Press Releases
DALLAS, TX – StenTech® Inc., a leading global company specializing in SMT Printing Solutions, is excited to announce its participation at the SMTA Querétaro Expo & Tech Forum on Thursday, June 6, 2024. The company's local team in Mexico will be present to discuss the advanced StenTech BluPrint™ PVD (Physical Vapor Deposited) Surface Treatment, engineered to enhance SMT processes, improve stencil performance and longevity, and streamline production.
The BluPrint™ PVD Surface Treatment is designed to address the challenges of shrinking components and circuit boards in solder paste printing with laser-cut stainless-steel stencils. Meticulously developed to meet the intricate requirements of the semiconductor and EMS industry, StenTech BluPrint™ PVD has established itself as the premier choice in North America for evolving SMT demands.
Key Benefits:
- Consistent Thickness: Ensures uniform printing with a coating that remains resilient without degradation.
- Virtually Indestructible Coating: Outperforms traditional coatings, maintaining integrity and reducing maintenance costs.
- Enhanced Transfer Efficiency: The process applies the coating at approximately 1000 times less thickness compared to current alternatives, ensuring superior performance, especially in high-volume builds.
- Plasma Polishing: Initiates with plasma polishing to create smooth, high-gloss surfaces with enhanced corrosion resistance.
The revolutionary BluPrint™ process begins with plasma polishing to yield smooth, high-gloss surfaces, followed by the physical vapor deposition process which applies a thin film of material onto the substrate. This method results in a consistent, indestructible coating that significantly enhances transfer efficiency and stencil performance, outperforming nano-coatings.
StenTech BluPrint™ sets a new standard for stencil coating technology, offering unmatched performance, longevity, and cost-effectiveness for the SMT industry. Its innovative approach ensures reliable, uniform printing while reducing maintenance and replacement costs associated with traditional coatings.
Visit us at the Querétaro Expo & Tech Forum to learn more about how StenTech BluPrint™ PVD Surface Treatment can elevate your SMT processes. Our local team in Mexico is eager to discuss how our advanced coating can streamline your production and enhance the quality of your SMT assembly process.
BROMONT, CANADA – Cogiscan, a leading connectivity and TTC solution provider for the electronics manufacturing industry, is pleased to announce that SolarEdge Technologies selected Cogiscan’s comprehensive machine connectivity platform and Track Trace Control (TTC) solution, as part of its ongoing digital transformation initiative for manufacturing operations.
As a global leader in smart energy technology, SolarEdge designs, builds, and manufactures photovoltaic (PV) inverters for a broad range of energy sectors. As part of its broader and ongoing quality enhancement initiatives, SolarEdge strives to better monitor, control, and improve manufacturing operations across all plants, including EMS partners, emphasizing how quality is paramount to the organization.
The Cogiscan installation included data collection and contextualization from all machines, enhanced material and process control on the line, traceability reporting of the production process, as well as factory performance visualization dashboards.
With the capability to integrate with existing systems and gather data in mixed vendor environments, the Cogiscan platform is ideally suited for deployment at partner manufacturing sites in both the Americas and Asia.
Dan Ilani, Senior Director of Global Manufacturing Technologies and Operations Excellence at SolarEdge commented, “This is part of our long-term strategic initiative to optimize the efficiency of our supply chain. As a world leading technology provider, we strive to build our products in strict adherence with their specifications in all our manufacturing facilities around the globe. While traditional inspections and testing are effective to a certain extent, there is a crucial need to monitor and control the process in real-time, using smart manufacturing technology.”
“We selected Cogiscan because of their expertise in the electronics industry and the modularity and flexibility of their Track, Trace Control (TTC) platform that has the ability to co-exist and integrate with various MES that are already implemented by our EMS partners,” added Roy Rosenstreich, Lead of Battery Space – R&D Department at SolarEdge.
AUBURN HILLS, MI – The Murray Percival Company, the premier manufacturer’s rep in the Midwest and one of the longest tenured distributors in the electronics industry, is pleased to announce the recent sale of the advanced MIRTEC MV-6 Automated Optical Inspection (AOI) machine to Odyssey Electronics. This strategic investment, facilitated by Matt Percival, underscores Odyssey's commitment to leveraging cutting-edge technology to improve process efficiency and product quality for their end customers.
