REDMOND, WA – Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced security and data deployment solutions for security ICs, microcontrollers and memory devices will showcase device programming and security provisioning solutions delivering high-performance, configuration flexibility automated device programming systems with security provisioning and industry 4.0 integration capability to enable traceability, process analysis and two-way communication that improves factory efficiency and quality at the lowest total cost of ownership. Data I/O will demonstrate a 64% increase in programming performance on Lumen®X Programmers with VerifyBoost™, the PSV family automated device programming systems, SentriX® security provisioning platform and the ConneX® software application that enables Data I/O’s device programming systems to integrate into the connected factory at the IPC APEX Expo in booth #3107 in Anaheim, California from April 9 th – 11 th at the Anaheim Convention Center.

About LumenX Programming Platform & VerifyBoost

VerifyBoost delivers rapid verify performance up to 750 MBps High-speed Gear3 x 2-Lane support for UFS devices for a massive 4.5x increase in performance. This enables our customers to immediately leverage existing production capacity for significant throughput gains, reduce the total cost of programming by up to 39% and maximize their existing investment in Data I/O’s programming technology. High-throughput PSV programming systems using LumenX programmers with high socket capacity and VerifyBoost enable manufacturers to use one PSV system to program what previously required multiple systems to produce. Learn more about VerifyBoost for LumenX programmers at www.dataio.com/VerifyBoost 

About ConneX Service Software

Electronics manufacturers, focused on operational efficiency to drive down costs and increase production capacity, are expanding their smart factory initiatives to integrate offline pre- programming processes into their Manufacturing Execution Systems (MES). ConneX enables customers to directly integrate data programming and security provisioning inputs and outputs between a Data I/O PSV programming system and an external application such as MES systems and analytics or web dashboards via industry standard protocols, to enable traceability, process analysis and two-way communication that improves factory efficiency and quality. To show the power of ConneX, Data I/O will display an example of a factory monitoring application with samples of dashboards a customer can build by accessing key areas of data collected during the programming process including system status, availability, utilization, socket adapter usage statistics and more. Learn more about ConneX at www.dataio.com/Solutions/ConneX 

PSV7000

The PSV7000 is the world’s premier automated programming solution with speed, flexibility, fast changeover, and small parts handling to manage any job for the lowest total cost of ownership. Engineered for velocity and versatility, the PSV7000 combines industry leading robotics handling, the LumenX revolutionary programming technology for fastest device programming and highest socket density ideal for automotive applications. A comprehensive suite of process control software applications along with fiber laser marking and 3D co-planarity component inspection meets the demanding process requirements for automotive electronics applications and Industry 4.0 automation. Learn more at www.dataio.com/PSV7000 

PSV3500

The PSV3500 is the cost-effective entry point for high-quality automated device programming for low mix / high volume applications. Ideal for customers moving to automated pre- placement programming for the first time, the PSV3500 delivers trusted performance and reliability at an affordable price. The PSV3500 is ideal for customers setting up automated pre- placement programming for the first time.. Learn more at www.dataio.com/PSV3500 

SentriX Security Provisioning Platform with SentriX Product Creator

SentriX Security Provisioning Platform with SentriX Product Creator reduces the complexity inherent in defining security for mass production by an order of magnitude. SentriX delivers pre-configured security deployment profiles for the most popular IoT use cases such as cloud onboarding, secure boot, access control, device authenticity and others. OEMs can use the provided pre-defined use cases or customize their own security profile. Secrets and credentials input product definitions using SentriX Product Creator are protected in transport and at rest to a SentriX security provisioning system. The PSV7000 and PSV5000 systems are field-upgradable to support SentriX and secure provisioning. Learn more at www.dataio.com/sentriX 

Customers attending the IPC APEX Expo in Anaheim, California can visit Data I/O’s booth in booth #3107 to see product demonstrations including VerifyBoost for LumenX displaying up to 750 MBps performance, the ConneX Service Software with system monitoring dashboards, SentriX security provisioning platform and the PSV7000 and PSV3500 automated programming systems.

DALLAS, TX – StenTech® Inc., a leading global company specializing in SMT Printing Solutions, will introduce the new StenTech BluPrint™ Chemical Vapor Deposited (CVD) Surface Treatment at the 2024 IPC APEX EXPO. This groundbreaking technology, designed to enhance SMT processes with unparalleled benefits for stencil performance, longevity, and overall assembly quality, will be showcased for the first time in Booth 1608 from April 9-11, 2024 at the Anaheim Convention Center in California.

The relentless drive to shrink components and circuit boards poses challenges in solder paste printing with laser-cut stainless-steel stencils. StenTech BluPrint™ CVD emerges as the premier solution in North America, aligning with the intricate demands of the semiconductor and EMS industry, backed by cutting-edge laser technology advancements.

StenTech BluPrint™ CVD Surface Treatment introduces a revolutionary method of depositing thin films onto a substrate by introducing chemical precursors into a reactor chamber, resulting in a solid material deposit on the surface. The consistency achieved across all areas distinguishes StenTech's CVD from traditional liquid spray processes, providing a resilient, virtually indestructible coating that ensures uniform printing with identical apertures.

Beyond consistent thickness, StenTech BluPrint™ offers exceptional thermal stability, chemical inertness, anti-stiction properties, a refined smooth surface finish, customizable characteristics, and unmatched print quality consistency. The process begins with plasma polishing, followed by the chemical vapor deposition, resulting in a smoother sidewall and enhanced corrosion resistance.

