LAKEWOOD, N.J. – August 3, 2023 – BidChip today announced its new platform that makes it possible for semiconductor customers to efficiently buy electronic parts they need from brokers without risk. The platform authenticates all components and vendor partners, guaranteeing safe purchases.

There are many places to buy electronic components, but one of the most reliable and convenient options is through an online electronic component sourcing marketplace like BidChip. Its comprehensive online marketplace provides a wide range of parts from trusted suppliers, ensuring high quality and fair prices. The process reduces price gouging by directly connecting buyers and suppliers.

BidChip leverages a large number of suppliers to secure a fair market value for semiconductor demand. It has discovered a way to enhance and streamline procurement safer, faster and economically. The platform uses a bidding process where buyers and suppliers compete daily to increase prices through an auction and reduce prices through a reverse auction, leveraging technology to streamline purchases. It empowers buyers and sellers to trade online without the fear of counterfeit merchandise, overdue payments or fraudulent transactions.

“I developed a successful system that addresses semiconductor commerce issues,” said CEO and founder Moshe Hezrony. “We streamlined the process while providing a set of protection services for the buyer and the seller, enhancing trust. Buyers and sellers will be equally protected. Risky transactions can go wrong and our goal is to keep the platform and process transparent for peace of mind.”

The auctions allow vendors to seek fair market value by leveraging a large group of buyers to submit bids for the best price. The bidding process allows fair buyer competition. Every day, buyers are given instant access to daily component offers.

The reverse auctions allow buyers who are seeking parts to purchase them at a fair market value and leverage a large group of suppliers that bid on the demand. The bidding process allows fair suppliers competition. Every day, suppliers are given instant access to daily component demands.

BidChip gives buyers an online shopping experience advantage for small and medium-size businesses. Now they can shop for semiconductors efficiently and risk-free with the assurance that all parts are authenticated and funds are guaranteed.

Electronic component sourcing websites are online platforms where buyers can locate and procure a wide variety of electronic parts and components. These platforms offer a convenient method of sourcing electronic components from multiple suppliers worldwide. BidChip is revolutionizing the industry by integrating the trading system of online auctions and reverse auctions, plus offering escrow services and lab testing that make it a unique system where manufactures can concentrate on assembling the next innovation while BidChip finds the parts for the next project. Sourcing electronic components has never been easier, faster, more efficient and more economical.

Other BidChip advantages include:

● Verified sellers and buyers to add security.

● Auction with transparent pricing and bidding for equal opportunity.

● Reverse auction (Quest) with transparent pricing and bidding for equal opportunity.

● Integrated escrow services for safe transactions.

● High standard of lab test AS 6081 to ensure part authenticity.

● A comprehensive dashboard to streamline the procurement process

Hezrony added, “Imagine your satisfaction, establishing instant trust with any buyer or supplier. You can trade lab-certified parts, get paid through escrow and ensure your business is always up and running.”

BidChip offers lab tests and escrow services for dedicated buyers and suppliers for safe trading and reducing price gouging. BidChip understands the challenges of not being able to trade freely. The company not only cares about parts but also the safety of your business.

For more information, to register now or schedule a discovery call, visit bidchip.com.

NASHVILLE — August 2023 — KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, is excited to announce its participation in the SMTA High Reliability Cleaning and Conformal Coating Conference. The event is scheduled to take place Aug. 29-31, 2023 at The Westin Dallas Fort Worth Airport in Texas. KYZEN’s Debbie Carboni and Ram Wissel, in cooperation with Brian Chislea from Dow Chemical and Brian O’Leary from Indium Corporation, will present the keynote “Strengthening E-Mobility Infrastructure: Overcoming High-Voltage and Environmental Challenges.”

The recently introduced US standard requiring 97% up-time performance, coupled with the global expectations of consumers and fleet operators for robust and durable EV infrastructure capable of withstanding harsh outdoor conditions, is driving manufacturers to develop weather-resistant, corrosion-resistant, and outdoor-friendly solutions with advanced features for top performance. In this technical presentation, the authors will explore the critical elements of producing e-mobility modules and the difficulties in maintaining reliability and durability under high voltage, current, and temperatures in electric vehicles and charging stations.

A thorough long-term cost-benefit analysis during the assembly manufacturing process is vital. While reducing costs may appear appealing, investing in connecting, cleaning, and coating processes from the beginning is advisable to avoid downtime caused by corrosion, environmental ingress, and other types of damage over time. Well-thought-out initial designs can help minimize risks associated with expensive warranty repairs, revenue loss, and customer dissatisfaction. As a result, focusing on the total cost of ownership (TCO) and prioritizing the reliability and durability of EV infrastructure by investing in manufacturing processes that ensure long-term benefits is critical, even if it involves a more significant initial investment. KYZEN will present data highlighting the correlation between the costs of cleaning and coating and the risks arising from neglecting these crucial processes.

