NORTH READING, MA ― Accu-Assembly Inc., a leading industrial automation company, is set to exhibit at the upcoming 2024 IPC APEX EXPO, scheduled to take place from April 9-11, 2024 at the Anaheim Convention Center in California. Accu-Assembly will be exhibiting its revolutionary AccuLiFT SMT Component Reel Vertical Modular Storage and Retrieval System at Booth 4030.

The AccuLiFT system has redefined SMT component reel storage and retrieval, setting new standards for efficiency and adaptability. With a focus on rapid changeover and user-friendly operation, the AccuLiFT empowers manufacturers to seamlessly interchange small and large reels on the storage pallet, offering unprecedented operational flexibility.

Key Features of AccuLiFT:

• Automation Excellence: The AccuLiFT employs a robotic workcell for automated loading/unloading of reels from reel stacking units, eliminating the need for manual intervention. This key feature maximizes throughput with fast cycle times and exceptional accuracy.
• Impressive Capacity: The base unit alone can store up to 3,800 7” reels, and the system offers the option to integrate two additional vertical storage units, resulting in an astonishing total storage capacity of up to 8,300 reels. The reels are securely housed on durable pallets with a robust steel frame and ESD plastic trays for comprehensive protection.
• VLM Technology: Leveraging Vertical Lift Module (VLM) technology, the AccuLiFT ensures efficient parts storage and retrieval. Its modular design enables seamless vertical expansion, optimizing floor space as manufacturers require additional reel storage. The Direct Drive Technology with auto correction eliminates the need for calibration.
• Automated Dual-Level Robotic Station: The AccuLiFT features an automated dual- level robotic reel loading/unloading station, allowing efficient loading and unloading of reels. This innovation significantly reduces cycle times and enhances overall operational efficiency.
• Input Stacking Units: The capability to automatically load up to 200 reels at a time for loading into the AccuLiFT.
• Advanced Barcode Scanning: The system integrates automatic barcode scanning of all reels on the pallet and automatic reel thickness detection, enhancing accuracy and reliability. Multiple job sorting capabilities enable faster kitting processes.
• Flexible Software Interface: AccuLiFT's flexible software interface facilitates seamless integration with SMT placement equipment and MES/ERP systems, showcasing Accu- Assembly's proficiency in software development and interfacing with various databases.

Visit Accu-Assembly at Booth 4030 during the 2024 IPC APEX EXPO to witness the future of SMT component reel storage and retrieval.

The AccuLiFT is proudly manufactured in the USA.

For more information about Accu-Assembly’s automation and productivity solutions, visit www.accuassembly.com 

SAN DIEGO, CA – Intraratio, the leading provider of Advanced Manufacturing enterprise software solutions, announces its participation in the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Intraratio is set to exhibit its cutting-edge smart manufacturing and Industry 4.0 solutions that redefine visibility, traceability, and control in Semiconductor and Surface Mount Technology (SMT) electronics manufacturing operations in Booth 2342.

With customer testimonials for excellence, Intraratio offers a comprehensive suite of solutions designed to enhance, manage, and optimize electronics manufacturing processes and drive operational efficiency.

Their featured solutions include:

Seamless Factory and Equipment Integration (Data Automation/IoT) for AI/ML: Intraratio establishes seamless connectivity between factories and equipment, eliminating the need for third-party software or middleware. Deployable in 12 weeks or less. This cost-effective and robust integration forms the foundation for data-driven decision-making, and the application of AI/ML.

Full-Featured Manufacturing Execution System (MES/RunCard): Intraratio's MES solution, RunCard, optimizes manufacturing processes, streamlining operations and enhancing overall efficiency, with direct AI/ML integration.

Serialized Product Traceability: Intraratio empowers manufacturers with end-to-end product traceability, ensuring quality and compliance throughout the production lifecycle.

Real-Time IoT, Yield and Quality Monitoring (DataCard): With DataCard, Intraratio provides real-time visibility into IoT, yield and quality data, enabling proactive measures to enhance product quality, reduce waste, and the ability to leverage AI/ML.

Global Supplier Data Management (ServiceCard): ServiceCard simplifies global supplier data management, fostering collaboration and efficiency in the supply chain.

