CLINTON, NY – As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 9-11, in Nuremberg, Germany.
Tuesday, May 9
Wednesday, May 10
Click here for additional information, including times and locations for all Indium Corporation presentations at PCIM. All presentations will be given in English unless otherwise noted.
Andreas provides technical support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials for customers in Germany, Austria, and Switzerland. Products include solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Andreas is an ECQA-certified integrated design engineer and earned his Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforces Indium Corporation’s commitment to providing world-class service to our customers in Europe.
Joe is responsible for driving the growth of Indium Corporation’s power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Joe also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. He earned a bachelor’s degree in mechanical engineering and an MBA from Clarkson University and is a Certified SMT Process Engineer (CSMTPE).
Dean is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which includes high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Dean holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.
To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at PCIM in hall 6, stand #460.
NEWMAN LAKE, WA – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Rochester Electronics has purchased a Photon steam aging system.
The Photon steam aging system is used for accelerated life testing to simulate elongated storage conditions for high-reliability applications. These steam aging systems complement the Odyssey component lead tinning machines specifically designed to perform component re- tinning, tin whisker mitigation, gold removal and BGA de-balling for high reliability and military application in accordance with all relevant GEIA- STD-0006, MIL-PRF-38535, MIL-PRF-38524E and ANSI-J-STD-002 standards.
CHINO, CA – Scienscope International, a prominent supplier of cabinet-style micro-focus X-ray systems in the United States, announces its participation in the upcoming TechDay events on April 25, 2023, in Tallinn, Estonia, and April 27, 2023, in Örebro, Sweden. The Scienscope team will showcase its Complete Component Solutions, representing the latest technological advancements at the event.
Scienscope is proud to partner with ESD Center, a well-established company with over 40 years of experience in the industry, in this venture. The recent opening of the ESD Center in Tallinn, Estonia, presents a unique opportunity for Scienscope to collaborate with a reputed industry player and establish a strong foothold in the European market. The team at Scienscope is thrilled to participate in this event and looks forward to engaging with the attendees and exploring potential business opportunities.
The AXC-800 III is a state-of-the-art X-ray system that provides real-count imaging of electronic components, PCBs, and other critical components. It features a high-resolution detector, advanced image processing software, and a user-friendly interface that makes it easy for novice and experienced users.
The IMS-100 features a high-resolution barcode camera system with an image-based algorithm that reads any barcode, even with defects. It simultaneously reads and stores the information of four 7”, 13”, and 15” reels. As one reel is removed, a unique identification number label is printed, archiving reliable data that can be easily and conveniently traced.
The Smart Storage Rack is an innovative storage solution to streamline electronics manufacturing. It features an RFID-based inventory management system that tracks components and materials in real time, reducing the risk of errors and ensuring that materials are always available when needed.
AUSTIN, TX – Kodiak Assembly Solutions LLLP, a leading contract electronic manufacturer, has announced the acquisition of a MIRTEC 3D MV-6 OMNI AOI system, furthering its commitment to investing in the latest technologies to provide superior quality control for customers.
The MIRTEC 3D MV-6 OMNI AOI system is a state-of-the-art machine that utilizes 15 mega pixel 3D inspection technology, providing unparalleled inspection capabilities with superior speed and accuracy. The system is capable of inspecting components as small as 01005, while providing exceptional defect coverage across a wide range of assembly types.
"We are extremely excited to add the MIRTEC 3D MV-6 OMNI AOI system to our arsenal of advanced equipment," said John K. Kampfer, President of Kodiak Assembly. "This acquisition reaffirms our commitment to providing our customers with the highest level of quality control possible."
Kodiak Assembly has built a reputation on delivering excellence in electronic contract manufacturing services, and their investment in the MIRTEC 3D MV-6 OMNI AOI system further solidifies their position as an industry leader. The new system will allow them to increase their inspection capabilities, provide faster inspection times, and improve overall product quality.
The MIRTEC 3D MV-6 OMNI AOI system is now fully operational at Kodiak’s Austin facility. The company looks forward to continuing to provide their customers with exceptional service and quality products as they move forward with this exciting investment.
For more information on Kodiak Assembly and their electronic contract manufacturing services, please visit their website at www.kodiakassembly.com
CHELMSFORD, MA – VJ Electronix, Inc., the leader in rework technologies and global provider of advanced X-ray inspection and component counting systems, today announced its new partnership with Uptech LLC.
Uptech LLC was founded in 2021 by Andrew Beckwith and Michael McClay, former Uptime Inc. employees. With decades of combined experience, Uptech’s mission is to provide local technical support services to electronics manufacturing firms in the San Francisco Bay Area and the West Coast.
Uptech LLC is pleased to be working in close coordination with VJ Electronix to provide more value and faster service to the West Coast customers. As VJ Electronix’s installed base continues to grow and customer need for maximum uptime increases, Uptech provides a higher level of on-site support to meet the ever-changing uptime challenges that customers face. VJ Electronix is an advanced electronics manufacturing equipment supplier, providing intelligent imaging applications, X-ray inspection, PCB rework solutions, and services for various electronics and industrial markets worldwide.
For more information or to schedule a demo, visit www.vjelectronix.com
CLINTON, NY – Advanced materials innovator Indium Corporation is pleased to announce that the company has joined the European Center for Power Electronics (ECPE), the leading industrial and research network for power electronics in Europe. Through its involvement with the organization, Indium Corporation continues to position itself as a premier materials provider, as well as thought leader, in the European power electronics market.
Founded in 2003 and comprised of more than 200 members, ECPE leads education, innovation, research, and technology transfer initiatives in the power electronics industry throughout the European continent. By joining the organization, Indium Corporation ensures its continued ability to provide superior product development and engineering support to its European customers. It also enhances the company’s ability to influence materials research and development initiatives, based on emerging design trends, and shape the development of new standards vital to the success of the global power electronics industry.
“As a company built on materials science innovation, Indium Corporation is proud to join ECPE and its coalition of power electronics leaders,” said Ross Berntson, COO and President of Indium Corporation. “ECPE’s work to drive research and technology roadmaps aligns perfectly with our goals, especially given the rapid developments taking place within the e-Mobility space.”