Press Releases
MADISON, AL – STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and contract electronic manufacturing, is thrilled to announce the newest addition to its team, Edrick Young, who joins the company as a Mechanical Assembly Technician. With a “can do” attitude, Young brings a unique skill set that will significantly contribute to STI’s continued success in delivering high-quality products to its valued customers.
As a Mechanical Assembly Technician, Young will be responsible for a variety of crucial tasks, including hand assembly operations on both prototype and production printed circuit boards. His attention to detail and precision will ensure that every product meets our stringent quality standards.
“We are excited to welcome Edrick to the STI team,” said David Raby, President/CEO. “His attitude and dedication to quality make him an invaluable asset to our team. We are confident that Edrick will play a key role in driving our ongoing commitment to delivering superior products and services to our customers.”
Mr. Young joins STI at an exciting time of growth and innovation. With his expertise and enthusiasm, STI is well-positioned to continue pushing the boundaries of what is possible in the electronics industry and providing unparalleled value to its customers.
MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, will be presenting at the upcoming IPC APEX Expo on the critical challenges and innovations in high-voltage (HV) electronic assemblies within the realm of E-Mobility. The presentation, titled "EV Electronics: Design, Manufacturing, and Reliability Challenges," will feature industry expert Olaf Schoenfeld, Ph.D., and will take place from 11:30 AM to 2:00 PM on Thursday, April 11.
In the rapidly evolving electric vehicle (EV) market, affordability and reliability are paramount. ZESTRON, a leading cleaning solutions provider, recognizes reliability's pivotal role in consumer acceptance and strongly emphasizes high-voltage (HV) electronic assemblies for E-Mobility.
HV units in EVs are susceptible to failures caused by particle-induced breakdowns and moisture ingress. ZESTRON offers innovative HV testing solutions to address these challenges, such as accelerated stress tests. These tests help identify risks before production, allowing manufacturers to optimize processes and mitigate potential failures. By leveraging analytical approaches and a comprehensive understanding of failure mechanisms such as AMP and ECM, ZESTRON supports manufacturers in reducing costs and enhancing efficiency in EV production.
To learn more about ZESTRON's cutting-edge solutions and how they can be tailored to your specific needs in HV and E-Mobility, explore the newest ZESTRON Cleaning Chronicle. Click here to access the Chronicle and delve deeper into our innovative approaches.
We value your insights and invite you to explore these innovations further at ZESTRON’s Booth #3620 during APEX 2024. Join our esteemed industry expert, Olaf Schoenfeld, Ph.D., to discuss how ZESTRON's expertise in HV and E-Mobility can be tailored to your specific needs. Reserve your meeting today. To schedule one on one time with Olaf at the upcoming APEX, click here.
WASHINGTON – IPC and Printed Circuit Board Association of America (PCBAA) released a joint statement on the FY 2024 Defense Budget.
"IPC and PCBAA were gratified to see that Congress settled on a favorable budget outcome for the Defense Production Act. As we encouraged in our February letter to Congressional Leadership, a robust level of funding is crucial to revitalizing the American PCB industry and the broader electronics ecosystem upon which U.S. military superiority rests. Additionally, this bill includes important guidance directing the Secretary of Defense to prioritize domestic production of printed circuit boards. Our coalition, representing hundreds of companies and tens of thousands of skilled American workers, will continue to push for healthy and uninterrupted funding for the DPA Procurement Account."
DALLAS, TX ― ROCKA Solutions is excited to announce its participation in the upcoming Del Mar Electronics & Manufacturing Show, scheduled to take place on April 24-25, 2024 at the Del Mar Fairgrounds in San Diego, CA. ROCKA Solutions will be exhibiting in Booth 650, where attendees can learn more about the company's commitment to enhancing supply chains and supporting various manufacturing sectors.
While traditionally known for its expertise in the electronics manufacturing industry, ROCKA Solutions is dedicated to providing value-added services across a wide range of manufacturing industries. With a focus on global reach, competitive pricing, inventory management, on-time deliveries, and technical support, ROCKA Solutions offers tailored solutions to meet the unique needs of its customers.
Key highlights of ROCKA Solutions' services include:
Global Reach: With a network of partners and suppliers worldwide, ROCKA Solutions provides global sourcing capabilities to ensure access to quality materials and components at competitive prices.
Competitive Pricing: ROCKA Solutions leverages its industry expertise and strategic partnerships to offer cost-effective solutions without compromising on quality.
Inventory Management: ROCKA Solutions assists clients in optimizing inventory levels, reducing carrying costs, and improving supply chain efficiency.
On-Time Deliveries: Through meticulous planning and execution, ROCKA Solutions ensures timely delivery of products and components to meet project deadlines and customer requirements. Technical Support: ROCKA Solutions' team of experts provides comprehensive technical support and guidance to help clients navigate complex manufacturing challenges and achieve their goals.
