BANGKOK – During this week, the GPV Executive Leadership Team conducted the first in a row of Site Engagement Meetings in the new GPV. The management teams from the largest Asian locations met at GPV Electronics TH in Bangkok to discuss strong achievements during 2022, share best practices, and agree on the focus for the next four quarters that will help ensure the continued development of operational excellence and higher customer satisfaction.
The merger between GPV and Enics was completed in October 2022, and since then, the organisation has worked on integrating the two companies. Overnight, the new GPV grew to be the second-largest EMS company with European headquarters, with more than 8,000 dedicated people and an expected annual revenue of around EUR 1.1 billion.
“The Site Engagement Meetings is an important leadership platform in GPV, where we bring together the site responsible and their leadership teams from our various production units. We have clustered the sites into regional units and each meeting includes a joint dinner to acknowledge the positive outcome of socialising and interacting with colleagues across sites. Our history in Asia dates back to the 1980s, and we continue our strong presence in Asia where we produce and service our customers primarily with European and American headquarters,” says Bo Lybæk, CEO in GPV.
The meeting was held at the new mechanics factory just 10 days after the hand-over from the construction company on 17 March 2023.
The purpose of the Site Engagement Meetings is to update the Executive Leadership about site status and challenges for the coming period including country specific implications, operational challenges and organisation and factory setup. But it is also to secure a good understanding across the “new” organisation, share knowledge, build on relations, and ensure optimal use of resources.
“Apart from discussing specific initiatives, these meetings give us a unique insight into and understanding of each other across the various professions. This knowledge is included when making decisions on specific business improvement initiatives,” says Bo Lybæk.
At the meeting in Bangkok, each site highlighted what they are most proud to have achieved during the last 12 months.
“First of all, it was a great pleasure to hear the sites tell about their greatest achievements – what they were most proud about. It gave a better understanding across sites, and it served as inspiration. In particular, we had a constructive dialogue around networking capital and how we can bring down the high inventory rates,“ says Bo Lybæk.
The Site Engagement Meetings are held once a year with half a day for each of the participating sites.
Next SEM will take place on 23 and 24 May 2023 at GPV Electronics EE in Elva, Estonia and include the Estonian site together with the electronics sites in Nova Dubnica and Hlohovec, both situated in Slovakia.
NEUSS, GERMANY – The Industrial Internet of Things (IIoT), as a key enabler for Industry 4.0, is transforming the way data is handled in both the operational (OT) and information (IT) technology domains. It’s driving the emergence of new tools that can enhance high-level planning as well as maintenance and optimisation on the factory floor.
Standards Enhance Connectivity
IIoT embodies powerful, standardised machine-to-machine communication protocols. In surface-mount electronics manufacturing, these now provide a basis for meaningful communication between automated inline equipment and enterprise-level software like the Manufacturing Execution System (MES) and Enterprise Resource Planning (ERP). This is a welcome improvement because, historically, a lack of standards has held back the prospects for sophisticated communication between the various types of equipment and systems. Another benefit is that the changes in the way machines share data also now enable SMT-equipment vendors to enhance the software tools available to production teams working in the factory. Despite the general trend for greater automation and longer periods of unsupervised production, the complexity of SMT processes and equipment - which require frequent attention to maintain and optimise - means empowering those teams remains important.
Connecting OT and IT Domains
As one of the defining principles of Industry 4.0, connecting an organisation’s OT equipment with its IT systems aims to create a seamless link between factory equipment and the applications that run the business. It enables enterprise software like the MES to automate control of the manufacturing activities, while the data from factory equipment also drives analytical applications that inform business planning and provide the insights needed for continuous improvement.
IIoT technologies now bring standardised protocols and APIs into the mix, like JSON (JavaScript Object Notation) and REST (REpresentational State Transfer) web-based API, that enable factory equipment and IT applications to communicate. Without these standardised platforms, compatibility between equipment and applications is far from plug-and-play, requiring labour-intensive and costly collaboration between different parties’ software development teams. By taking advantage of these protocols, equipment and applications can now share data through a relatively simple communication relay interface. The equipment manufacturer can create and maintain this interface without needing to customise it to enable communication with specific individual IT applications.