For nearly 16 years, Odyssey Electronics has navigated the challenges of 2D AOI systems, seeking a solution that marries user-friendliness with high-speed inspections while addressing inherent limitations. The MIRTEC MV-6 represents a pivotal advancement, offering an intuitive interface, rapid setup, and groundbreaking 3D inspection capabilities that significantly enhance defect detection and SMT manufacturing processes.
Kristopher K. Blomgren, AOI Inspections Director at Odyssey Electronics, reflects on the decision to choose the MIRTEC MV-6, highlighting the role of The Murray Percival Company in the selection process: "Our journey to improve our AOI capabilities led us to the MIRTEC MV-6, a decision greatly influenced by the expertise and support of Matt Percival and The Murray Percival Company. Their understanding of our process challenges and their hands-on approach in demonstrating the MV-6's capabilities directly addressed our needs. This investment not only streamlines our inspection workflows but also directly benefits our end customers by ensuring higher quality and reliability in our products. The Murray Percival Company has been instrumental in helping us enhance our process, ultimately allowing us to invest more effectively in technology that supports our commitment to quality and efficiency."
This acquisition is a testament to Odyssey Electronics' dedication to adopting technologies that meet the increasing demands of the electronics industry. By integrating the MIRTEC MV-6 into their PCB assembly process, Odyssey Electronics is setting a new standard for quality and efficiency, ensuring that they remain at the forefront of the industry and continue to deliver exceptional value to their clients.
The partnership with The Murray Percival Company highlights a shared commitment to providing customer-focused solutions that drive success. This collaboration is a prime example of how strategic investments in technology can create tangible improvements in manufacturing processes, benefiting not just the company but also their end customers.
Odyssey Electronics invites industry partners and clients to witness firsthand the improvements and efficiencies gained from the MIRTEC MV-6 AOI machine, reaffirming their position as a technology- driven leader in the PCB assembly services sector.
For further inquiries or to explore how The Murray Percival Company can address your PCB supply needs, please visit www.murraypercival.com
CRANSTON, RI – AIM Solder, a leader in delivering innovative solder assembly materials, is thrilled to announce a new distribution partnership with EIS, North America’s leading specialty distributor and fabricator of electrical and electronic process materials. This partnership is set to significantly enhance AIM Solder’s distribution network in Mexico, providing extensive access to our superior solder products through EIS’s well-established channels.
Founded in 1946, EIS has grown from a small family-owned business in Atlanta, GA, to a powerhouse in distributing, converting, and fabricating essential materials for the electrical and electronic industries. With over 900 dedicated employees and more than 25 facilities across North America, EIS brings a wealth of experience and a robust infrastructure to this partnership.
“This collaboration with EIS underscores our commitment to serving the electronics industry in Mexico,” said David Suraski, Executive Vice President, AMD at AIM Solder. “Together with EIS, we are set to deliver unparalleled product availability and technical support, fulfilling the growing demands of our customers in this important region.”
EIS is committed to top-tier results for all stakeholders, driven by a mission to serve its broad customer base with a focus on innovation, quality, and sustainability—values that align closely with AIM Solder’s vision. The partnership is expected to leverage both companies' strengths in supply chain efficiency and technical expertise.
Sypris Appoints Michael D. Sedgwick as Vice President and General Manager of Sypris Electronics, LLC
LOUISVILLE, KY – Sypris Solutions, Inc. (Nasdaq/GM: SYPR) announced today the appointment of Michael D. Sedgwick to the position of Vice President and General Manager of Sypris Electronics, LLC, effective June 3, 2024. Mr. Sedgwick will operate from the Company’s headquarters located in Tampa, Florida and will report to Jeffrey T. Gill, Chairman, President and Chief Executive Officer of Sypris Solutions, Inc.
Mr. Sedgwick will be joining Sypris following a successful career with SCI Technology, Inc., a division of Sanmina Corporation, where he most recently served as the Vice President of Defense and Aerospace Products and was responsible for the company’s product portfolio and electronics manufacturing services with annual sales in excess of $180 million per year.
Prior to his last assignment with SCI Technology, Inc., Mr. Sedgwick served in a number of increasingly responsible senior-level positions with I3, Abaco Systems Inc. and AAR Corporation. Mr. Sedgwick began his career with SCI Technology, Inc. in 2007 as its Senior Program Manager for the Defense and Aerospace Division, and as Director of Aircraft Systems from 2010 to 2014.