Visit Booth 650 at the Del Mar Electronics & Manufacturing Show to learn more about how ROCKA Solutions can enhance your manufacturing operations and supply chain efficiency.
CLINTON, NY – Indium Corporation’s Principal Engineer – Advanced Materials Andy C. Mackie, Ph.D., MSc, is scheduled to present on day one of the 2024 Critical Materials Council (CMC) Conference taking place April 10-11 in Chandler, AZ, U.S. The two-day event provides actionable information, on materials and supply-chains, for current and future semiconductor manufacturing.
Dr. Mackie’s presentation, titled From SiP to SiC: Advanced Metal Alloys Meet Evolving Reliability Challenges, will examine the continuing importance of metals in advanced digital and power packaging for both electrical and thermal electronics assembly.
“Engineered alloys for assembly materials, along with novel and emerging assembly processes, are enabling the future of electronics assembly and packaging,” said Dr. Mackie. “I look forward to exploring this timely topic with my industry colleagues at CMC.”
Dr. Mackie focuses on identifying the intersection of novel materials, emerging technologies, and their potential business impact. His professional experience covers all aspects of materials and processes for electronics manufacturing from wafer fabrication to semiconductor assembly and packaging and SMT/electronics assembly. Dr. Mackie holds a Ph.D. in physical chemistry from the University of Nottingham, UK, and a Master of Science (MSc) in physical chemistry and surface science from the University of Bristol, UK.
HAVERHILL, MA – Seica, Inc. is pleased to announce its participation in the 2024 IPC APEX EXPO, taking place April 9-11, 2024 at the Anaheim Convention Center in California. Visitors are invited to explore Seica's latest innovations in booth 3514, where the company will exhibit its state-of-the-art test platforms and automation solutions.
With a commitment to accelerating innovation, Seica's booth at the IPC APEX EXPO will feature an array of cutting-edge test solutions designed to meet the evolving needs of the electronics industry. Among the highlights will be the revolutionary PILOT VX NEXT test platform, setting a new standard in flying probe speed and performance. Equipped with advanced measurement hardware and software tools, the PILOT VX boasts unparalleled test performance, reduced test times, and enhanced capabilities for prototype validation and production testing. The Pilot VX has many automation configurations from inline integration to independent manufacturing workcell strategies. The Pilot VX is the best method to deploy for prototype runs to even high-volume production runs when the cost of fixtures and time-to-market are business concerns.
Visitors to Seica's booth will also have the opportunity to explore the fully automated COMPACT SL NEXT, a versatile test solution that maximizes configurability and customization while delivering exceptional throughput and reliability. With features such as onboard programming (OBP) and LED test capability, the COMPACT SL NEXT offers a comprehensive solution for in- circuit and functional testing requirements.
Additionally, Seica will discuss its MINI Line, a cost-effective platform for developing customized test solutions tailored to specific manufacturing needs. With integrated instruments, switching matrices, and user power supplies, the MINI Line provides flexibility and scalability for various test applications, supported by Seica's VIVA Integrated Platform (VIP™) for seamless integration and programming.
Innovative optical inspection solutions will also be on display, including the desktop version of the DRAGONFLY Next series for THT component inspection and conformal coating inspection, and with unique features to measure conformal coat thickness and validate the presence of process application of conformal coat masking. These advanced systems redefine performance in terms of flexibility, throughput, reliability and process traceability, offering unmatched capabilities for manufacturing quality and efficiency.
The COMPACT LR Next is Seica’s newest answer to legacy replacement systems, boasting a state-of-the-art-bed of nails in-circuit and functional test system with various receiver interfaces, allowing customers the ability to migrate old fixtures to a new Seica platform. This year the company will exhibit the Compact LR with its Teradyne interface. Seica has also deployed other LR options for both the GenRad and Aeroflex/Marconi systems.
The Firefly Next is a technologically advanced automated selective soldering solution, with its perfect integration on a single axis of a high-efficiency LASER source, fully-programmable donut spot, vision system and temperature sensor. The Firefly redefines the levels of performance achievable in the selective soldering process in terms of flexibility, throughput, reliability, applicability and process traceability. Stop by our booth for a discussion with our team on how the Firefly can help in your selective soldering process.
All of Seica's solutions showcased at IPC APEX EXPO will feature the company's VIVA NEXT software platform, enabling intelligent integration with manufacturing processes, data collection, traceability, and interaction with MES systems. Additionally, Seica's Next series systems are equipped with Canavisia's Industrial Monitoring solution for remote monitoring and predictive maintenance, ensuring compatibility with Industry 4.0 standards.
Come visit us at Booth 3514 to see how our innovation can help accelerate yours!
