TORRANCE, CA – Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is excited to announce an upcoming SMTA Technical Webinar titled "Effectiveness of Strain Gage Methodology for Durable Board Design." The webinar will be presented by Seika Machinery’s principal, James Hara, Principal at Kyowa Electronic Instruments Co., Ltd.

The webinar is scheduled to take place on Tuesday, Sept. 12th, 2023, from 1-2 p.m. Eastern Time. Mr. Hara, a renowned expert in the field of mechanical test and measurement, will delve into the crucial topic of ensuring the mechanical endurance and durability of printed circuit boards (PCBs) in challenging environments.

Printed circuit boards used in applications such as automobiles, commercial vehicles, and electronics are exposed to demanding conditions that require exceptional mechanical endurance. Even the slightest crack or failure in these boards can lead to the overall failure of electronic systems. To prevent such failures and achieve long-term stability, suppliers must assess and understand the mechanical strain and stress levels, identifying critical and high-risk points for potential breakage with stress concentration.

Hara will draw on his nearly 10 years of experience working with Kyowa Electronic Instruments Co., Ltd. and Kyowa Americas Inc. to explore the effectiveness of the strain gage methodology for designing durable and resilient PCBs. The webinar will feature specific case studies that highlight the benefits and real-world applications of this methodology.

Hara has established himself as a leading expert in mechanical test and measurement. Over the past decade, he has provided technical support to industrial engineers using Kyowa's cutting-edge strain gages, signal transducers, and data acquisition technology in various applications. Based in the Michigan area, Hara currently serves as a sales engineer, offering his expertise to support test and measurement projects in both academic and industrial institutions across North America.

Seika Machinery invites professionals in the manufacturing industry to join this insightful webinar and gain valuable insights into ensuring the durability and reliability of printed circuit boards. Registration for the webinar is now open, and participants can reserve their spots by visiting the SMTA website.

For more information, contact Michelle Ogihara at 310-540-7310; e-mail michelle@seikausa.com; or visit www.seikausa.com

DERRY, NH – StenTech® Inc., the leading multinational SMT Printing Solutions company, is excited to announce its participation at SMTA Chihuahua, taking place on Thursday, Sept. 7, 2023 at the Sheraton Chihuahua Soberano. The company will exhibit its highly acclaimed Advanced Nano Coating and showcasing its complete product line of various stencils and tooling.

As electronic packaging continues to push the boundaries of miniaturization, the challenge of achieving precise solder paste deposition and meeting evolving IPC requirements remains ever- present. StenTech's award-winning Advanced Nano Coating provides a groundbreaking solution to this challenge. This highly unique 1-3 um hardened nano coating, applied to the bottom side and inside the apertures of the stencil, offers exceptional anti-adhesion properties, effectively repelling solder flux and ensuring increased transfer of paste.

With StenTech's Advanced Nano Coating, transfer efficiency can be boosted by up to 25 percent, resulting in a significant reduction of bridging and paste-related defects. The "non-stick" characteristics of the coating also lead to reduced underside cleaning, contributing to improved yields and reduced expenses on rework and touch-up. Additionally, stencils coated with Advanced Nano are ready for use in just 30 minutes after coating, enhancing production efficiency and minimizing downtime.

StenTech's legacy of pioneering stencil technology, including the introduction of Fiber Diode lasers into North America, has firmly established the company as an industry leader. With a team of over 30 experienced CAD designers, StenTech provides unparalleled support in stencil modifications, material recommendations, and thickness specifications, ensuring optimized stencil solutions for every application.

At the SMTA Chihuahua expo, visitors to the StenTech booth will have the opportunity to explore the full range of stencil technology offerings, custom-tailored to meet specific manufacturing needs in the SMT industry. The company's dedication to innovation and customer satisfaction makes StenTech a trusted partner for companies seeking cutting-edge solutions to their electronic packaging challenges.

To learn more, visit www.StenTech.com 

DULUTH, GA – Viscom Inc., the US subsidiary of Viscom AG, Germany, will be exhibiting at the SMTA International 2023 Expo in Minneapolis, MN, October 10–11, in Booth No. 1413. Viscom experts will be on hand to answer questions and offer manufacturing solutions on their wide range of award-winning AOI/AXI/MXI inspection systems.

Viscom offers 3D SPI, 3D AOI, 3D AXI, and 3D MXI systems for inspection of densely packed printed circuit boards as well as components such as IGBT modules in power electronics. Visitors can also learn more about the latest software developments at Viscom, such as AI-assisted verification and inspection program generation. Juan Briceno, Vice President of Sales Viscom Inc., states: “SMTA International is a very important exhibition for us. Decision makers, industry experts and other key manufacturing players with very different backgrounds are present and we look forward to showcasing our inspection solutions.”

The booth staff can advise on how Viscom inspection systems combine outstanding performance with high throughput – plus modern networking solutions such as IPC HERMES 9852 or IPC CFX, as well as new condition monitoring and AI applications.

CHENNAI, INDIA – Syrma SGS Technology Limited informed that the Board of Directors of the Company have considered and approved August 24, 2023, appointment of Mr. Satendra Singh as Chief Executive Officer (CEO) of the Company with immediate effect. Mr. Satendra Singh is appointed as Chief Executive Officer (CEO) effective August 24, 2023. This is an important addition to Company's management team and in line with the strategic plans that the Company had envisaged.

Mr. Satendra has over three decades of experience in operations, strategic planning, global supply chain, and manufacturing. Before joining us, he was associated with Nokia, Helsinki, where he was heading global Hardware Service Delivery. At Nokia, in earlier assignments, Mr. Satendra provided leadership to global supply network strategy, supply chain, operations, and business development.

He was also instrumental in setting up manufacturing operations in India. He was earlier associated with Flex International (`Flex') as Director Operations and has garnered deep knowledge of Indian and global industry during his stint there. Mr. Satendra holds a master's degree in MS Manufacturing Management from BITS Pilani, and has completed advanced management program from IIM Bangalore, and Transformational Leadership executive program from Harvard Business School, Exec.