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HALFMOON, NY – PVA, a global supplier of automated dispensing and coating equipment, is excited to announce that Surf-Tech Manufacturing Corp. has made a strategic investment in PVA’s Delta 8 Selective Conformal Coating Machine with 5th Axis Tilt capability. Surf-Tech’s investment underscores its dedication to delivering top-notch quality and expanding its capabilities in selective conformal coating, potting, bead, and meter-mix dispensing applications.

“We are thrilled to incorporate the Delta 8 unit from PVA into our manufacturing capabilities,” stated Stephen Eggart, President of Surf- Tech Manufacturing. “The Delta 8’s remarkable flexibility, precision, and integrated features will empower us to offer even more efficient and reliable manufacturing solutions to our clients. By continuously investing in advanced technology and cutting-edge equipment, we are dedicated to maintaining our status as a trusted partner for our clients, delivering comprehensive and high-quality manufacturing solutions.”

PVA’s Delta 8 Selective Conformal Coating Machine is celebrated for its exceptional versatility and flexibility. Designed to accommodate a diverse array of assembly applications, the Delta 8 is perfectly aligned with Surf- Tech’s multifaceted manufacturing requirements. The machine comes with an array of options and integrated features, boasting a robotic system repeatability of ±25 microns and the capability to accommodate multiple dispensing applications or materials within a single cell, resulting in heightened precision and efficiency.

A standout feature of the Delta 8 unit is its 5th Axis Tilt capability. With this motorized programmable tilt, the machine can be adjusted to angles ranging from -50° to 50°. The added flexibility provided by this feature enables enhanced accessibility to components, ensuring more precise dispense and spray processes. By leveraging the 5th Axis Tilt capability of the Delta 8, Surf-Tech anticipates achieving superior outcomes and upholding the highest quality standards.

Surf-Tech Manufacturing Corp., renowned for its versatile contract manufacturing services across a range of industries, has solidified its position by acquiring the Delta 8 unit from PVA. With this strategic investment, Surf-Tech is poised to address evolving customer needs and deliver exceptional outcomes across a broad spectrum of manufacturing applications.

As a trusted innovator in precision application solutions, PVA is committed to providing cutting-edge technologies that enhance production processes and drive efficiency in various industries.

For more information about PVA, please contact PVA at info@pva.net or 518-371-2684.

NORTH BILLERICA, Mass., September 2023 — BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will highlight its TrueFlat™ reflow oven technology at SEMICON Taiwan in booth #M1039. The expo is scheduled to take place September 6-8, 2023 at TaiNEX 1 & 2 in Taipei.

“Very thin substrates represent a special challenge for thermal processing,” said Joe Yang, product manager at BTU. “Our TrueFlat technology ensures that even substrates as thin as 0.15 mm are kept flat throughout the entire reflow process.”

Part of the industry-leading Pyramax reflow oven platform, TrueFlat technology addresses the critical challenge of substrate warpage. One of the standout features of the TrueFlat is its exceptional thermal uniformity, made possible by integrating the Pyramax’s closed-loop convection heating system. By eliminating die tilt and accommodating substrate thicknesses ranging from 0.15-0.30 mm, TrueFlat technology maximizes process yield.

Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary Wincon™ Windows-based software including factory host/MES interface for Industry 4.0 compliance. This innovative configuration enables manufacturers to achieve reliable and optimal results across a range of applications.

Visit BTU International's booth at SEMICON Taiwan 2023. To learn more visit www.btu.com.

About BTU International

BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion and sintering. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia, and Europe. Information about BTU International is available at www.btu.com.

TAIPEI – Heraeus Electronics is excited to announce its participation in the SEMICON Taiwan exhibition. The event is scheduled to take place Sept. 6-8, 2023 at TaiNex Halls 1 and 2 in Taipei City, Taiwan. Heraeus Electronics is set to unveil a wide array of cutting-edge materials designed to elevate power modules and semiconductor device performance.

Addressing Challenges in Advanced Electronics

Heraeus Electronics recognizes the need for the semiconductor advanced packaging industry and related technologies to cater to fast- evolving and increasingly complex electronic products used in 5G communications, Internet of Things, AR and smart wearables, electric vehicles, and other consumer or industrial applications. As constantly driven by higher performance and smaller form factors, the number of components in semiconductor packages such as the system-in-package (SiP) continue to increase while the package size decreases. To meet the demand of today’s electronic industry, solder materials that can create tiny and reliable joints with close to zero defects are needed.

Heraeus Electronics will present its latest breakthrough solutions aimed at maximising yield, miniaturization and addressing defect challenges. Among these solutions are Welco™ AP520 and AP500X.

Innovative Solutions Unveiled

Welco™ AP520, a cutting-edge water-soluble type 7 printing paste, is engineered to address the challenges of miniaturization. With its ability to create tiny, reliable joints with minimal defects, Welco™ AP520 is ideal for fine-pitch components and flip chip attach applications. Its exceptional paste release down to 90 µm pitch, along with its low void performance and lack of splashing, makes it a standout choice for next-gen System-in-Package applications in 5G communications, smart wearables and electric vehicles.

Welco™ AP500X, a water-soluble, halogen-free tacky flux, offers specialized solutions for ultra-fine bump-pitch flip chip attach and BGA attach applications. By meticulously addressing defects such as cold joints, solder creeping and underfill delamination, AP500X ensures the reliability of advanced semiconductor packages.

Furthermore, as part of its commitment to sustainability, Heraeus Electronics offers a portfolio including gold bonding wire made with 100% recycled gold and Welco™ solder paste series made with 100 percent recycled tin. These materials adhere to Responsible Materials Initiatives (RMI) and IS014021:2016 standards, reflecting Heraeus Electronics' dedication to environmental responsibility.