Debbie Carboni, Global Product Manager of Electronics for KYZEN, brings more than 25 years of experience to the electronics manufacturing industry. She continues to learn and stay up-to-date on the latest technology by attending technical conferences and assisting in leading-edge research. Carboni has authored and co-authored several papers related to cleaning solutions and regularly presents at and attends industry events. Her extensive real-world experience helps guide engineers during qualification to ensure success in production conditions.

Ram Wissel, Vice President, Global Technology at KYZEN, received a Bachelor of Science degree in Chemical Engineering from the University of Arkansas. In his current role, he is responsible for KYZEN's Laboratories, Engineering, and Technical Support around the globe. His team is focused on continuing KYZEN's long-standing commitment to efficient chemical usage and environmental stewardship by developing innovative new technologies to help customers operate more efficiently and reliably. Wissel has a special interest in Industry 4.0 and providing process trending and analysis tools.

For more information, visit www.kyzen.com.

About KYZEN

KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.kyzen.com.

Manassas, VA – August 3rd, 2023, ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce an upcoming webinar titled, "Tackling Flux Residues: Best Practices for Cleaning Power Electronics Components," on August 17th, 2023, at 2:00 PM EST.

Flux residues pose a significant challenge in cleaning power electronics components, causing corrosion, electrical shorts, and other reliability issues, affecting the performance and longevity of the components. Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas, will present the webinar. Through a series of case studies, this webinar will focus on best practices for cleaning power electronics components, including selecting the appropriate cleaning method, ensuring compatibility with the components, and several test methods to validate cleanliness.

Registration is free and available HERE. Take advantage of this opportunity to learn from one of the industry's leading experts on best practices for cleaning power electronics components. Attendees will have the opportunity to ask questions, receive expert guidance from Mr. Parthasarathy, and gain valuable insights into the latest cleaning technologies and best practices for optimal performance.

About ZESTRON:

ZESTRON is headquartered in Manassas, Virginia, and operates in more than 35 countries. With eight technical centers worldwide and the industry’s most knowledgeable team of engineers focused on high-precision cleaning, ZESTRON’s commitment to ensuring that its customers surpass even the most stringent cleaning requirements is without equal.

For additional information or to tour one of our technical centers, please visit www.zestron.com

Indium Corporation is set to deliver a technical presentation and exhibit its industry-leading products for power electronics assembly at PCIM Asia, August 29-31, in Shanghai, China.

Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation titled Innovative High-Temperature Lead-Free Die-Attach Soldering Materials and Applications. He will examine the characteristics, applications, and process optimization related to new high-temperature, lead-free materials and their reliability testing data.

Power semiconductors are the core of electric energy conversion and circuit control in electronic devices, and are widely used in new energy vehicles, energy storage, data centers, photovoltaics, and industrial applications. In response to industry changes, Indium Corporation has launched a number of innovative high-temperature lead-free solutions, such as new high-temperature lead-free solder paste, pressured and non-pressured silver sintering paste, and copper sintering materials for die-attach.

“The power density of the third-generation semiconductors represented by SiC has been greatly improved, and higher requirements are placed on the on-resistance, thermal conductivity and reliability of die-attach materials,” said Hu. “Combined with the exemption of high-lead solder expiring in 2024, it is imperative for the industry to evaluate new and innovative high-temperature, lead-free solutions.”

As Senior Area Technical Manager for East China, Hu manages the technical support team in East China, and collaborates with global technical support teams to provide Indium Corporation customers with product and application solutions. He has more than 15 years of experience in semiconductor packaging and possesses expertise in advanced assembly technology development, process improvement, and assembly materials applications. Hu earned a master’s degree in IC engineering from the Chinese Academy of Science and a bachelor’s degree in electronic information science and technology from Nankai University, Tianjin, China.

Indium Corporation’s products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.

Featured products include:

• InTACK™ – a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the dependency on tooling without compromising soldering or sintering quality.

• InFORMS® – reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.

• Indalloy®301 LT Alloy for Preforms/InFORMS® – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. Specifically designed for power module applications, this alloy prevents warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. It is available in preforms, ribbon, or InFORMS®.

• InFORCE™29 – a pressure copper sinter paste for high-reliability, high thermal conductivity, die-attach applications, InFORCE™29 features high workability, making it suitable for printing or dispensing applications. InFORCE™29 provides excellent sinter performance on bare copper surfaces without the need for costly gold or silver plating.

• InFORCE™MF – a pressure silver sinter paste for the highest reliability, highest thermal conductivity, die-attach applications, InFORCE™MF is specially formulated for printing applications providing low process yield loss due to print defects and reduces the need for overprint. With a high metal load and low organic content, it enables fast drying times and less material loss.

• Durafuse® HT – based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse® HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.

To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM Asia in hall W2, stand F25.

About Indium Corporation

Indium Corporation is a premier materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Germany, India, Malaysia, Singapore, South Korea, the United Kingdom, and the U.S.

For more information about Indium Corporation, visit www.indium.com or email jhuang@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.linkedin.com/company/indium-corporation/ or @IndiumCorp.