Press Releases
BOHEMIA NY ― Q Source is pleased to introduce the new Brady S3700 Multicolor + Cut Sign and Label Printer and the M511 Label Printer. Designed to elevate labeling processes, these printers bring a new level of versatility, convenience, and precision to the industrial labeling landscape.
Brady S3700 Multicolor + Cut Sign & Label Printer: Redefining Labeling Possibilities In the quest for enhanced safety and visual communication, the Brady S3700 Multicolor + Cut Sign & Label Printer stands out as a transformative solution. Offering the power of multicolor brilliance and revolutionary shape cutting, this printer empowers users to create signs, labels and tags tailored to various applications.
One of the standout features is the smarter print technology that facilitates seamless color changeovers in just 20 seconds. Whether you need mono or multicolor labels, the S3700 delivers vibrant visuals that catch the eye and convey critical information quickly and reliably. The precision XY plotter cutter ensures flawless shapes, letters, arrows, and more, revolutionizing the accuracy and quality of labeling. This printer also maximizes efficiency by stacking pipe markers and fitting multiple shapes per label, minimizing waste and resource consumption.
M511 Label Printer: Seamless Connectivity
Brady’s new M511 Label Printer is designed to facilitate labeling flexibility and connectivity. Equipped with Bluetooth capabilities, the M511 enables seamless connectivity to up to five devices simultaneously, optimizing collaboration and workflow efficiency. With edge-to-edge printing capabilities on labels up to 1.5" wide, the M511 ensures that important messages are clearly visible and easy to read.
The M511's user-centric approach is further emphasized by its mobile app and software compatibility. This allows users to design and print labels from their phones, tablets or laptops, eliminating the need for unnecessary rework and speeding up the labeling process.
Q Source is a distribution leader for a wide range of commercial industrial products used across multiple industries. For more information about the new Brady label printers and other high-quality brands available at Q Source, please visit www.qsource.com
MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is hosting a live webinar on September 28, 2023, at 2:00 PM EST. This webinar will be given by Sr. Application Engineer, Ravi Parthasarathy, and Brent Frizzell, Global Electronics & Automotive Marketing Segment Manager from Specialty Coating Systems. The event will focus on the criticality of cleaning PCBs before conformal coating and is intended for individuals interested in learning about the benefits of cleaning PCBs, the harmful effects of coating over residues, and the assessment methods used to evaluate cleanliness before conformal coating.
During the session, Specialty Coating Systems, coating experts, will share their knowledge and experience in providing process recommendations to ensure the long-term performance of conformal coatings. Case studies will be reviewed, and the event will conclude with a 30-minute question and answer session, providing attendees with an opportunity to ask their questions and receive expert advice from the field's leading experts.
Registration for the event is open, and individuals can register through the provided link. This event promises to be insightful and informative, and interested individuals are encouraged to register now to secure their spot.
Milwaukie, OR – ECD today announced that Seydina Diop has joined the company’s growing engineering team as a Software Engineer II. This is the second ECD engineering hire in less than a year, as the company has committed to – and is achieving – an accelerated product development roadmap.
Diop, an experienced full-stack software developer who has been writing code since childhood, brings over ten years of experience to the ECD team. He previously worked for an online design goods marketplace where he managed the company’s social media presence and provided technical support, metrics analysis, and troubleshooting to improve the user experience. His unique skill set unites back-end and front-end technical knowledge with artistic presentation, bringing operational robustness and user perspective to his craft.
“I describe myself as having an engineer’s brain with an artist’s eye,” comments Diop. “It’s one thing to understand and be able to develop technically sound code. It’s quite another to marry that skill with artistic conceptualization to ensure the user experience is visually rich, intuitive, and consistent across multiple platforms. That’s what I intend to help deliver for ECD users.”
Initially focused on enhancements to the company’s popular OvenSENTINEL™ continuous reflow soldering monitoring technology, Diop’s future assignments include the development of baking-centric profiling software, portfolio-wide MAP profiling software upgrades, and adding customer-requested features to several popular ECD products.
Micheal Pliska, ECD Director of Engineering, says, “Seydina is a great addition to our team, allowing us to bring key software responsibilities in-house which has tightened the feedback loop and enabled fast implementation. He’s already been instrumental in adding OvenSENTINEL product support for global regions and has begun working on major upgrades to other ECD product lines.”
Diop holds a B.S. in computer science and is proficient in multiple front-end, back-end, and database programming languages, including HTML, CSS, JavaScript, Python, C#, C++, and SQL, among others. He is based in ECD’s Milwaukie, Oregon headquarters.
REDDITCH, UK – Altus Group, a leading UK and Ireland distributor of electronics assembly equipment, will be supporting key suppliers at Productronica 2023 in Munich, Germany from 14-17th November. Altus aims to maximize engagement opportunities with partners and customers, connecting attendees with new product launches and live equipment demonstrations from their suppliers.
Productronica is anticipated to attract a considerable audience, positioning itself as one of the most highly-attended industry events in recent years. Altus is strategically leveraging their entire sales team's presence at the exhibition to accommodate a high volume of supplier and customer meetings and ensure their clients can view the latest equipment innovations.
Altus CEO, Joe Booth said: "It's exciting to have Productronica back on the calendar, with attendance levels reminiscent of pre-pandemic times.
"We've spoken with many of our UK and Irish partners, and they are planning to send sizable delegations, eager to catch up with the industry's latest technologies from around the world. What's particularly exciting for us is that several of our suppliers are set to unveil and demonstrate new technologies for the first time at the event. This means we will have brand new processes to bring our local partners into 2024, with new features and enhanced value."
