DALLAS – CalcuQuote, a supply chain solution provider for the electronics industry, is pleased to announce that Dorigo Systems, a leading provider of electronic manufacturing services (EMS) based in Burnaby, BC, Canada, has chosen the QuoteCQ RFQ Management System to upgrade its quote process. This collaboration brings enhanced efficiency and optimization to the quoting process at Dorigo.

The implementation of QuoteCQ marks a significant step forward for Dorigo Systems, as the EMS provider continues to prioritize technological advancements and superior customer service as it drives forward in being part of something extraordinary. With CalcuQuote's robust quoting solution, Dorigo aims to streamline its quoting process, improve accuracy, reduce turnaround time, and ultimately deliver exceptional value to its clients.

QuoteCQ is a comprehensive quote management platform that empowers EMS companies to efficiently manage and respond to customer quote requests. By automating various aspects of the quoting process, such as component costing, labor estimation, and pricing, QuoteCQ enables EMS providers to generate accurate quotes in a fraction of the time, enhancing responsiveness and competitiveness.

"Dorigo Systems is committed to delivering outstanding value and service to our customers," said Kin Leong, IS/IT Manager of Dorigo Systems. "The adoption of CalcuQuote at Dorigo is a proactive step to optimize our quoting process. This integration allows us to respond faster to customer inquiries, provide customers with better clarity with the supply chain, and further strengthen our position as a trusted EMS provider."

"We are excited to partner with Dorigo Systems and support their commitment to innovation and customer satisfaction," stated Chintan Sutaria, CEO of CalcuQuote. "Like all of the software products we build, QuoteCQ is designed to improve speed, accuracy and efficiency with a nuanced understanding of an electronics manufacturing company’s processes."

RONKONKOMA, NY – Surf-Tech Manufacturing Corp., a multi- faceted provider of contract manufacturing services, is pleased to announce that it has invested in PVA’s Delta 8 Selective Conformal Coating Machine with 5th Axis Tilt capability. This acquisition represents Surf-Tech's commitment to delivering exceptional quality and expanding its capabilities in selective conformal coating, potting, bead and meter-mix dispensing applications.

The Delta 8 Selective Conformal Coating Machine is renowned for its versatility and flexibility. It is designed to handle a wide range of assembly applications, making it an ideal choice for Surf-Tech's diverse manufacturing needs. With numerous options and integrated features, including robotic system repeatability of +/-25 microns and the ability to accommodate multiple dispensing applications or materials in one cell, the Delta 8 offers enhanced precision and efficiency.

One of the standout features of the Delta 8 unit is the 5th Axis Tilt capability. This motorized programmable tilt allows the machine to adjust to any angle between -50 degrees to 50 degrees. The flexibility of this feature ensures greater accessibility to parts, enabling more accurate dispense and spray processes. By leveraging the Delta 8's 5th Axis Tilt, Surf-Tech can achieve superior results and meet the highest standards of quality.

"We are excited about the acquisition of the Delta 8 unit from PVA," said Stephen Eggart, President of Surf-Tech Manufacturing. "The Delta 8's flexibility, precision, and integrated features will enable us to provide our clients with even more efficient and reliable manufacturing solutions. By continuously investing in cutting-edge technology and equipment, we aim to maintain our position as a trusted partner for our clients, offering comprehensive and high- quality manufacturing solutions."

Surf-Tech Manufacturing Corp. has built a solid reputation as a multi-faceted provider of contract manufacturing services, serving a wide range of industries. With this strategic investment in the Delta 8 unit, Surf-Tech is well-equipped to address the evolving needs of its customers and deliver superior results across various manufacturing applications.

