LAKEVILLE, MN – ITW EAE announces a new partnership agreement with eBerian Assembly for Spain and Portugal to represent ITW EAE per June 1, 2023. The representation involves the full portfolio of ITW EAE equipment; MPM printers, Camalot dispensers, Vitronics Soltec wave, reflow and selective equipment plus Electrovert soldering solutions and cleaners.

“eBerian Assembly brings superior knowledge and experience in electronics assembly equipment to the market,” said Wim Schouten, Sales Manager for ITW EAE. “We are very fortunate to have this first-class, technically experienced team representing the full range of ITW EAE’s equipment. The eBerian Assembly team has serviceability as their primary focus and can be counted on to serve all our customers well.”

“We’re very pleased to represent ITW EAE throughout Spain and Portugal” said Carlos Olmos CEO of eBerian Assembly. “ITW EAE is a pioneer in electronics assembly equipment with a reputation for cutting edge technology combined with quality manufacturing and service support. We look forward to representing these high-quality products.”

eBerian Assembly team specializes in knowledge and distribution for the electronics manufacturing industry. They will be responsible for sales, service, and parts for MPM printers, Camalot dispensers, Vitronics Soltec wave, reflow and selective equipment, and Electrovert soldering solutions and cleaners, serviced from eBerian Assembly office located in Barcelona Spain.

PENANG, MALAYSIA – ViTrox Technologies is excited to announce that our V310i Advanced 3D Solder Paste Inspection (SPI) Solution has officially passed the rigorous qualification audit for IPC-CFX-2591 Qualified Products Listing (QPL) and has received the mandatory IPC-CFX messages for classification.

This certification is a significant achievement for ViTrox and showcases the company's commitment to innovation and excellence in the electronics manufacturing industry. The V310i 3D SPI's listing on the IPC-CFX QPL shows that ViTrox's solution is fully compatible with the IPC-CFX-2591 standards, giving electronics manufacturers and Original Equipment Manufacturers (OEMs) the confidence to partner with us.

Our state-of-the-art V310i 3D SPI technology has unique features that set it apart from the competition. Our Artificial Intelligence (A.I.) Missing Detection significantly enhances users' experiences when detecting absent and insufficient solder with the integration of A.I. This feature is incredibly accurate and improves overall efficiency. Our effortless Inspection Parameter Setup allows users to export custom parameters fast for future usage, ensuring compliance with IPC standards. This feature streamlines inspection setups, making them more accessible and user-friendly. Lastly, our Ultra Smart Programming feature is a game-changer, reducing programming time by around 80%. The advanced programming algorithm in the ViTrox SPI Software (VAPIGUI) creates a fast, effortless, and easy-to-pick-up programming process for our users, making the V310i 3D SPI an excellent choice for anyone in the SMT PCBA industry.

Asides from the IPC-CFX standard, ViTrox's Industry 4.0 Manufacturing Intelligence Solution (V- ONE) provides Machine-2-Machine (M2M) connectivity and big data analytical capabilities for users to monitor production performance using real-time production process insights and data analysis with image traceability across ViTrox vision solutions. With V-ONE, manufacturers can have a strategic approach to oversee the production process, minimise production downtime, and improve production efficiency.

We are proud to continue developing innovative solutions with M2M connectivity to match the ever-changing demands of the electronics manufacturing industry, moving further into the era of Smart Manufacturing. Hence, ViTrox is actively collaborating with IPC to validate its PCB SMT Vision Inspection Solutions for the IPC CFX QPL. You can also find our validated solutions, the V510i Advanced 3D Optical Inspection (AOI) Solution and V810i Advanced 3D X-Ray Inspection (AXI) Solution, on the IPC-CFX-2591 QPL Portal at https://certification.connectedfactoryexchange.com/certification-directory 

Are you interested in implementing IPC-CFX compliant vision inspection solution to achieve Smart Factory? Contact us today at enquiry@vitrox.com for more information and assistance.

NORTH BILLERICA, MA – BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, will exhibit at the SMTA Capital Expo & Tech Forum, scheduled to take place Tuesday, May 23, 2023 at the Johns Hopkins Applied Physics Laboratory Kossiakoff Center. Attendees can learn all about BTU’s reflow ovens, Profile Tracer and the all-new Aurora platform.

“2023 has already been a big year for product development at BTU,” said Bob Bouchard, director of sales and marketing for BTU. “Earlier this year we launched the Profile Tracer and we have just returned from the launch of our new reflow platform, the Aurora, in Germany.  I’m looking forward to bringing our customers up to date at the SMTA Expo.”

BTU will feature its new, award-winning Profile Tracer, a next-generation thermal profiling tool providing real-time data acquisition for oven optimization by identifying inconsistencies due to temperature variation at both the product level and at the heat source.

With 6, 8, 10, and 12 zone air or nitrogen models, flexible platform configuration and low nitrogen and power consumption, the PYRAMAX family of convection reflow ovens the industry’s best value. The BTU team also will discuss its newest development – the Aurora platform. Using the combination of newly integrated process control technologies and innovative Wincon 8 reflow oven control software, Aurora provides the ultimate in thermal process performance.

To learn more visit www.btu.com 

AUSTIN, TX – TechSearch International’s latest analysis explains the tough year ahead for semiconductor companies, OSATs, and foundries after the record highs from the Covid-induced spending spree. Market forecasts for Ball Grid Arrays (BGAs) and Chip Scaled Packages (CSPs) are provided in units. The CSP market is divided into laminate (FBGA and FLGA) and leadframe (QFN) substrates. Stacked die package trends are included. Unit growth projections for Cu clip and molded interconnect substrates (MIS) are provided. Package examples and demand drivers are included. TechSearch International analyzes the supply and demand for build-up substrates used for flip chip BGAs and the excess capacity expected resulting from declining demand and inventory. The report includes OSAT financials and examines economic trends impacting the industry with an analysis of CAPEX plans for the year.

Automotive electronics and especially electric vehicles (EVs) are a bright spot. Increased adoption for SiC and GaN in applications including EVs and charging stations, renewable energy, fast charging for mobile devices, and power suppliers are driving demand for legacy packages such as TOs and power modules for SiC and DFNs and QFNs for GaN. Embedded die packages are playing an increased role. With strong growth in China’s EV industry, the country is well positioned with the infrastructure to support the expansion.

The latest Advanced Packaging Update is a 100-page report with full references and an accompanying set of more than 90 PowerPoint slides.