These solutions are enriched by state-of-the-art Machine Learning (ML) based analytics, facilitating outlier detection and predictive maintenance. Intraratio’s offerings are meticulously designed to accelerate the digital transformation journey of customers in the electronics manufacturing industry.

Visit Booth 2342 at the 2024 IPC APEX EXPO to experience firsthand how Intraratio’s advanced manufacturing software solutions revolutionize operational visibility, traceability, and control, setting new benchmarks for excellence in the industry.

For more information about Intraratio, visit www.Intraratio.com 

SHINGLE SPRINGS, CA – PDR Americas is set to showcase its latest innovations at the 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024, at the Anaheim Convention Center in California. Visit PDR at Booth 3829 to experience firsthand the IR-E3 System for rework and the GenX90 w/ Vector Nav 3D CT Tomography for X-ray.

The PDR IR-E3 is an advanced rework station designed to cater to BGA/SMT components with precision and efficiency. This cutting-edge system boasts key features such as advanced focused IR component heating, quartz IR PCB preheating with up to 3 zones, and a Split Beam prism system enabling simultaneous PCB/component viewing.

The station ensures precision in component placement up to 10um, precise PCB handling, and includes a Component Nest/Flux Application Facility. With closed- loop non-contact temperature sensing, advanced automatic thermal process control, a reflow process observation camera, and PCB forced air cooling, the IR-E3 streamlines the rework process, setting a new standard for accuracy and control across a diverse range of components.

Additionally, PDR will showcase the GenX-90P, an ultra-high- performance X-ray system designed for precision inspection.

Key features include:

• Compact system, accommodating PCB sizes up to 21” (533mm) X 17.5” (445mm)
• Customizable Flat Panel Detectors or Image Intensifier options
• 90kV, 8 Watt, 4um X-Ray tube, 0.18mA with Magnification up to 1100X

Primarily designed for BGA inspection and analysis, counterfeit inspection, porosity/voiding detection, medical device inspection, wire bond inspection, and LED inspection, this system ensures precise and reliable results. With radiation levels less than 1 uSv/hr (0.1 mR/hr) and compliance with USFDA 21 CFR-1, J-1000, 1020.40 standards, it prioritizes safety in all operations. The GenX-90P is equipped with programmable 4-axis (X, Y, Z1/Z2) fully motorized motion control, facilitating comprehensive inspection capabilities. Its BGA/QFN/Flip Chip software includes Pass/Fail criteria, Sphere Size, Void analysis, and a 3D Gray Scale Option.

Visit PDR at Booth 3829 during the IPC APEX EXPO to explore these groundbreaking solutions and learn more about how PDR is shaping the future of electronic rework and inspection.

For more information about PDR Rework and its innovative solutions, please visit www.pdr-rework.com  

CLINTON, NY – Indium Corporation’s leading technical experts are set to deliver and participate in a number of presentations and panel discussions throughout IPC APEX Expo, April 9-11, in Anaheim, Calif., U.S. Topics will include sustainability, assembly processes, and EV electronics.

Tuesday, Apr. 9

• Innovative Low-Temperature Solder Alloy & Optimized Convection Reflow Oven Combination to Achieve up to 25% Energy Savings presented by Regional Technical Manager and Technologist – Advanced Applications Andreas Karch, in partnership with Daniel Hamann, SMT Thermal Discoveries

Wednesday, Apr. 10

• Advancements in Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes for Complex Electronics Assemblies presented by Product Specialist Evan Griffith, in partnership with Kalyan Nukala, Zestron Americas
• Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing presented by Product Development Specialist for Thermal Interface Materials Miloš Lazić, in partnership with Sunny Agarwal, ITWEAE
• The Attempt of Lower Temperature Soldering Process for Large Plastic Ball Grid Array Board-Level Assembly presented by R&D Manager, Alloy Group, Principal Metallurgist Dr. HongWen Zhang
• Optimization of Photonic Soldering Processes for SIR Performance co-authored by Technical Support Engineer Thuy Nguyen, presented by Ara Parsekian, PulseForge, Inc.
• Liquid Metal Patterning for Electronic Circuits and Thermal Management co-authored by Miloš Lazić, Associate Director ESM Product Management Jon Major, and Material Research Scientist Dr. Ricky McDonough; presented by Michael Dickey, North Carolina State University

Thursday, Apr. 11

• Panel Discussion: PCBA Reliability and Test for EV Applications featuring Principal Engineer, Global Accounts Technical Manager, Dave Sbiroli

Click here for an interactive schedule of all presentations taking place at IPC APEX 2024 and be sure to visit with Indium Corporation’s experts at booth 4227.

