NASHVILLE – KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in SEMICON West 2024, taking place July 9–11 at the Moscone Center in San Francisco. KYZEN will be exhibiting in Booth 1841, where attendees will have the opportunity to learn about their latest advancements, including the spotlight product: MICRONOX® MX2123 Multi-Process Power Module Cleaner.
MICRONOX MX2123 is an advanced, aqueous, multi- phase cleaning solution specifically engineered to remove flux residues from a variety of IGBT module devices that utilize a combination of copper, silver and nickel DBC substrates, as well as PCBs. Its meticulously balanced formula ensures superior surface conditions for subsequent wire bonding and potting processes.
Key Features of MICRONOX® MX2123:
Exceptional Cleaning Performance: Designed to effectively eliminate flux residues, MICRONOX MX2123 ensures optimal surface conditions for critical downstream processes.
Versatile Application: Suitable for use in both Spray-In-Air in-line and Ultrasonic Immersion cleaning systems, providing flexibility for diverse manufacturing setups.
Low Temperature and Concentration Efficiency: Operates effectively at low temperatures and concentrations, reducing energy consumption and operational costs.
Enhanced Surface Preparation: Ensures exceptional surface conditions for subsequent wire bonding and potting, crucial for high-reliability applications in power devices and advanced packaging.
In addition to MICRONOX MX2123, KYZEN will also discuss its range of other high- performance cleaning solutions tailored for power devices and advanced packaging applications. The company’s experts will be available at Booth 1841 to provide insights and answer questions about their comprehensive product portfolio.
For more information, visit www.kyzen.com
HANAU, GERMANY – Heraeus Electronics GmbH & Co KG (“Heraeus”), a global leader in electronic materials and technologies, announces the successful defense of its key European patent no. EP 3215288 B1. This patent encompasses the use of specific metal sintering preparations for connecting electronic components in Germany, as well as the metal sintering preparations themselves in France, Italy, Hungary and Romania. This patent is important for those involved in using such preparations for connecting electronic components, such as semiconductors, in these regions.
The validity of the patent, particularly concerning the use of specific metal sintering preparations for connecting electronic components, was recently confirmed by the Federal Patent Court. This follows an attempt by Vibrantz GmbH (“Vibrantz”) to invalidate the German part of the patent through a nullity suit (file no. 3 Ni 26/21 (EP) – also published as BPatG GRUR-RS 2023, 44592 - Metallsinter). The court's decision in favor of Heraeus has now become final after Vibrantz withdrew their appeal to the Federal Court of Justice (file no. X ZR 21/24).
Heraeus is committed to take proactive steps to protect its intellectual property. The above patent is also subject to an infringement lawsuit (case no. ACT_13227/2024) with the Local Chamber Munich of the Unified Patent Court (UPC) concerning the German, French and Italian parts of the patent.
Heraeus’ patented metal sintering technology is significant for the reliable and efficient connection of electronic components, offering excellent performance and stability. By defending this patent, Heraeus ensures that its technologies remain protected, enabling continued innovation and progress within the semiconductor industry.
HOUSTON – MacroFab Inc., the operator of North America’s largest technology platform for electronics manufacturing, has announced today that it is now offering custom PCBs. This exciting addition empowers electrical engineers to rapidly test critical circuit paths and layouts during critical early prototyping and iteration stages.
The announcement comes in response to customer feedback requesting this valuable option that provides enhanced flexibility, rapid design iterations and reliable functionality for electrical engineers. MacroFab’s new bare PCBs are manufactured to customers’ exact specifications using top-tier materials and precision processes to ensure quality and reliability. Electrical engineers can leverage custom PCBs as a cost-effective and versatile solution for upfront testing. This proactive approach helps identify and eliminate potential issues before full PCB fabrication, so the final electronic device functions flawlessly. In addition to these benefits, custom PCB orders through MacroFab are supported by the company’s expert design review process, high-quality production capabilities, and the ability to seamlessly transition to full assembly using the MacroFab platform.
“As we continue to reshape the future of electronics manufacturing, MacroFab is committed to addressing the core needs of manufacturers of all sizes through our diverse offerings and services,” says Misha Govshteyn, CEO of MacroFab. “Our user-friendly platform simplifies the ordering process, providing our customers with fast turnaround times supported by our engineering expertise. From prototyping to full production, MacroFab offers flexibility and precision along with flawless execution.”
