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MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is excited to announce its participation in the upcoming IPC APEX EXPO 2024. The premier event for the electronics manufacturing industry will take place from April 9-11, 2024 at the Anaheim Convention Center in Anaheim, California.

As a trusted name in the electronics industry, ZESTRON is committed to providing innovative and sustainable cleaning solutions that meet the evolving needs of electronic manufacturers. The IPC APEX EXPO provides an ideal platform for ZESTRON to showcase its latest advancements in cleaning technologies and engage with industry professionals, engineers, and decision-makers.

Key Highlights of ZESTRON's Presence at IPC APEX EXPO 2024:

Advanced Cleaning Technologies: ZESTRON will feature its latest pH Neutral cleaning solution, Vigon® NX 728, designed to address the challenges of today's complex electronic assemblies. With excellent compatibility and superior performance on low stand-off components this product is a great example of ZESTRON’s innovative capabilities.

Analytical Services: Review ZESTRON’s capabilities to assist customers in evaluating their electronics' surface cleanliness according to IPC standards, J-STD, MIL, or the latest industry requirements by employing various test techniques like Ion Chromatography, Ionic Contamination, SIR and much more.

Environmental Sustainability: ZESTRON is dedicated to environmental responsibility. The company will highlight its eco-friendly cleaning solutions that deliver superior results and align with industry standards for sustainability.

High Voltage & EV Electronics: Stop by the ZESTRON booth on Wednesday, April 10th from 1pm – 4pm to discuss, share your concerns and gain insight regarding the reliability of your High Voltage electronic assemblies. Our industry expert from ZESTRON Europe, Dr. Olaf Shoenfeld, will be providing consultations and recommendations on failure analysis, risk assessment, humidity robustness, and other high voltage related topics.

Visit ZESTRON at booth #3620 to experience the future of electronic cleaning. For more information about ZESTRON and its participation in IPC APEX EXPO 2024 or to schedule a meeting, please visit: https://pages.zestron.com/apex-2024 

HOUSTON – MacroFab Inc., the operator of North America's largest technology platform for electronics manufacturing, has announced upgrades to its user experience, creating a more flexible PCB assembly platform to meet electronics manufacturers' needs. These changes to the PCB experience allow more users to leverage the business benefits of MacroFab's innovative platform.

With this new functionality, MacroFab's platform empowers electronics manufacturers of all sizes to leverage expert support to finalize data, source components and simplify workflows. MacroFab's leading-edge, technology-enabled manufacturing platform, provides users with valuable insights and actionable suggestions, providing effortless management of material requirements, specifications and design integration, as well as providing actionable quotes for users.

"Electronics manufacturers of all sizes are consistently looking for ways to improve their processes, enhance their designs and easily acquire components from reputable suppliers," said Kyle McLeod, senior product manager at MacroFab. "This user experience upgrade is driven by our customer-first approach and ensures that all electronics manufacturers are able to benefit from our flexible, straightforward, expert-supported processes."

Since MacroFab's founding in 2013, thousands of companies have accelerated prototype-to-production of electronics through its advanced technology platform coupled with the company's network of North American manufacturing facility partners. Whether a company needs low-volume printed circuit board assembly or high-volume full product delivery, MacroFab consistently provides unmatched service to diverse industries with its customer-first approach to manufacturing innovation.

To learn more about MacroFab's innovative solutions, please visit macrofab.com

VILLINGEN-SCHWENNINGEN, GERMANY – Kubler US Corp., a leader in smart inventory management technology, proudly announces its strategic partnership with PMR Representatives (PMR Reps) to represent its innovative products in Southern California. This collaboration marks a significant step in Kubler US Corp.'s efforts to extend its market reach and reinforce its commitment to delivering exceptional technological solutions in North America.

PMR Reps, known for their extensive experience and profound expertise in the electronics equipment and materials sector, will now offer Kubler US Corp.'s award- winning ARCHIMEDE Smart Storage System among other high-tech solutions to their extensive customer base in Southern California and Southern Nevada.

