CLINTON, NY – Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials, Sze Pei Lim, is scheduled to present at the International Conference on Electronics Packaging (ICEP 2024). The presentation will take place on April 18 in Toyama, Japan, as part of the iNEMI session. During the presentation, Lim will discuss the results of a technical paper titled Low-Temperature Material Discovery and Readiness for First-Level Interconnect in Semiconductor Packaging. The full conference is being held April 17-20.

Today’s industrial needs necessitate more in-depth study into the assembly process challenges, materials properties, reliability performance, and feasibility of employing low-temperature material for first-level interconnects. Most of the current flip-chip, or first-level interconnects, use SAC alloy solder bump or SnAg alloy on Cu-pillar. With both the thinning and enlargement of die, warpage is a constant challenge in the assembly process. Lower die-attach temperatures help to minimize warpage caused by high temperatures, while temperature-sensitive substrates, die, and sensors may also require lower processing temperatures. Interconnect materials with a hierarchy of various processing temperatures are necessary to prevent remelting during subsequent reflow processes. Lastly, lower processing temperatures reduce energy consumption and minimize carbon footprint in the manufacturing process.

“If Sn-Bi-based solder alloys are carefully designed, with optimized production processes, SAC and low-temperature solder hybrid joint systems can revolutionize thermomechanical and fatigue performance with benefits such as low-temperature reflow and better drop and thermal shock resistance to high-temperature applications,” said Lim.

As the Senior Global Product Manager for Semiconductor and Advanced Materials, Lim works closely with the R&D and manufacturing teams and collaborates with leading semiconductor companies and contract manufacturers around the world. She is a task force member of the International Electronics Manufacturing Initiative’s (iNEMI) Packaging Technology Integration Group and has co-chaired several industry projects and road mapping initiatives over the past five years. She is also a member of the executive committee of the Institute of Electrical and Electronics Engineers (IEEE) Packaging Society Malaysia Chapter. Lim is a part of the organizing committee for the International Electronics Manufacturing Technology (IEMT), and has authored several technical papers. She regularly presents at international technical conferences. Lim earned her bachelor’s degree from the National University of Singapore, where she majored in industrial chemistry with a focus on polymers. She is a Certified SMT Process Engineer and has earned her Six Sigma Green Belt.

HALFMOON, NY – PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce that Jon Urquhart, Global Director of Applications Engineering, will present at the SMTA Heartland’s High Reliability: Strategic Technology Advancement Research (STAR) Forum. The event is scheduled to take place on Thursday, May 2, 2024 at the Embassy Suites by Hilton Kansas City Olathe.

In his presentation “Protecting Electronics – An Overview of Conformal Coating, Encapsulation, and Potting,” Urquhart will delve into the critical aspect of safeguarding electronic assemblies from environmental factors to prevent failure. While designers and manufacturing professionals acknowledge the importance of protection, configuring automation in a production environment can be challenging. Urquhart’s presentation will provide valuable insights into three commonly used methods of protecting electronic assemblies using liquid formulations: conformal coating, encapsulation, and potting.

The presentation will cover essential topics such as the materials used, application methods, real-world examples, and troubleshooting tips to ensure a successful manufacturing process. Attendees can expect to gain valuable knowledge and practical strategies to enhance the reliability and longevity of electronic products.

Urquhart has served as PVA’s Senior Application Engineer since 1993, boasting extensive expertise in fluid material processing within production environments. He is highly sought after by both material manufacturers and end-users for his ability to optimize processes and recommend efficient automated equipment and application solutions. Urquhart holds multiple patents for spray valve designs and coating machine configurations. With more than 20 years of practical experience, he is recognized as a leading authority in the selective application of conformal coating materials, contributing significantly to the advancement of manufacturing processes.

For more information about PVA, please contact PVA at info@pva.net or (518) 371-2684.

SANTA CLARA, CA – TEXMAC-Takaya booth #4016 at APEX will feature the latest technology in Flying Probe Test technology. Two advanced systems, the APT-1400F-SL and APT-1600FD-A will be on display in the booth and available for demonstrations, particularly Takaya’s newest tool set with Takaya’s Plus Infinity platform.

The 1400F-SL manual load, single sided, large test area system can test assemblies as large as 25 x 24 inches. This system can be ordered with an automated conveyor interface.

The 1600FD-A is an automated, dual-sided inline probing system with a 21 x 19 inch test area. PCBs are fed into the system via conveyor, and the system is equipped with the OPC UA server for MES communication. The 1600FD-SL dual-sided system with a 25 x 24-inch test area can also be ordered with the automated conveyor interface. For larger board sizes, the 1600FD-SL is available to test boards up to 25 x 24-inch and can also be ordered with the automated conveyor interface.

TEXMAC will also demonstrate their latest tool for programming, FastTrack. FastTrack uses ODB++ data to very quickly create Takaya programs without 3rd party software and maintenance. Other features include boundary scan and ISP integration utilizing Takaya’s MultiProbe, APT Plus Infinity operating environment, and more.

ATLANTA — ECIA is pleased to announce that Ron Reed, Director of Supplier Operations at Avnet (Americas) has joined the Global Industry Practices Committee (GIPC). The GIPC works to identify common global problems and issues, organize Subject Matter Experts to research, provide guidance and drive adoption of measures to increase efficiencies throughout the global authorized channel for electronic components.

"I am thrilled to welcome Ron to the GIPC. We will take advantage of his 30 years of experience in the broader electronics distribution industry. He will be a valuable addition to the talented team of industry professionals already on our current committee,” Don Elario, ECIA’s VP of Industry Practices commented. “I look forward to working with him to drive best practices within our industry.”

“I am super-excited to be working with a group of talented and experienced industry leaders to promote best practices,” Ron added.

Ron began his career at Insight Electronics (Memec Group) working in logistics, asset management and sales. For the past 9 years he has resided in Guadalajara, Mexico, leading local Avnet teams focused on customer service, procurement, and product management. Ron holds a BS from Brigham Young University and an MPA from San Diego State University. He and his wife Michelle have three children and two grandchildren. Ron’s outside interests include Latin American cuisine and culture, travel, reading, freediving and spearfishing.