Since MacroFab’s founding in 2013, thousands of companies have accelerated prototype-to-production of electronics through its advanced technology platform coupled with the company’s network of North American manufacturing facility partners. Whether a company needs low-volume printed circuit board assembly or high-volume full product delivery, MacroFab consistently provides unmatched service to diverse industries with its customer-first approach to manufacturing innovation.
To learn more about MacroFab’s innovative solutions, please visit macrofab.com
FLORHAM PARK, NJ – Heller Industries, the global leader in thermal technology solutions, announced two hirings today to strengthen their market position in the Eastern United States. Bob Doetzer, President of Circuit Technology Inc., has been appointed sales representative for North and South Carolina. Circuit Technology is a manufacturer’s representative and IPC training group specializing in products and services covering circuit board production and semiconductor assembly.
“We are excited to welcome Bob to the Heller team. He is a highly respected industry expert with the experience and relationships that are critical to Heller’s success in the Carolinas,” commented Frank Hart, SVP of Global Sales and Marketing for Heller.
Heller has also announced the hiring of Tim Glasgow of REStronics Southeast to represent their products in Georgia, Tennessee, Alabama, and Mississippi. REStronics Southeast leverages their diverse range of products and extensive industry expertise to assist manufacturers in improving their productivity and efficiency.
“I have had the opportunity to work with Tim Glasgow for a number of years,” stated Hart. “Tim is a tremendous advocate for his customers with unparalleled expertise in SMT. I am confident that Heller is best positioned for the future with Tim and REStronics Southeast.”
NASHVILLE – KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at RAPID + TCT 2024, scheduled to take place June 25-27, 2024, at the Los Angeles Convention Center. The KYZEN clean team will discuss their safe and effective water and solvent-based solutions for sensitive 3D parts at Booth #2853.
KYZEN’s specially formulated cleaning chemistries, such as KYZEN 3D5420 and KYZEN 3D5701, are compatible with most cleaning systems on the market today and have proven to effectively remove resins and contaminants without damaging 3D-printed parts and molds. KYZEN partners with its customers to learn about their processes and cleaning challenges, providing not only cleaning chemicals but also cleaning solutions.
KYZEN 3D5420 is a water-based aqueous cleaning solution proven efficient in removing a variety of uncured resins and contaminants from Stereolithography (SLA) 3D printed parts. Used for post-process cleaning, 3D5420 offers an operator safe and environmentally responsible alternative to IPA and TPM solvent cleaning processes. KYZEN 3D5420 provides a cost effective and free rinsing solution.
KYZEN 3D5701 is a cost-effective drop-in replacement for Tripropylene glycol monomethyl ether (TPM) in solvent parts washing systems. 3D5701 will remove resins and contaminants from molds and Stereolithography (SLA) 3D printed parts. KYZEN 3D5701 has proven effective with many standard UV cured resins used in 3D printing processes.
KYZEN proudly provides effective solutions tailored to meet the unique cleaning challenges of the ever-evolving market for additive manufacturing post-process cleaning.
For more information, visit www.kyzen.com
DALLAS, TX – StenTech® Inc., a leading global company specializing in SMT Printing Solutions, is excited to announce its participation at the SMTA Querétaro Expo & Tech Forum on Thursday, June 6, 2024. The company's local team in Mexico will be present to discuss the advanced StenTech BluPrint™ PVD (Physical Vapor Deposited) Surface Treatment, engineered to enhance SMT processes, improve stencil performance and longevity, and streamline production.
The BluPrint™ PVD Surface Treatment is designed to address the challenges of shrinking components and circuit boards in solder paste printing with laser-cut stainless-steel stencils. Meticulously developed to meet the intricate requirements of the semiconductor and EMS industry, StenTech BluPrint™ PVD has established itself as the premier choice in North America for evolving SMT demands.
Key Benefits:
The revolutionary BluPrint™ process begins with plasma polishing to yield smooth, high-gloss surfaces, followed by the physical vapor deposition process which applies a thin film of material onto the substrate. This method results in a consistent, indestructible coating that significantly enhances transfer efficiency and stencil performance, outperforming nano-coatings.
StenTech BluPrint™ sets a new standard for stencil coating technology, offering unmatched performance, longevity, and cost-effectiveness for the SMT industry. Its innovative approach ensures reliable, uniform printing while reducing maintenance and replacement costs associated with traditional coatings.
Visit us at the Querétaro Expo & Tech Forum to learn more about how StenTech BluPrint™ PVD Surface Treatment can elevate your SMT processes. Our local team in Mexico is eager to discuss how our advanced coating can streamline your production and enhance the quality of your SMT assembly process.