From 2005 to 2007, Mr. Sedgwick served in the U.S. Army as a Battalion Intelligence Officer (S-2) for the 10th Special Forces Group (Airborne) operating in Iraq. From 2001-2005, Mr. Sedgwick served as an Infantry Officer for the 82nd Airborne Division in Afghanistan and Iraq, where he conducted over 100 combat patrols. Since 2007, he has continued to serve as a member of the U.S. Army Reserve.
Mr. Sedgwick’s breadth of experience includes leading business segments serving the U.S. Department of Defense, prime government contractors, and the commercial aerospace market with responsibility over IR&D, Business Development, Sales and Marketing, and Project and Program Management.
Commenting on the announcement, Jeffrey T. Gill, Chairman, President and Chief Executive Officer of Sypris Solutions, said, “We are very pleased to announce the addition of Mike to the Sypris team. His extensive experience, industry knowledge and successful track record will be invaluable in the continued development of Sypris Electronics into a larger, increasingly profitable company.”
Sypris Solutions is a diversified manufacturing and engineering services company serving the defense, transportation, communications, and energy industries. For more information about Sypris Solutions, visit its Web site at www.sypris.com
HANOVER, GERMANY – Viscom AG, a global leader in automated optical inspection, X-ray inspection, and software solutions, is excited to announce its participation in SMTconnect 2024, taking place in Germany from June 11 to 13 at the Nuremberg Exhibition Grounds. For Viscom, this prestigious event is a key date in the year to showcase its most innovative inspection solutions designed to meet the evolving needs of electronics manufacturers worldwide.
At Booth 4A-145, Viscom will proudly present its 3D-AOI inspection flagship, the "iS6059 PCB Inspection Plus" renowned for its exceptional reliability and precision. This cutting-edge system offers manufacturers unmatched accuracy in defect detection, ensuring the highest standards of quality control throughout the production process. Additionally, visitors will have the opportunity to experience the lightning-fast performance of Viscom’s "iS6059 SPI" system, revolutionizing solder paste inspection with its speed and efficiency.
In a significant debut, Viscom will unveil the latest addition to its X-ray inspection lineup – the high-speed variant of the "iX7059" series. This advanced system sets a new benchmark for automatic X-ray inspection, offering companies enhanced throughput without compromising on inspection accuracy. With its state-of-the-art technology, the iX7059 high- speed variant empowers manufacturers to achieve optimal quality assurance in the most demanding production environments.
Furthermore, attendees can explore the all-new features of Viscom’s flagship software vVision which now integrates advanced AI capabilities, enabling more intelligent and efficient inspection processes. With vVision release 4.0, manufacturers can leverage AI-driven algorithms to enhance defect detection accuracy, streamline inspection workflows, and optimize production efficiency.
Viscom will also showcase the latest enhancements and redesign of its vConnect software suite, providing users with a new level of connectivity, flexibility, and usability. With its intuitive interface and advanced functionalities, vConnect offers seamless integration with Viscom’s inspection systems, enabling real-time data analysis, remote monitoring, and comprehensive quality management.
“We are thrilled to return to SMTconnect this year and to showcase our latest innovations in inspection technology,” said Carsten Salewski, Board Member of Viscom AG. “At Viscom, we are committed to pushing the boundaries of excellence in automated inspection solutions, and SMTconnect provides an ideal platform for us to demonstrate our capabilities and engage with industry professionals from around the world.”
Viscom’s participation in SMTconnect extends beyond its booth presence, with the company’s experts hosting informative sessions and technical presentations throughout the event. Visitors will have the opportunity to gain valuable insights into emerging trends, best practices, and the future of inspection technologies, further solidifying Viscom’s position as a thought leader in the industry.
“As the electronics manufacturing landscape continues to evolve, it is essential for manufacturers to stay ahead of the curve with advanced inspection solutions,” added Salewski. “At Viscom, we are committed to empowering our customers with the tools they need to achieve excellence in quality control and production efficiency.”
Viscom invites attendees to visit Booth 4A-145 at SMTconnect 2024 to discover firsthand how Viscom’s solutions can elevate their manufacturing processes to new heights of performance and quality.
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