At Productronica 2023, Altus will host its customers at their suppliers' booths, facilitating hands-on product demonstrations and meetings. If wish to engage with industry-leading suppliers and discover the latest advancements in electronics assembly equipment, contact Altus Group - www.altusgroup.co.uk
MUNICH, GERMANY – Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2023, which will be held at Messe München Center from November 14 – 17, 2023. Visit booth No. A2-139 to experience TRI's newly released test and inspection solutions.
TRI will unveil the newly released Ultra-High-Speed 3D AOI, TR7700QH SII, capable of inspecting at speeds of up to 80 cm²/sec, maintaining uncompromised Gauge R&R. The TR7700QH SII is powered by TRI's Smart Programming, AI Algorithms, and Metrology measurement capabilities. Also exhibiting will be the newly released high throughput 3D AXI, TR7600 SV, which offers up to 20% performance improvement compared to the award- winning TR7600 series. Powered by AI Algorithms, the high-speed 3D AXI can precisely detect Void defects.
TRI will showcase the newly released high-speed multi-angle 3D AOI, TR7500QE Plus, equipped with four 20MP side cameras and 1 top high-resolution camera. TRI's lineup will include the enhanced 3D SPI TR7007DI Plus, the high-end 3D AXI TR7600F3D SII, and the Multi-core ICT with In-System LED Analysis function TR5001Q SII INLINE.
The AI solutions from TRI include the AI training tool, the AI Station, Verify Host, AI Smart Programming, and more. TRI Test and Inspection solutions comply with Industry 4.0 standards like the IPC-Hermes-9852, IPC-CFX, and IPC-DPMX.
TRI invites you to visit booth No. A2-139 at productronica 2023. Don't miss the opportunity to discuss with our experts how TRI solutions can enhance your production yield rate, reduce operational costs, and increase efficiency.
CLINTON, NY – Indium Corporation R&D Manager, Alloy Group and Principal Research Metallurgist Dr. HongWen Zhang will present at the SMTA Empire Expo & Tech Forum on September 26 in Syracuse, NY. Also at the conference, Regional Sales Manager Emily Belfield will host a panel discussion, Generational Differences in Today’s Workplace.
Dr. Zhang’s presentation, titled A Bismuth-Free In-Containing Lower Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305, will evaluate a novel solder powder paste technology which has been used to develop an innovate, bismuth-free, indium-containing solder paste for low-temperature soldering. The paste has been successfully used in board-stacking bonding with a 200°C peak temperature profile for 5G mobile phones due to the excellent drop shock performance. The joint of the wafer-level package experienced high stress/strain during thermal cycling, which led to the joint cracking right beneath the interface joining the wafer bonding pad and solder. Durafuse® LT was used to assemble a wafer-level package (WLP256, full-array, 0.25mm diameter SAC305 balls and 0.4mm pitch) with the 200–240°C peak temperature reflow profiles with a constant paste-to-ball ratio of 1:4. Hybrid joints were created using the minimum 200°C peak temperature, which had two distinct areas: (1) the mixing zone dominated by the In-containing paste on the PCB side, and (2) the area immediately above the mixing zone which retained the initial SAC305 morphology. Indium is present in multiple forms within the mixing zone, including In/Sn4 (γ) phase, Sn(In) solid solution, and In4/Ag9 or In4/Ag9/Ag3Sn composite precipitates. The full-mixing homogeneous joint was formed by raising the peak temperature to 210°C, yielding a similar microstructure to the traditional SAC305 joint of the networked Ag-containing precipitates embedded in the Sn matrix. The In/Sn4 phase was not observed in the full-mixing homogeneous joint while Sn(In) solid solution and In4/Ag9 or In4/Ag9/Ag3Sn composite precipitates remained. TCT (temperature cycling) was run under a -40°C/125°C temperature range and a 20-minute dwelling profile. Regardless the reflow profiles, Durafuse® LT outperformed SAC305 in TCT by 11% or greater. The 210°C peak temperature profile resulted in a more than 30% improvement compared to the SAC305 paste. The joint cracking was localized to the solder joint below the wafer-solder interface, similar to the SAC305 joint.
As manager of the alloy group in Indium Corporation’s R&D department, Dr. Zhang’s focus is on the development of Pb-free solder materials and the associated technologies for high-temperature and high-reliability applications. He was instrumental in inventing the new alloy technology to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joint’s morphology, thus improving reliability. As principal metallurgist, he is also responsible for expanding metallurgical innovation. He and his team are responsible for using metallurgical insight to develop new products, implement improvements to existing processes and products, and measure results.
Dr. Zhang has a bachelor’s degree in metallurgical physical chemistry from Central South University of China, a master’s degree in materials and engineering from the Institute of Metal Research, Chinese Academy of Science, and a master’s degree in mechanical engineering and a Ph.D. in material science and engineering from the Michigan Technological University. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610, as well as a certified SMT Process Engineer. He has extensive experience in various aluminum (Al) alloys and fiber/particle reinforced Al-based composite materials, and Al-rich and ZrHf-based amorphous alloys. He has co-authored two book chapters on high-temperature lead-free bonding materials, has had a number of patents filed, and has been published in approximately 20 journals in the fields of metallurgy, materials science and engineering, physics, electronics materials, and mechanics.
As regional sales manager, Belfield is responsible for maintaining existing sales and driving new qualifications and sales through effective account management and coordination of resources in the Northeast Americas region. She joined Indium Corporation in 2020 as a Technical Support Engineer where she provided technical assistance to resolve soldering process-related issues. Belfield earned a bachelor’s degree in chemical engineering at Syracuse University. Currently VP of Membership, she has served as an officer for SMTA Empire Chapter for two years.
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