MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, proudly announces the launch of its highly anticipated webinar series on Advanced Packaging & Power Electronics, a webinar series on the latest innovations, cleaning, and corrosion challenges. Designed to address the evolving challenges in semiconductor manufacturing, this comprehensive series of webinars will delve into cutting-edge topics crucial for optimizing processes and enhancing reliability.

Led by Senior Application Engineer Ravi Parthasarathy, ZESTRON's upcoming webinar series promises to be an indispensable resource for professionals in the semiconductor industry. With a focus on addressing the unique challenges and requirements of semiconductor manufacturing, each session will deliver invaluable insights and practical solutions. Recognizing the intricate demands of the semiconductor sector, the webinars will provide tailored content designed to meet the specific needs of industry professionals, from semiconductor fabrication facilities to electronic component manufacturers. Ravi brings a wealth of expertise and experience to the table, with years of hands-on involvement in advanced packing and power electronics cleaning technologies, offering a unique perspective on the industry's evolving landscape and ensuring that participants receive expert guidance backed by real-world insights.

The webinar series will foster an interactive learning environment, encouraging participants to engage with the material and exchange ideas with fellow industry professionals through live Q&A sessions. In an industry where innovation is constant, staying ahead of the latest developments is paramount. ZESTRON's Advanced Packaging & Power Electronics webinar series serves as a platform for continual learning, empowering semiconductor professionals to remain at the forefront of their field.

Webinar Topics Include:

• Optimizing High Bandwidth Memory (HBM) Wafer Surface Treatment: Navigating Cleaning Challenges
• Tackling Flux Residues: Best Practices for Cleaning Power Electronics Components
• Unveiling Defluxing Strategies for High-Density Advanced Packaging with Ultra-Fine Pitch Die on CoWs
• Advancing Reliability in Automotive Power Electronics: Cleaning Strategies and Corrosion Mitigation

For registration and more information, visit ZESTRON’s website: ZESTRON Semicon Webinar Series

ANN ARBOR, MI – Aven, a full-service technology provider, is pleased to announce its partnership with Industrial Source Inc. (ISI), a respected national representative firm based in Chicago. This strategic alliance aims to bolster support for Aven's industrial distribution partners, ensuring enhanced promotion and visibility of Aven's products in the industrial marketplace.

With years of experience ranging from working with small manufacturers to large multinational companies like Rust-Oleum Paints & Coatings, ISI brings invaluable expertise and insight to the table. Their proven track record in successfully promoting products to the industrial marketplace through large distributors aligns perfectly with Aven's goals of expanding its reach and better serving its distribution network.

"As we continue to grow and evolve, it's crucial for Aven to align with partners who share our commitment to excellence and customer satisfaction," said Mark Kanpurwala, VP Sales & Marketing at Aven. "ISI's extensive experience and industry knowledge make them an ideal partner to help us better support our industrial distribution partners and drive growth in the marketplace."

Through this collaboration, Aven aims to strengthen its relationships with industrial distributors, provide them with enhanced support and resources, and ultimately increase the visibility and availability of its products to customers across various industries.

"We are very excited to partner with Aven and contribute to their success in the industrial marketplace," said Doug DiVenere, Senior Managing Partner at ISI. "Aven's reputation for delivering high-quality products aligns perfectly with our agency’s mission to provide exceptional service and support to our clients. Together, we look forward to driving mutual growth within the industrial distribution channel."

For more information about ISI, visit www.isiconnection.com 

For more information about Aven, visit aventools.com 

CHICAGO, IL – Bimos, a leading provider of ergonomic ESD seating solutions, is pleased to announce the appointment of Z TECH SERVICES, INC. as its newest representative.

Established in 1993, Z TECH SERVICES serves a wide range of states, including Illinois, Indiana, Wisconsin, Iowa, Missouri, Kansas, and Nebraska, with a dedicated sales staff known for its experience and technical expertise.

With this new partnership, Bimos expands its reach and enhances its ability to serve clients in key regions across the United States. Z TECH SERVICES brings a wealth of knowledge and a commitment to providing efficient and effective sales support to its clients.

Bimos is renowned for its range of ESD seating solutions, including the acclaimed Neon, Nexxit, and Labsit series. These products are specifically designed to meet the rigorous demands of the electronics industry, offering unmatched comfort, durability, and ergonomic support. Bimos' commitment to design innovation, exceptional quality, safety certifications, and ergonomic excellence makes its seating solutions the preferred choice for businesses seeking to invest in the health and productivity of their employees.

"We are excited to welcome Z TECH SERVICES to the Bimos family," said Mark Scelfo US Managing Director at Bimos. "Their extensive experience and dedication to customer service align perfectly with our values, and we are confident that together, we will continue to provide outstanding seating solutions to our clients in the electronics industry."

For more information about the Bimos Stool System and other ergonomic seating solutions from Bimos, please visit www.bimos.com 

CLINTON, NY – Indium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA. Payne’s presentation, scheduled for May 9, will examine the challenges and benefits of transitioning from high-Pb solder to Pb-free solder for die-attach in discrete power applications.

High-Pb solder has long been the standard material for die-attach in discrete power devices; however, market-leading device manufacturers have been actively working with suppliers to find alternatives. In addition to Pb-free solders, other options are being considered, including TLPS, adhesives, and sinter materials. Focusing on a novel, dual-alloy, high-temperature, Pb-free solder, Payne will explore the pros and cons of the different material options and explain why Pb-free solder shows the most promise as an alternative to high-Pb solutions.

“The results and analysis presented will highlight how this new Pb-free solder can outperform Pb-based solder in some aspects of function and reliability,” said Payne. “With successful customer trials already completed, this new Pb-free solder is ready for industry adoption.”

Payne is responsible for driving the profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. He has more than 13 years of experience in semiconductor/wafer fabrication. Dean holds multiple certifications from the University of Wales and Coleg Gwent in the United Kingdom, including the Level 3 National Vocational Qualification in electrical and electronic engineering, the Higher National Certificate in electrical and electronic engineering, and the Higher National Diploma in engineering.