CHANDLER, AZ – Isola Group brings the latest cost-effective, high-performance PCB material solutions for hybrid circuits to this year’s Del Mar Electronics & Manufacturing Show (DMEMS2023). With growing demand for miniaturization in electronic design, Isola’s materials support compact PCBs for RF/microwave (RF/MW), high-speed-digital (HSD), and power circuits with high efficiency and excellent thermal stability. The durable circuit materials share processing compatibility with general-purpose circuit materials such as FR-4 for ease of fabricating multilayer circuit solutions with a combination of circuit material types.

DMEMS2023 is set for the Del Mar Fairgrounds (San Diego, CA) on April 26-27, 2023, and features free admission, parking, and an abundance of educational seminars. Isola’s representatives are ready to share their years of experience and expertise on matching PCB materials to different mechanical and electrical circuit requirements. They will welcome DMEMS2023 visitors to booth #100 to learn more about their high-performance but “manufacturing-friendly” circuit materials, including TerraGreen ® 400G, Tachyon ® 100G, Astra® MT77, I-Tera ® MT40, IS550H, IS580G and IS680/IS680 AG laminates and prepregs. These temperature-stable circuit materials enable the fabrication of HSD circuits and high- frequency RF, MW, and millimeter-wave (mmWave) signals beyond 110 GHz on the same circuit board.

When the highest signal integrity must be maintained, TerraGreen ® 400G, Tachyon ® 100G, I- Tera ® MT40 and I-Speed® circuit materials support HSD circuits at rates up to and beyond 100 Gb/s. Visitors to the booth can learn more about the characteristics of each material and how they benefit some of the latest high-frequency/high-speed circuits for computing, automotive, aerospace and defense, robotics, space, and telecommunications applications. For applications requiring halogen-free materials, stop by the booth and ask about Isola’s latest offerings. IS550H is our halogen-free solution for high power & voltage applications with extreme thermal stability requirements. The TerraGreen® 400G family of laminates and prepregs provide a range of cost and high speed digital performance solutions up to 200Gb/s. IS580G is a halogen-free material with I-Speed-like electrical performance and optimized Z- axis CTE for thermal reliability.

For more information about any of these materials, please visit the Isola website at www.isola-group.com 

CLINTON, NY – The next episode of Indium Corporation’s free webcast series EV InSIDER Live, titled e-Mobility Batteries: The Next Frontier of Sustainability and the Circular Economy, is set to premier on Thursday, May 11, at 11:30 a.m. EST.

EV InSIDER Live is co-hosted by Indium Corporation’s Global Head of e-Mobility and Infrastructure, Brian O’Leary, and Loren McDonald, EV consultant and CEO of EVAdoption. It is conducted in a candid and conversational format suitable for business executives, casual observers, and seasoned engineers alike.

The upcoming session, featuring special guest Oliver Gross, Global Director of Energy Services – Electrification and EV Operations at Stellantis, will explore a range of topics including:

• The role of automakers in the future, including the circular economy. Will automakers follow Tesla's lead and compete in both the electric vehicle and energy spaces? Gross will outline his idea for the Energy Internet of Things (EIoT), vehicle to grid opportunities, and the interplay with microgrids and virtual power plants.
• The latest developments in battery technology and chemistry that could significantly extend the life of EV batteries. Hosts will examine the likely “high/low” bi-furcation of battery chemistries for low-range and long-range EV applications. Which approach will win out in the end: recycling or repurposing batteries in second-life applications? How will bi-directional charging affect battery life? Is the 70%-80% energy capacity rule of thumb for EV end-of-life the right metric, or do we need to think differently about battery lifespans?
• How will government action impact supply chains? What effect will the recent Clean Vehicle Credit (CVC) battery cell requirement have moving forward? Will EV battery production be akin to the New Deal in the U.S.? What about the politics and challenges of producing battery cells, primarily with Asian partners? How will regional regulations impact the powertrain and battery strategies of automakers?

“Season two of EV InSIDER Live got off to a great start in April with a timely examination of EV fast chargers,” said O’Leary. “Loren and I are now looking forward to welcoming a battery expert like Mr. Gross and, together, exploring the exciting challenges and opportunities that lie ahead.”

Click here to register for the upcoming episode or, optionally, register for all upcoming season two episodes. All sessions will be made available for on-demand viewing afterward. EV InSIDER Live is driven by Indium Corporation.

SAN DIEGO, CA – Intraratio, a provider of enterprise software solutions, announced today that it will be exhibiting at the Surface Mount Technology Association (SMTA) Juarez Expo. The event will be held Thursday, May 19, 2023 at the Polanco Complex - Hall A (Convention Center) in Juarez, Mexico. Intraratio will discuss its integrated Manufacturing Execution System & Quality Data Management platform for real-time automated operations traceability and quality control.

With a transaction-based pricing model, Intraratio is able to serve Startups to Global Tier 1. The company delivers an infrastructure capability and advantage previously exclusive only to large organizations.

Backed by more than 30 years of global high-tech engineering and manufacturing experience, the Intraratio platform breaks the accessibility and integration limitations of existing software systems – putting data-driven innovation and improvements at the fingertips of those who are passionate about operational excellence.

Intraratio provides enterprise software solutions to automate traceability and quality control of advanced electronics product manufacturing. The company serves the high-performance computing, automotive, space military, and medical device markets. Deployed globally, Intraratio’s platforms bring true visibility and scale to manufacturing operations anywhere. For more information about Intraratio, visit www.intraratio.com

LYON, FRANCE – Overall memory packaging revenue is estimated to have been US$15.1 billion in 2022, excluding testing. This corresponds to around 10% of overall stand-alone memory revenue, around US$144 billion in 2022. Yole Intelligence, part of Yole Group, forecasts that revenue will reach US$31.8 billion in 2028 with a CAGR22-28 of 13%.

According to Thibault Grossi, Senior Technology and Market Analyst, Semiconductor & Software Division at Yole Intelligence: “In terms of packaging revenue, DRAM will grow with a CAGR22-28 around 13% while NAND will grow faster, with a CAGR22-28 of 17%. Other memory technologies, such as NOR Flash, EEPROM, SRAM, and emerging NVM, are forecasted to grow with a CAGR22-28 of around 3%.”

AP has become a key enabler of technological progress for NAND and DRAM. Among the different AP approaches, hybrid bonding has emerged as the most promising solution to manufacture higher bit density and higher-performance memory devices.

Whether its use is intended to enable higher performance or smaller form factors, advanced packaging is an increasingly important factor in the memory value equation. From representing about 47% of memory packaging revenue in 2022, AP will represent 77% by 2028.

In this context, Yole Intelligence releases its new product: Memory Packaging 2023 report. In this study, the company – part of Yole Group – presents an overview of the semiconductor memory market, provides an understanding of memory packaging technologies and markets, and offers market forecasts for memory packaging. This report also describes the memory packaging business and delineates and analyzes the competitive landscape.

Wire-bond is the dominant packaging approach. It is widely used for mobile memory and storage applications, followed by flip-chip packaging, which continues expanding in the DRAM market.

The adoption of flip-chip packaging with short interconnects is essential to enable high bandwidths per pin. While wire-bond packaging may still meet DDR 5 performance requirements, analysts expect flip-chip packaging to become a must-have for DDR6.

Leadframe remains widely used for NOR Flash and other memory technologies and is the package with the highest volume of unit shipments.

WLCSP is being increasingly adopted for consumer/wearable applications requiring small form factors, such as True Wireless Stereo earbuds. It is found in low-density memory devices such as NOR Flash, EEPROM, and SLC NAND.