StenTech BluPrint™ stands out with its application at approximately 1000 times less thickness compared to existing alternatives, ranging from 3-5 micrometers versus 3 nanometers. Positioned as the practical choice for coating high-end SMT solder paste stencils, StenTech BluPrint™ promises noticeable enhancements in transfer efficiency, outperforming current nano-coatings, particularly in high-volume builds.

StenTech invites attendees to Booth 1608 at the 2024 IPC APEX EXPO to explore the StenTech BluPrint™ CVD Surface Treatment and experience firsthand its transformative impact on SMT processes.

PALO ALTO, CA – Arch Systems, a leader in machine data and manufacturing analytics, will exhibit at the 2024 IPC APEX EXPO, taking place from April 9-11 at the Anaheim Convention Center in California. Visitors can explore Arch's latest innovations at Booth #727, where the company will demonstrate its acclaimed ArchFX Platform, including the groundbreaking GLO™ solution and its collaborative efforts in global electronics manufacturing.

With successful strategic collaborations with Flex, Jabil, Plexus, HARMAN, and other widely respected manufacturers, Arch Systems has cemented its position as a pioneer in machine data solutions and intelligent actions for manufacturers.

At the IPC APEX EXPO, Arch Systems will highlight ArchFX GLO and its role in transforming manufacturing operations through actionable intelligence. Arch’s direct-to-machine connectors, global data brokers, cloud-based analytics, and action monitoring and resolution capabilities offer an end-to-end manufacturing solution that revolutionizes data-driven decision-making.

A highlight of Arch Systems' showcase will be the enhanced capabilities of GLO (Global and Local Operations Intelligence), supplemented by the robust data analytics of ArchFX Process Insights™. GLO, adept at synchronizing global digitization strategies with local operational excellence, leverages Process Insights' advanced analytics to provide electronics manufacturers with intelligent and actionable insights. This powerful combination enables GLO to not only integrate seamlessly with existing factory machines and solutions but also to transform vast manufacturing data into precise, actionable steps. GLO offers unparalleled operational efficiency and decision-making prowess through this enriched functionality at both global and local levels. This innovative approach ensures that the manufacturing process is optimized for peak performance, driven by data-led intelligence and strategic actions.

Andrew Scheuermann, CEO of Arch, emphasizes the importance of data in driving operational intelligence. “Our collaboration with industry leaders underlines our commitment to empowering manufacturers with the insights they need to excel. ArchFX and GLO offer a comprehensive solution that transforms manufacturing data into intelligent, actionable insights for the top floor to the shopfloor."

Arch Systems invites attendees to visit their booth to experience firsthand how ArchFX and GLO are shaping the future of manufacturing. Discover how these solutions can help streamline your operations, enhance efficiency, and drive innovation in your manufacturing processes.

For more information about Arch Systems and its innovative solutions, please visit archsys.io

WALTHAM, MA – Essemtec is exhibiting at APEX Expo at booth 2409.

We are showcasing our flagship All-in-One platforms FOX and PUMA. The machines will be equipped with the latest innovations in Solder Jetting, Integrated Inspection System, Smart Material Management, and 4 mm EVO feeder – 08004 Pick-and-Place.

The All-in-One platform will demonstrate live the highest standards in electronics assembly on flexible substrates, jetting of multiple fluids three times faster and efficient rework on populated boards. Essemtec presents its agile dispensing platform on the TARANTULA machine. The machine can be equipped with five different valves, for a comprehensive range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam, and Underfill.

Our in-house rapid prototyping solution will be demonstrated on Nano Dimension’s DragonFly 3D printer and Essemtec FOX equipment with the combined dispensing and components placement capabilities. This is a revolutionary end-to-end concept that accelerates the assembly process, protects IP, and creates supplementary internal synergy.

Under the motto “Our Focus - Your Solution,” we focus on proven new solutions in various segments for electronics production, as NPI, High-Mix/Low-Volume, High-Speed Dispensing, Printed Electronics, and Complex Repair.

High-Speed Solder Paste Jetting - for all product platforms

Essemtec is dedicated to continuous improvement. An increased solder jet speed of 180’000 – 400’000 dots/h can be achieved. It is now possible, with the new increased speed and accuracy, to exchange inflexible traditional solder paste screen printers with a P&P integrated solder paste jetting solution to serve multiple machines in a highly flexible line solution. End users gain the flexibility to solder jet products & place components in the All-in-One Systems or dedicated high- speed dispensers for volume production, integrating the system for process improvement capability.

Integrated Inspection System – for all product platforms

First time in the industry an Integrated Inspection System (I2S) in the Pick and Place and dispensing solutions will be shown. The Integrated Inspection System is available for dispensed and jetted material as well as placed SMD components right after the process. Thus, only good, inspected products are entering the reflow ovens. The process also includes an automated repair function. The system is already integrated in automotive and complex production sites by various companies.

Smart Material Management - integrated solution for factory 4.0

The affordable material management solution is a fully integrated end-to-end solution for electronics manufacturing factories and covers all different storage locations. The solution enables right material placement at the right time. The traceability is precise down to individual component.

The solution is expandable and flexibly controlled by an intuitive eStorage software, from simple barcode-labelled storage location to fully automated storage cabinets. Smart Material Management The solution offers high ROI and is fully integrated with the production machine and the ERP systems.

Our team of engineers will share best tips for the hottest SMT topics on the market to help you improve the time to market, increase the flexibility of your production line and optimize your manufacturing costs.

Visit us at booth 2409 and be inspired by our solutions!