Turnkey Solution Available for Early Movers

Maskless Selective Metal Coatings: Prexonics® is the new full system solution from Heraeus Printed Electronics, combining particle-free silver ink and an inkjet printer for superior EMI shielding using maskless selective coating. It offers perfectly matched equipment, silver ink and processes to create the optimal shielding effectiveness, providing design flexibility for varied pattern layouts. The tool fulfills the standards of the semiconductor industry, and its mass production capability has been proven. All process steps are automated and inline: component pre-treatment, inkjet printing of the MOD metal ink and sintering to a metallic silver film.

Heraeus Electronics invites attendees to visit booth L0200 (TaiNex Hall 1, 4F) at SEMICON Taiwan 2023 to explore the full range of revolutionary solutions. To learn more about Heraeus Electronics' expertise in advancing electronics through innovative materials, please visit www.heraeus-electronics.com

HANOVER, GERMANY – A well-prepared team from Viscom Asia is ready to welcome visitors to NEPCON Vietnam 2023 in Hanoi. Two machines will represent the wide range of inspection systems developed and manufactured at Viscom AG in Germany: iX7059 PCB Inspection XL (3D AXI) and S3088 ultra chrome (3D AOI). In combination, they cover 100% of today's post-reflow inspection requirements.

Whether research and development or production of high-end electronic devices, Vietnam is increasingly becoming a very important key player among Asian countries. This will also be evident at the International Centre of Exhibition (I.C.E.) in the country's capital from September 6 to 8. Viscom will be present at NEPCON Vietnam 2023 with its own booth No. V04. Under the vAI brand, for example, Viscom offers a growing portfolio of smart solutions in the field of artificial intelligence. NEPCON visitors will learn more about the advantages of AI in the verification process or, e.g., inspection program generation.

The exhibited iX7059 PCB Inspection XL inline X-ray system has already won the EM Innovation Award in the "X-ray inspection" category this year. Its special features include a revolutionary, fully dynamic 3D image acquisition concept with a new generation of flat panel detectors and the ability to inspect very long PCBs in lengths of up to 1600 mm (63"). High- quality 3D AXI volume calculations and slice images of the inspection areas enable, for example, the repeatably exact measurement of voids – based on high-performance planar CT.

The S3088 ultra chrome at the Viscom booth is a well-known 3D AOI system used in high-throughput production lines worldwide. For verification, it delivers true-to-life 360° renderings and color images from nine perspectives. Its advanced 3D camera technology is combined with extremely high inspection speed and outstanding inspection quality. All this is delivered as a standardized system configuration. The Viscom team is also available to answer questions about other inspection solutions, e.g., for solder paste, wire bonds, conformal coatings, or batteries.

CORK, IRELAND – Altus Group has recently opened a new facility in Cork, southwest Ireland, to accommodate rapid growth in the country and support its customers within the region.

The new premises supports the company’s growth strategy and strengthens their presence in the region. The facility will be equipped with spare parts, consumables, and equipment to ensure customers in Ireland receive faster deliveries and enhanced support. It will also house an area where off site training and demonstrations of the most innovative hardware and software will take place to enhance pre-sales opportunities.

Joe Booth, Altus CEO said: “After a great 2022 for our business in Ireland with several significant orders and a continuation of that performance in 2023, we have committed to our long-term plans for the region by moving our operations to a dedicated facility.

“With the portfolio we have, and the infrastructure we are building, our aim is to be the number one partner for electronics manufacturing not just in the UK, but in Ireland too. This latest step is helping to achieve those goals.”

Heading up the facility will be Gareth Fenton (Sales Manager), Michal Ostrykiewicz (Senior Applications Engineer) and new joiner Andras Fekete (Applications Engineer), who as a team have built on existing relationships and nurtured new ones to establish Altus Ireland as a front runner in its field. The new premises will open more possibilities to reach customers and increase business in this territory.

“It has been a joy to watch the journey of our new entity firstly in being established, and now striving as we show commitment to the region, our existing partners and new customers who trust us to fulfil their projects,” said Joe.

“The response to our efforts has been far better than even we were expecting. Our principle has always been to be ‘focused on support excellence’. We believe by making these investments in the region, we are living up to that promise. You only need to look at the industry-leading brands in our portfolio to see why we have been successful in the past. With the team and infrastructure in place in Ireland, the sky is the limit for our future.”

NORTH BILLERICA, MA – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will highlight its TrueFlat™ reflow oven technology at SEMICON Taiwan in booth #M1039. The expo is scheduled to take place September 6-8, 2023 at TaiNEX 1 & 2 in Taipei.

“Flat substrates are an industry challenge that require special processing,” says Joe Yang, product manager at BTU. “That’s why the BTU TrueFlat technology ensures that even the most minimal substrates are held flat through the entire reflow process.”

Designed as an addition to the industry-leading Pyramax platform, the TrueFlat technology addresses the critical challenge of substrate warpage.

One of the standout features of TrueFlat technology is its exceptional uniformity, made possible by integrating the Pyramax’s closed-loop convection heating system. By eliminating die tilt and accommodating substrate thicknesses ranging from 0.15 to 0.30mm, TrueFlat technology guarantees consistent flatness.

Easy to maintain with no vacuum pump, the system offers simple operation and full integration with BTU’s proprietary Wincon™ Windows-based software including factory host/MES interface for Industry 4.0 compliance.

This innovative configuration enables manufacturers to achieve reliable and optimal results across a range of applications. Visit BTU International's booth at SEMICON Taiwan 2023. To learn more visit www.btu.com

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