Surf-Tech is IPC, ITAR registered and ISO 9001 certified. Personnel are certified to various applicable standards including IPC-A-610 (Acceptability of Electronic Assemblies) and J-STD- 001 (requirements for Soldered Electrical and Electronic Assemblies). For more information, visit www.surftechmfg.com

MILPITAS, CA – Critical semiconductor industry topics will take center stage at SEMICON West 2023, opening tomorrow with leading CEOs gathering at the Moscone Center in San Francisco for the latest insights into industry growth opportunities, sustainability, and workforce development. The July 11-13 event, North America’s premier exhibition and conference for the microelectronics supply chain, will also feature presentations and executive panels on other key industry topics with thought leaders from the electronics design and manufacturing ecosystem, academia, and government.

Concurrent with SEMICON West at the Moscone Center, FLEX Conference 2023 will showcase flexible hybrid electronics innovations from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex.

Registration for both events is open.

SEMICON West 2023 Highlights

Before the show floor opens, each day of SEMICON West 2023 will kick off with CEO Summit presentations on Path to $1T, Path to Net Zero and Path for Talent.

Day 1 – July 11

CEO Summit: Path to $1T

• Welcome by Joe Stockunas, President of SEMI Americas, and opening remarks by Ajit Manocha, President and CEO of SEMI
• SEMI International Board Message – Axcelis Technologies
• Keynotes:
  • The Virtual Path to a Trillion-Dollar Reality – Lam Research
  • Keys to Creating $1T in Shared Value – Tokyo Electron Limited
  • Compound Semiconductors: Taking Center Stage – Coherent
  • Navigating the Semiconductor Supply Chain Transformation – DHL Supply Chain
  • Combining Accuracy and Throughput for Next Semiconductor Industry Challenges – DR. JOHANNES HEIDENHAIN GmbH
• Climate Equity and Social Impact Session

FLEX Conference Keynotes

• Simplifying the IC Ecosystem – Pragmatic Semiconductor
• The Very Big Picture on Materials: All of the Options Fit to Print – Rice University
• Advancing Additively Manufactured Electronics (AME) for Heterogeneous Integration – Meta Reality Labs

Other Sessions

• Executive Panel – Navigating Supply Chain Uncertainty: How Do You Build Agile Supply Chains? – Representatives from Dell, Intel, KLA, McKinsey & Company and Resilinc will examine government investment in chip manufacturing and supply chain resilience.
• TechTALKS
  • Sustainable Synergy: Balancing Semiconductor Growth and Environmental Responsibility
  • Enabling New Products with Advanced Substrates
• Networking Events:
  • SEMI Corporate Savings Program Wine and Cheese Mixer
  • New: SemiSisters Reception – SemiSisters is a group of female semiconductor engineers, scientists, technologists, market analysts, executives, marketing and public relations professionals and journalists.
  • SEMI Standards 50th Anniversary Celebration and Awards Ceremony

Day 2 – July 12

CEO Summit: Path to Net Zero

• Welcome by Mousumi Bhat, Ph.D., VP of SEMI Sustainability Programs, and opening remarks by Ajit Manocha, President and CEO of SEMI
• Keynotes:
  • Pursuing Sustainable Growth – Intel Corporation
  • A Collaborative Pathway to Net Zero – Applied Materials
  • Showing Our True Colors: Co-Creating a Brighter Future for the Chip Industry – Schneider Electric
  • Inventing What’s Next in Sustainable Computing – IBM
• Sustainability & EHS Forum
• SEMI Sustainability Wall of Fame – Recognition of semiconductor value chain leaders inspiring the Path to Net Zero
• SEMI Sustainability Award – Recognition of outstanding efforts to launch the Semiconductor Climate Consortium
• America’s Path Forward in Semiconductors
  • Focusing on government support of the U.S. semiconductor industry, representatives from the Arizona Commerce Authority, BDO USA, Boston Consulting Group, Compass, Covington & Burling, mySilicon, the State of Indiana, and the U.S. Department of Commerce will present.

