronto is its patented IR rework technology. This groundbreaking technology has earned a reputation for consistently delivering outstanding results, even in the most challenging rework applications. With a proven track record of benefiting countless users worldwide, Ersa's IR rework systems have become synonymous with reliability, efficiency, and unmatched performance. Their remarkable cost-to- performance ratio makes them the preferred choice for electronics manufacturers seeking superior rework solutions.
Visitors to the event can expect to explore a diverse range of Ersa's rework and soldering systems, all of which showcase the brand's signature superiority and adaptability. Kurtz Ersa has set the benchmark for high-end reflow ovens. Notably, the HOTFLOW series boasts impressive energy savings of up to 25 percent, along with a remarkable 20 percent reduction in N2 consumption.
Comtree represents Ersa throughout Canada. For more information about Comtree, e-mail Ernesto Provenzano at ernesto@comtreeinc.com, Graham Gibson P.Eng. at graham@comtreeinc.com, or call 905 673-7777.
For more information about Kurtz Ersa Inc., visit www.ersa.com
BOHEMIA, NY – Q Source proudly highlights its partnership with Gentex Corporation, a global leader with more than 125 years of innovation in personal protection and situational awareness solutions.
Gentex Corporation’s commitment to continually reinvesting in its company and capabilities has resulted in significant company growth and groundbreaking innovations over the past century. Gentex Corporation remains dedicated to providing top-tier solutions to its customers.
Gentex Corporation offers a range of industry-leading brands, including PureFlo. The PureFlo PAPR (Powered Air Purifying Respirator) is an all-in-one NIOSH-approved air-purifying protection system designed for the most demanding pharmaceutical and clean room environments. The PureFlo 3000 is a modular head borne PAPR that does away with the need for hoses and belts, virtually eliminating snag hazards. The PureFlo PAPR delivers best-in-class integrated respiratory, eye, and face protection against hazardous airborne particulates.
As a PureFlo distributor for Gentex Corporation, Q Source is committed to delivering the innovative solutions to its customers across various industries. By partnering with Gentex Corporation, Q Source ensures that its customers have access to the latest advancements in personal protection. For more information about Q Source's product offerings, including Gentex Corporation’s PureFlo PAPR please visit www.qsource.com
WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer in response to the decision by the World Trade Organization (WTO) to renew the Moratorium on Customs Duties on Electronic Transmissions during the 13th Ministerial Conference (MC13) in Abu Dhabi.
“In terms of high drama, once again, the WTO Ministerial Conference didn’t disappoint. Thankfully, trade negotiators were able to overcome obstacles to deliver an extension of the Moratorium, which has been a cornerstone of the digital economy – enabling semiconductor supply chains, fueling economic growth and innovation across the globe, and helping to bridge the digital divide.
“While we celebrate this outcome, we recognize that more needs to be done to educate businesses and policymakers on the importance of the Moratorium. The semiconductor industry supports making the Moratorium permanent, which will provide the stability and predictability necessary for sustained innovation and growth in the digital age. We stand ready to work with the government and industry stakeholders to achieve this goal.”
CLINTON, NY – With more than five million electric vehicles (EVs) on the road with its materials and nearly a decade of experience in the market, Indium Corporation® is proud to feature its innovative Durafuse® solder technology alongside its Rel-ion™ portfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing, at IPC APEX EXPO 2024, April 9-11, in Anaheim, California, U.S.
Among its featured products, Indium Corporation will showcase its lead-free Durafuse® technology and industry-proven Indium8.9HF solder paste series:
- Durafuse® HR – based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
- Award-winning Durafuse® LT – a novel solder paste alloy system with highly versatile characteristics that enable energy savings, high-reliability, low-temperature, step soldering, assemblies with large temperature gradients, and large BGAs with large complex warpage profiles. It also provides superior drop shock performance as compared to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
- Indium8.9HF Solder Paste Series – an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
Some of the additional Rel-ion and high-reliability products for power electronics featured at IPC APEX will include:
- Indalloy®301 LT Alloy for Preforms/InFORMS® – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys.
- Award-winning InFORMS® – reinforced solder alloy fabrications which improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications.
- InTACK® – a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
- QuickSinter® – a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput.
- Durafuse® HT – a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys.
- Heat-Spring® – a compressible, non-reflow metal TIM ideal for TIM2 applications.
To learn why Indium Corporation is trusted by top EV and power electronics manufacturers across the globe, visit our experts at booth 4227 or at www.indium.com
MILWAUKIE, OR – ECD announced today that it is continuing its engineering department expansion and has hired a software and manufacturing engineer, further bolstering its team as it accelerates current product line enhancements and NPI initiatives.
Nicholas Chase, Senior Software Engineer, comes to ECD with an impressive decade-long career, which includes software engineering experience at EDA companies Mentor Graphics Corporation (now Siemens EDA) and, most recently, Synopsys, Inc. He has a strong focus on sound design principles, continuous improvement, and has broad programming language proficiency. At ECD, Chase’s responsibilities entail driving development process efficiency, ensuring product software provides an intuitive and responsive user experience, and implementing robust testing procedures. He has already completed a significant project for ECD’s Baking Division with the integration of food safety KillStep Calculator functionality into the new touchscreen M.O.L.E.™ EV6 thermal profiling hardware. Chase holds a B.S. in Software Engineering from Oregon Institute of Technology.
Manufacturing Engineer Rahul Bilakanti oversees production and quality for ECD’s in-house manufacturing operation, which produces M.O.L.E. thermal profilers, SmartDRY™ desiccant cabinets, soldering machine verification pallets, and baked goods and oven sensors. Since joining the company, Bilakanti has contributed to manufacturing waste reduction through the use of 3D-printed fixtures, is leading the implementation of digitized manufacturing processes to streamline workflows, and is focused on improving production efficiency through collaborative DFM procedures. Bilakanti’s previous experience includes quality and manufacturing engineering positions at Abbott Labs and Japan Aviation Electronics’ Automotive Group. He graduated magna cum laude from the University of Southern California, where he earned a B.S. in Biomedical Engineering.
Speaking about the engineering staff growth, ECD President Tara Fischer says, “We are launching new products at an unprecedented pace, with three M.O.L.E. EV-series thermal profilers developed and commercialized within the last year,” she explains, underscoring the company’s ambitious five-year R&D roadmap. “So far, our team has executed our strategy perfectly. Nick and Rahul bring fresh eyes and outstanding credentials to our engineering department and have already been instrumental in our success. We are thrilled to have them on board!”
Chase and Bilakanti began their roles at ECD in November 2023. They are based in the company’s Milwaukie, OR headquarters.
