OLDHAM, UK – With just four weeks remaining until the highly anticipated IPC Apex Expo 2024, Solderstar, a leading supplier of temperature profiling equipment for soldering processes, is gearing up to unveil its latest innovations. From April 9th to 11th, at Booth 2538 in Anaheim, California, Solderstar will introduce the newly launched Reflow Shuttle with O2 measurement module. This product promises to redefine soldering process optimization, offering manufacturers unparalleled control and precision.

The Reflow Shuttle O2 stands as a ground-breaking advancement in soldering process verification. It represents the first tool to integrate real-time oxygen (O2) measurement in parts per million (ppm), vibration levels in three axes, vacuum reading, temperature profiles, and conveyor speed onto a single platform. This consolidation of critical parameters helps manufacturers make informed decisions and optimize their reflow soldering processes with accuracy.

"Reflow soldering demands precision and control," said Mark Stansfield, CEO of Solderstar. "The Reflow Shuttle with O2 measurement module delivers detailed insights into critical parameters, equipping manufacturers with the tools needed for informed decision-making and process optimization.

“By consolidating measurement systems onto a single, robust platform, we're providing manufacturers with the knowledge to enhance quality and efficiency in their soldering operations with a single pass through the machine. We look forward to demonstrating this innovative solution at IPC Apex Expo and highlighting how it can benefit attendees' manufacturing processes."

Precise control over O2 levels is paramount in electronics manufacturing, as it directly impacts solder joint quality. The Reflow Shuttle O2 enables detailed monitoring of oxygen levels within each zone, allowing manufacturers to quantify nitrogen consumption and detect process issues quickly.

The Reflow Shuttle O2, with its seamless integration into existing reflow ovens, minimizes downtime during verification procedures while boasting a user-friendly interface that simplifies data collection for operators, facilitating prompt adjustments in case of anomalies. Its versatile design, with a specially engineered battery pack and Smartlink connector ensures continuous verification across multiple production lines without interruption. Importantly, the module allows for zone-by-zone analysis of oxygen levels throughout the reflow process. This provides manufacturers with granular insight to monitor oxygen content precisely and detect nitrogen leaks, thereby optimizing nitrogen consumption and maintaining process quality.

In addition to the Reflow Shuttle with O2 measurement module, Solderstar will feature its zero set-up SLX thermal profiler at the booth. The innovative SLX thermal profiler is designed to capture and analyze temperature profiles in various soldering processes.

Recognized for its accuracy and compact design, the SLX offers comprehensive data capture capabilities, further enhancing process control and product quality. It automatically detects connected test adapters and intelligently auto-configures the information, eliminating the need for manual set-up and saving valuable time.

Attendees are invited to visit Booth 2538 at IPC Apex Expo 2024 in Anaheim, California, to see the Reflow Shuttle O2 measurement module in action and explore Solderstar’s latest profiling equipment for reflow, wave, vapor, and selective soldering, including the zero set-up SLX.

REDDITCH, UK – In today's rapidly advancing electronics manufacturing landscape, achieving zero defects and maintaining stringent quality control standards throughout production processes are paramount. The precision alignment and attachment of components, particularly with flex circuits, can pose significant challenges that demand innovative solutions.

Recognising the need for precision and repeatability in electronics production, May & Scofield, designer and manufacturer of electronic controls and systems, turned to Altus Group, a leading capital equipment distributor in the UK and Ireland. Faced with challenges in their existing manual soldering methods, they sought a solution capable of meeting the stringent requirements for accuracy and consistency integral to their operations.

For May & Scofield's customer, zero hand soldering was mandatory. "We had an extremely challenging application of precisely attaching flexi circuits to rigid PCBs, where manual soldering was not permitted by our prestige automotive customer," said Nuno Goncalves, May & Scofield Production Manager.