Other Sessions and Networking Opportunities

• TechTALKS
  • Latest Trends in Sensorization
  • Heterogeneous Integration: HPC and Hyperscale Computing
• Bulls & Bears panel with experts from Bernstein Research, Jefferies, Parnassus Investments, Reuters Network, and Tudor Investment Corporation
• Networking events:
  • Sustainability & EHS Forum Reception
  • SEMI Member Breakfast
  • Global Automotive Advisory Council (GAAC)
  • Advanced Packaging & Heterogeneous Integration
  • MEMS & Sensors Industry Group (MSIG)
  • Silicon Manufacturers Group (SMG)
  • Workforce Development
  • Smart Manufacturing
  • Smart Mobility

Day 3 – July 13

CEO Summit: Path for Talent

• Welcome by Ajit Manocha, President and CEO of SEMI, and opening remarks by Shari Liss, Executive Director of the SEMI Foundation
• Keynotes:
  • One Trillion Reasons to Join Our Industry – Axcelis Technologies
  • Building the Future: Workforce Development in the Semiconductor Manufacturing Industry – SkyWater Technology
  • Transforming Pathways to Transformative Semiconductor Careers – University of California, Berkeley
• Chip In Roadtrip Nation Panel – Accenture, Aeris LLC, Roadtrip Nation, SEMI Foundation, and University of Texas Austin
• SEMI Foundation Excellence in Achievement Award – Recognition of significant contributions to global microelectronics industry workforce development and diversity, equity and inclusion

Other Sessions

• TechTALKS
  • Accelerating the Pace of Lithography and Scaling Innovation
• Startups for Sustainable Semiconductors

Test Vision Symposium

On Days 2 and 3, the Test Vision Symposium will bring together industry experts to explore the future of test, discussing upcoming trends, innovations, and industry requirements.

New this year at SEMICON West are the local Taste of San Francisco cuisine and a daily networking happy hour.

FLEX Conference 2023

FLEX Conference & Exhibition 2023 (San Francisco CA) - Annual Flexible and Printed Electronics Conference -- FLEX Conference will feature keynotes, startup and venture capitalist panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible hybrid electronics, printed electronics and advanced packaging including heterogeneous integration.

“FLEX will showcase advancements in next-generation electronics packaging accelerating industry growth,” said Melissa Grupen-Shemansky, CTO and Vice President of Technology Communities at SEMI. “Companies pushing the boundaries of heterogeneous integration will join FlexTech, NBMC and NextFlex innovators as they present cutting-edge research and development to advance industry technical knowledge through papers, posters, and product information.”

Design Automation Conference (DAC), the premier gathering focused on the design and design automation of electronic circuits and systems, will co-locate with SEMICON West 2023.

Follow SEMICON West on LinkedIn and Twitter: #SEMICONWest

MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is excited to announce an upcoming webinar titled, "Enhancing Yield and Reliability of Ultra-Fine Pitch Die through Defluxing on CoWs" on July 20th, 2023, at 2:00 PM EST.

This informative webinar will focus on the critical step of defluxing ultra-fine pitch die on chip-on-wafer (CoW) packages in the manufacturing process of microelectronics. The study will be presented by Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas, who will discuss the challenges presented by the small size and proximity of the interconnects on CoW packages.

Mr. Parthasarathy will investigate the appropriate cleaning solution and process parameters required to effectively remove the flux residues without damaging the delicate interconnects on CoW packages with a 10µm bump pitch and 10µm gap height between a top die and bottom silicon wafer. The study will provide valuable insights into the defluxing process, enabling the production of high-quality microelectronics with improved reliability and performance.

This webinar is a must-attend for engineers, quality control personnel, and other professionals involved in the manufacturing of microelectronics. Participants will have the opportunity to ask questions and receive expert guidance from Mr. Parthasarathy, as well as gain valuable insights into the latest defluxing technologies and best practices for optimal performance.

Registration is free and available HERE. Don't miss this opportunity to learn from one of the industry's leading experts on defluxing ultra-fine pitch die on CoW packages.