DALLAS, TX – StenTech® Inc., a leading global company specializing in SMT Printing Solutions, is excited to announce its participation in the upcoming SMTA Dallas Expo & Tech Forum, scheduled to take place on March 19, 2024, at the Plano Event Center. As a trusted partner in delivering cutting-edge solutions for leading electronic manufacturers, StenTech will be exhibiting its innovative stencil, tooling, and parts solutions that empower customer success.
“We take pride in our ability to provide customers with innovative solutions that drive success in their operations," said Greg Starrett, StenTech’s Director of Sales. "Our team is dedicated to pushing the boundaries of what's possible in stencil, tooling, and parts solutions, and we look forward to sharing our latest developments with attendees at the SMTA Dallas Expo & Tech Forum.”
StenTech has established itself as the largest multi-national SMT printing solutions provider, with a presence in 20 facilities across the United States, Mexico, and Canada. These strategically located facilities ensure localized expertise and quick turnaround solutions, providing customers with the convenience and efficiency they require in today's dynamic SMT landscape.
At the core of StenTech's success is its formidable team of over 35 experienced CAD designers and more than 250 production staff. This talented workforce, combined with state-of-the-art equipment and infrastructure, enables StenTech to deliver gold standard products with unmatched speed, precision, quality, and customer care.
Visit StenTech's booth at the SMTA Dallas Expo & Tech Forum to learn more about how its innovative solutions can empower success in your electronic manufacturing operations.
Download 2024 StenTech Brochure: https://www.stentech.com/thebuzz/StenTech_Brochure.pdf
For more information about StenTech and its comprehensive range of stencil, tooling, and parts solutions, please visit www.stentech.com
AUSTIN, TX ― ROCKA Solutions is excited to announce its participation in the upcoming 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. ROCKA Solutions will be exhibiting in Booth #432, where the company will highlight its expanded services in the USA and Canadian markets, along with showcasing top distribution brands.
With a strategic focus on growth and expansion, ROCKA Solutions is committed to further strengthening its presence in the USA and Canadian markets. At the IPC APEX EXPO, attendees can expect to learn more about ROCKA's comprehensive range of services, including SMT production supplies and distribution partnerships with leading brands in the industry.
Among the key highlights at ROCKA's booth will be the display of ROCKA Manufactured SMT production supplies, renowned for their quality, reliability and performance. Visitors will have the opportunity to explore ROCKA's extensive product portfolio and discover innovative solutions tailored to meet the evolving needs of electronics manufacturers.
In addition to showcasing its in-house manufactured products, ROCKA Solutions will also feature a selection of top distribution brands at its booth. Attendees can expect to see products from industry- leading brands such as Zestron, Actnano, Weller, Indium, BT Mix and more.
As an added highlight, Justin Worden, VP Sales & Marketing at ROCKA, will be hosting the WNIE interviews during the event. Attendees can look forward to insightful discussions and valuable insights from industry experts.
Visit Booth #432 at the IPC APEX EXPO to learn more about how ROCKA Solutions can enhance your manufacturing operations and supply chain efficiency.
For more information about ROCKA Solutions, visit www.rockasolutions.com
GAINESVILLE, GA ― Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, will exhibit in Booth #1332 at the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in Calif. The COT team will focus on its core product lines at the show:
Count On Tools holds and maintains current ITAR registration, 07FFL, 02SOT, and a first-class Quality Management System. For more information about Count On Tools’ products and services, visit www.cotinc.com
NORTHBROOK, IL – Impossible Objects proudly announces plans to exhibit at Apex 2024, scheduled to take place April, 9-11, 2024 at Anaheim Convention Center. The focus of this exhibition is the game-changing CBAM-25 industrial 3D printer, a true paradigm shift in high-speed, high-performance additive manufacturing.
CBAM 25: Step into the in the Future of 3D Printing Impossible Objects’ CBAM-25 3D printer marks a monumental leap forward in additive manufacturing capabilities. Setting new industry standards, this cutting-edge machine stands out as a true game-changer for electronics tooling (and more), boasting a remarkable fifteen-fold increase in speed compared to the fastest competition.
With the CBAM-25, a new era dawns for electronics tooling, one characterized by unprecedented speed and efficiency, in addition to all of the benefits of 3D printing that shatters traditional limitations. The first CBAM-25 will ship in Q2 2024, heralding a seismic shift in manufacturing processes. This groundbreaking innovation brings 3D printing to the forefront of volume tooling manufacturing, tearing down barriers and expanding the horizons of what can be achieved with advanced materials, exceptional mechanical properties, and superior tolerances.