After reviewing the challenge, Altus recommended Promation's Quick 9434 robotic soldering platform as the ideal solution. The Quick 9434 features a 4-axis configuration with a teach pendant for intuitive programming. It utilises Promation’s advanced hot iron system, rapidly achieving temperatures up to 500°C. A closed-loop sensor enables exceptional thermal stability and accuracy with the solder wire feeder, utilising fine-toothed gears to feed and perforate solder. This maximizes flux core outgassing to minimize solder splashing for optimum quality.

Joe Booth, CEO of Altus Group said: "We're pleased to have assisted May & Scofield with advanced technology to enhance their manufacturing processes. The Promation Quick 9434 has made a difference in their production, providing precision and reliability in their soldering process.

“With minimal operator involvement, it streamlines operations while optimising resources. May & Scofield's successful adoption of the Quick 9434 demonstrates its effectiveness in overcoming manual limitations, ensuring consistent, high-quality results."

By successfully implementing Promation's Quick 9434 system, May & Scofield has automated the delicate process of flex circuit soldering, effectively addressing their complex manufacturing challenge. The system's advanced technology and precision control capabilities have overcome the limitations of manual soldering, efficiently handling fragile components. Its advanced programming and process monitoring also ensure reliable and repeatable solder joint quality.

HARRISBURG, PA – Cumberland Electronics Strategic Supply Solutions (CE3S), a leading provider of quality goods and services, proudly announces the establishment of its newest distribution center in Orlando, Florida. This strategic expansion reflects the company’s dedication to serving the Florida market and enhancing its service offerings to valued customers in the region.

With a strong presence and clientele in Florida for many years, CE3S recognized the need to bolster its support infrastructure with a physical distribution and warehouse location. This decision aligns with CE3S's commitment to delivering exceptional service and convenience to its customers, particularly those under Vendor Managed Inventory (VMI) arrangements.

"This expansion represents a significant milestone for CE3S as we continue to prioritize the needs of our customers in the Florida market," said Jeremy Wagner - President/CEO at CE3S. "Establishing a distribution center in Orlando emphasizes our dedication to providing efficient and personalized service to our clients.”

Leading the operations at the new Orlando distribution center is Dave Fields, who joined CE3S last year. Fields brings extensive industry experience and a deep understanding of the Florida market, making him well- suited to oversee sales, support efforts, and operational management in the region.

"This facility marks our first warehouse location in Florida, complementing our existing offices in Harrisburg, PA, and Maryland," added Wagner. "The central location of our Orlando distribution center enables us to better serve our customers across the state, offering locally-stocked inventory and personalized service tailored to their specific needs."

CE3S's commitment to delivering a superior customer experience extends beyond its product offerings. The new distribution center in Orlando signifies the company's dedication to providing convenient access to high-quality electronics manufacturing solutions and fostering long-term partnerships with its customers.

For more information about CE3S, please visit www.ce3s.com 

WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer regarding President Biden’s State of the Union address.

“During tonight’s State of the Union address, President Biden highlighted the initial progress made in implementing the landmark CHIPS and Science Act, which is on track to greatly strengthen America’s economy, national security, and semiconductor supply chains. The Commerce Department has taken important early steps to advance CHIPS manufacturing incentives and research investments, and we look forward to seeing continued headway in the weeks and months ahead.

“Companies in the semiconductor ecosystem have announced 80 new manufacturing projects in the U.S. since CHIPS was first introduced in Congress, totaling more than $250 billion in private investments across 22 states. These projects are projected to create 45,000 direct jobs and support hundreds of thousands of additional jobs throughout the U.S. economy.

“We commend President Biden and bipartisan leaders in Congress for their longstanding efforts in support of the CHIPS Act and urge the administration to continue implementing CHIPS in an effective and expeditious manner. We also call on leaders in Washington to enact policies that will grow the STEM talent pipeline, promote U.S. technology leadership, and maintain access to global markets.

“These policies will help ensure the CHIPS Act delivers maximum benefits for U.S. semiconductor production and innovation while also promoting America’s long-term economic and national security.”