Andreas has more than 20 years of experience in automotive electronics and power electronics, including the development of advanced customized solutions. In 2014, the Austrian Patent Office awarded him the “Inventum” award for his patent for innovative LED automotive lighting as one of the top ten applicants. He is an ECQA-certified development engineer and has earned the Six Sigma Yellow Belt.

Griffith is a Product Specialist for Indium Corporation’s Semiconductor and Advanced Assembly Materials product line, which includes Indium Corporation’s fine-powder solder pastes (SiPastes) and semiconductor assembly fluxes. He is responsible for researching and analyzing customer and market data and facilitating current and prospective customers’ needs. Additionally, he supports customers’ inquiries, internal product trainings, and works closely with Indium Corporation’s R&D team on new applications. He earned a Master of Engineering Management, Bachelor of Engineering in Materials Science and Engineering, and a Bachelor of Arts in Engineering Sciences and French, graduating with honors, all from the Thayer School of Engineering at Dartmouth College. He has also earned his Lean Six Sigma Green Belt from Dartmouth College and has received certifications in Product Management from Columbia University and Product Marketing from Cornell University.

Lazić is responsible for developing new thermal materials and products, and providing solutions for customer challenges and applications. He also develops new testing methods to evaluate power and thermal products, and gathers data on new and existing products for marketing presentations. He earned his master’s degree in electronics engineering and his bachelor’s degree in electrical engineering from the University of Nis in Serbia. He is an Energy Efficiency Engineer certified by the Serbian Chamber of Engineers in Belgrade; a Certified SMT Process Engineer; and is fluent in English, Serbian, Croatian, and Bosnian.

As manager of the alloy group in Indium Corporation’s R&D department, Dr. Zhang’s focus is on the development of the varieties of Pb-free solder materials and the associated technologies for low-temperature, high-temperature, and/or high-reliability applications. He was instrumental in inventing the Durafuse® technology to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joint’s morphology, thus improving reliability. As principal metallurgist, he is also responsible for expanding metallurgical innovation. He and his team are responsible for using metallurgical insight to develop new products, implement improvements to existing processes and products, and measure results. Dr. Zhang has a bachelor’s degree in metallurgical physical chemistry, a master’s degree in mechanical engineering, and a Ph.D. in materials science and engineering. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610, as well as a certified SMT Process Engineer. Dr. Zhang has published two book chapters and more than 50 conference and journal papers, and he has been granted more than ten patents in the U.S. and globally. Dr. Zhang was awarded the Surface Mount Technology Association’s (SMTA) Technical Distinction Award in 2023.

Nguyen joined Indium Corporation in 2015 and has held roles in Quality, R&D, and Manufacturing during her time with the company. She has contributed to multiple large-scale projects and assisted in the implementation of new processes and training materials. She holds a bachelor’s degree in chemistry from Utica College and is a Certified SMT Process Engineer (CSMTPE).

As Principal Engineer, Sbiroli utilizes his experience to characterize soldering materials’ critical performance attributes and assist in the development of new materials and accelerated test methods to augment their critical performance. As the Technical Manager of Global Accounts, he is also responsible for the coordination, business maintenance, and resource deployment of technical services and onsite support to Indium Corporation’s global customer base with a focus on key automotive customers. Sbiroli has more than 25 years of hands-on experience in the selection and applications of printed circuit board assembly materials and SMT process optimization, defect reduction, and troubleshooting on hundreds of Indium Corporation customers’ SMT and electronic assembly production lines. He has a bachelor’s degree in Mechanical Engineering Technology from the State University of New York Institute of Technology. He achieved one of the highest scores on the SMTA Process Engineer certification exam and is certified as an IPC Specialist for IPC-A-600 and IPC-A-610D. He actively participates in the development of industry standards with the IPC and received the IPC’s Distinguished Committee Service award for his work on the J-STD-004B (Requirements for Soldering Fluxes) standards.