Rudy Lago, a spokesperson for PMR, expressed enthusiasm about the new partnership, stating, "We are incredibly excited to add Kubler's state-of-the-art products to our portfolio. The ARCHIMEDE Smart Storage System, in particular, is a game-changer in inventory management. Its unparalleled efficiency, space optimization, and smart technology features are exactly what our market has been seeking. We are confident that our customers are going to quickly realize the value of this product at this price point. It's not just about offering new technology; it's about revolutionizing how businesses manage their inventory with cost-effective solutions."

Kubler US Corp.'s decision to partner with PMR Reps underscores a mutual commitment to excellence and a shared vision for innovation and customer satisfaction. This alliance is expected to enhance Kubler US Corp.'s market penetration and brand visibility across Southern California and beyond.

The announcement comes on the heels of the creation of Kubler US Corp., which signifies Kübler GmbH's strategic expansion into the North American market. With a focus on introducing cutting-edge products and technology solutions, such as the 2023 Mexico Technology Award-winning ARCHIMEDE Smart Storage System, Kubler US Corp. aims to set new standards in high-tech solutions.

Kubler US Corp. is set to exhibit at the IPC APEX Expo this year, from April 9-11, at Booth #1715 in Anaheim, CA, where attendees can experience the revolutionary ARCHIMEDE Smart Storage System firsthand.

For further information on Kubler US, ARCHADIA SRL and its pioneering inventory control solutions, please visit https://www.arcadiasrl.it/?lang=en

CLINTON, NY – Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen and Product Development Specialist for Thermal Interface Materials Miloš Lazić will present on thermal interface material (TIM) technology at SEMI-THERM, taking place March 25–28 in San Jose, California, U.S.

Jensen’s presentation, titled Innovative Metal TIM Technology for TIM1 in BGA Style Semiconductor Packages, will focus on the use of metal TIMs in a broader array of applications for which traditional polymer TIM materials are no longer suitable. Solder TIM (STIM) materials have been used as a TIM1 solution for a limited set of server packages for over 20 years due to their potential to provide extremely high amounts of heat dissipation. Because of increasing power and functionality of HPC packages, many of the traditional polymer TIM materials are reaching their physical limits for heat dissipation.

Lazić’s presentation, Integration of Thermally Conductive Tacky Agents with Compressible TIMs to Improve Thermal Performance, will examine a compressible metal foil designed to be used as a TIM between a heat source and a heat-sink, heat-spreader, or heat-pipe. Metals and alloys have been used in different forms as TIMs for many years. Generally, they have several advantages compared to other commercially available TIMs. Since they have higher thermal conductivity than polymeric TIMs, these materials are less sensitive to bond line thickness and coplanarity issues.

At Indium Corporation, Jensen leads a matrixed team focused on engaging customers and commercializing new technology for our Thermal Interface Material products, including technology for 5G and AI. He is responsible for ensuring the product line is poised for long-term success by developing technologies that best meet the current and future needs of customers. He has authored numerous technical papers on soldering and thermal technology. He has a bachelor’s degree in chemical engineering from Clarkson University and an MBA from Syracuse University.

Lazić is responsible for developing new thermal materials and products, and providing solutions for customer challenges and applications. He also develops new testing methods to evaluate power and thermal products, and gathers data on new and existing products for marketing presentations. He earned his master’s degree in electronics engineering and his bachelor’s degree in electrical engineering from the University of Nis in Serbia. He is an Energy Efficiency Engineer certified by the Serbian Chamber of Engineers in Belgrade; a Certified SMT Process Engineer; and is fluent in English, Serbian, Croatian, and Bosnian.

CARLSBAD, CA – Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON China 2024, booth 3645.

Plasma removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Fluid dispensing provides adhesion, structural integrity, thermal and electrical conductivity, and more in microelectronics manufacturing applications. Equipment in the booth includes:

  • The MARCH FlexTRAK®-CD plasma system delivers high-throughput plasma processing of strip-type components for semiconductor manufacturing applications, such as leadframe or laminate strips presented in magazines. Flexible chamber configurations support contamination removal, etching, and surface activation before die attach, wire bond, molding and encapsulation, and underfill applications.
  • The ASYMTEK Vantage® fluid dispensing system is used for applications in wafer-level packaging and panel-level packaging during semiconductor manufacturing. The Vantage system dispenses precise, fine lines to meet requirements for underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly. When configured with dual IntelliJet® valves, using Nordson’s patented jetting technology, Vantage can dispense into gaps less than 200 microns, and up to 90,000 dots per hour.