Design and Manufacturing Renaissance
The CBAM-25 opens doors for engineers to design parts that are not only stronger but also lighter and more durable. Its high-performance composite materials, notably Carbon Fiber/PEEK, offer remarkable chemical and temperature resistance, along with mechanical properties that surpass those of many engineering plastics.
Carbon Fiber/PEEK components have proven to be an exceptional alternative for electronics tooling, as well as a wide range of additional applications, including, aerospace, defense, transportation industries, and beyond. “Our innovative 3D printer represents a quantum leap in additive manufacturing technology, enabling engineers and manufacturers to achieve feats previously considered impossible,” says Robert Swartz, Founder and Chairman of the Board at Impossible Objects.
“We are also committed to serving the global electronics manufacturing community as a premier tooling supplier, providing cutting-edge solutions for their evolving needs.”
Experience the future of 3D printing and discover how Impossible Objects redefines the boundaries of design and manufacturing.
Visit Impossible Objects at APEX 2024, booth #2715 or fill out a contact us form to get in touch with us directly and schedule a dedicated time slot to discuss your specific tooling needs.
ISLE OF WIGHT, UK – EVS International, the leader in solder recovery, today announced plans to exhibit in Booth 730 at the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. The company is set to showcase its EVS 18KLFHS Solder Recovery Systems, a revolutionary innovation that is transforming the solder recycling process.
The key to the EVS 18KLFHS's exceptional performance is its innovative design, featuring a sealed cabinet that cleverly integrates the dross bucket and fume extraction. This groundbreaking concept ensures both security and efficiency in the solder recovery process.
At its core, the system features the Tilting Pot Mechanism, an industry-first innovation that eliminates the need for traditional twin opposed air rams and doors, resulting in a substantial boost in efficiency and productivity.
What truly sets the EVS 18KLFHS apart is its ability to invert and rotate the dross/solder pot, combined with an ingenious hot air-activated auto drain tap. This remarkable combination results in the creation of clean ingot bars, enabling the recovery of up to 80 percent of solder from the dross. This remarkable efficiency is made possible through EVS's patented technology.
With an expanded 18-kilo/40lbs pot, the system empowers users to recover more dross, promising a faster return on investment (ROI). It simplifies components, extends running times, and boasts an extraordinary availability rate of 90% and above, reinforcing its reputation for unmatched reliability in the industry.
Additionally, the EVS 18KLFHS Solder Recovery System is now available in a lead-free version, providing a compelling price-performance ratio. This inclusive offering opens doors for businesses of all sizes, from small job shops to those using both lead and lead-free units, to invest in this game- changing technology. With the promise of delivering pure solder and a swift ROI within months, the system propels production efficiency and sustainability to new heights.
Visit the EVS booth at the 2024 IPC APEX EXPO, where the 18KLFHS Solder Recovery System will be on display, showcasing the most advanced solder recovery solution in the industry.
For more information about EVS International’s industry-leading systems, visit www.solderrecovery.com
OSAKA, JAPAN – Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth 1325 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Renowned for its commitment to innovation, Nihon Superior will present a range of groundbreaking products, including the SN100CV® P608 solder paste and the TempSave™ series of low-temperature soldering materials.
SN100CV® P608 sets a new standard as a completely halogen-free, lead-free, and no- clean solder paste by Nihon Superior. In contrast to silver-containing alloys relying on a dispersion of fine particles of eutectic Ag3Sn for strength, SN100CV achieves its robustness from solute atoms within the tin matrix of the joint. Remarkably, in tensile tests, SN100CV matches the strength of SAC305 while retaining a high resistance to impact loading, offering exceptional performance in various applications.
For high-reliability applications demanding strength surpassing SAC305, Nihon Superior introduces the LF-C2 lead-free alloy. Leveraging both dispersion and solid solution strengthening, LF-C2 delivers superior strength. With a liquidus temperature of 213°C, it facilitates reflow at a lower temperature than SAC305.
The P608 flux medium ensures wetting comparable to halogen-containing pastes, despite being completely halogen-free. SN100CV P608 and LF-C2 exhibit outstanding performance across diverse component types and process parameters.
Additionally, Nihon Superior presents the TempSave™ series of low-temperature soldering materials, addressing industry goals such as reducing peak reflow temperature, minimizing package warpage, lowering energy consumption during reflow, and protecting temperature- sensitive devices.
Visit Booth 1325 at the 2024 IPC APEX EXPO to explore Nihon Superior's latest alloys, solder pastes, and lead-free products. For more information, please visit www.nihonsuperior.co.jp/english