Experts will be ready to answer questions, discuss industry trends, and help navigate the challenges of electronics manufacturing to enhance efficiency, precision, and reliability across your projects. SEMICON China will be held at the New International Expo Centre, Shanghai, China, March 20 – 23, 2024. Our booth #3645 is shared with the Nordson Test and Inspection division.

WALDENBURG, GERMANY – The Würth Elektronik eiSos Group is taking part of the embedded world exhibition in Nuremberg from 9 through 11 of April 2024. Occupying the 200m² Stand #110 in Hall 2, the company will be presenting components from all its divisions, not only including electronic and electromechanical components, but also the Wireless Connectivity and Sensors division, which are particularly interesting for IoT solutions. The presentation focuses on components, and also on the comprehensive spectrum of dedicated services Würth Elektronik has to offer; including design-in support.

At the embedded world 2024 exhibition, Würth Elektronik will be showcasing all divisions to present itself as a service-orientated partner for developers. Its partnership with IC suppliers will also be discussed as two semiconductor manufacturers will be on hand on the booth each day of the exhibition to present reference designs in cooperation with Würth Elektronik.

Exhibition highlights

Brand-new products include the WL-ICLED RGB LEDs with integrated circuits (IC). These pixel-controlled components combine red, green, and blue LED chips and a pre-programmed IC. SMT-capable digital isolators for signal transmission applications up to 150 Mbps will also be displayed to the public for the first time. Other product highlights include the WE-MAPI, WE-HEPC, and WE-XHMI high-temperature power inductors, and the WE-BMS transformer for battery-management systems. Further eye-catching points of the presentation will be the WRIS-RSKS thick-film resistors, whose high degree of sulfur resistance making them ideal for industrial applications. Additionally, in the area of mechanical components, the lead-free SMT spacers make it considerably easier to manufacture stacked circuit boards. Also shown will be four new series of products in the portfolio of durable aluminium hybrid polymer capacitors.

Because the IQD Frequency Products company is a co-exhibitor this year, further attention-drawing products include quartz crystals and oscillators. This Würth Elektronik eiSos Group affiliate will be presenting a series of quartz crystals embedded in 4-pad SMT ceramic cases with an extended operating-temperature range from -40°C to 125°C.

The service area also has a novel feature to present: The REDEXPERT online simulation tool; now expanded with the MagI³C power module designer feature, which enables the swift and simple integration of a power module into an application without the need for specialist DC/DC converter skills.

Conference paper on EMC

The company’s resident EMC expert, Dr. Heinz Zenkner, will also make Würth Elektronik’s special contribution at the embedded world conference. The paper, titled “EMC Compliant Industrial Electronic Design“, will be presented on April 11, 2024 from 9:30am to 1:00pm. This technical article discusses interface electronics and EMC filter concepts that suppress both transient interferences as well as interference emissions at frequencies above 1 GHz.

“We see ourselves as the developer’s partner of choice, and not only do we deliver components ex stock without minimum order volumes, we also provide tools like REDEXPERT and personal support right from the circuit design stage, to help create high-quality and sustainable products hand in hand with our customers. This is why we attach such great importance to service and support,” says Alexander Gerfer, CTO of the Würth Elektronik eiSos Group, describing the thematic orientation of the company’s embedded world presentation.

April 11 2024 is Student Day at the exhibition, and here, Würth Elektronik will be offering a special programme. Information and registration options can be retrieved at the following link: https://www.we-online.com/en/news-center/events/student-day 

Aside from its presence at the exhibition stand, Würth Elektronik will have its Show Truck in attendance. Located in the Exhibition Park, this will be a further popular venue for talks and encounters.

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