One example is YSUP-LINK, which is a part of Yamaha’s YSUP production support system. It uses REST to allow surface-mount equipment like a YSP10 automated printer and the latest YRM20 mounters in a production line to be connected to various third-party MES or other Industry 4.0 applications. It also handles controlling and collecting information from equipment in the production line and connects to intelligent component storage, as well as supporting the possibility to connect with third-party equipment and software in the future.
Effectively, it provides a connectivity package that enables equipment in the factory to send status information to the MES, which enables the MES to monitor and manage manufacturing activities automatically.
Multiple instances of machines such as the YRM20 can connect simultaneously into this environment, enabling YSUP-LINK to send reports to the MES, such as live status updates about the materials being used at each machine, or splicing reports when reels are changed.
There is also support for the legacy SECS/GEM interface that facilities communication between the new software and equipment such as semiconductor back-end processing environment, which uses established protocols. On the other hand, looking to the future, it’s ready for the incoming IPC-CFX connected factory exchange protocol (IPC-2591), which aims to establish a single standard for all aspects of managing data and communications in digital factories.
Enriching OT Communications
Yamaha’s production support system also includes a material information system, YSUP-MI, which centralises management of material information and makes this available to factory software tools for activities such as line monitoring and setup verification/navigation. This delivers advantages for production teams, such as accelerated response to operator requests for information about reels, and also enables faster data backup execution. Management is centralised thanks to real- time synchronisation between the material information system and enterprise IT systems.
In the factory, it is critical to ensure that operations teams are kept informed of equipment and production status, and that they are empowered to take corrective action when needed.
Taking advantage of the relay server, an operator working on one machine can send an instruction to all other machines in the line simultaneously. All machines can share basic operations such as running control and program switch, while the latest YRM equipment generations allow exchanges such as board loading, screen display, and machine/board status.
In addition, the YSUP software provides a live dashboard that delivers enhanced analysis to assist with real-time optimisation and troubleshooting. This tool includes analytical functions such as print-results analysis, placement-misalignment analysis, vision process support, loss cost aggregation, and enhanced reporting that support maintenance activities and help improve productivity.
There is also component-pickup analysis, which helps find and remedy the causes of common assembly defects. This has already delivered remarkable successes for some clients. By simultaneously visualising the rates of pickup errors per feeder and per head, the dashboard helped the team track down a pickup problem to an issue with splicing tape that could have taken about 6 hours to identify using traditional tools.
Similarly, another client has taken advantage of the dashboard information to prevent over 100,000 pickup errors every month, potentially saving between $12,000 and $120,000 per year in component losses.
Conclusion
IIoT technologies are enabling sophisticated plug-and-play communication between surface-mount equipment, factory software tools, and enterprise-level IT. On the one hand, this provides the long-awaited bridge between companies’ IT and OT domains, to automate production management and boost efficiency. On the other, it is providing the basis for enhanced factory software tools that increase visibility for equipment operators and accelerate troubleshooting and process optimisation to maximise productivity.
CHATSWORTH, CA – NEOTech, a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical, and mil/aero markets, announces the procurement of industry-leading manufacturing equipment to implement a new SMT line at its Westborough, MA site. This new line replaces an older line being phased out and provides NEOTech customers with the latest technology, improved efficiency, and reduced cycle times, keeping them ahead of their competition.
NEOTech is well known in the industry for its commitment to provide high-quality and high-reliability electronic manufacturing services with the continued investment in cutting-edge manufacturing equipment. The new SMT line in Westborough will enable NEOTech to run a wider range of board sizes, in some cases at twice the current throughput rates. NEOTech is excited to attract new business by offering customers quality manufacturing utilizing the latest advanced technology. Current customers are also being informed of the updated equipment being put in place at the Westborough site and are thrilled for the increased capabilities.
“Our customers are very excited about the implementation of our new line, and our manufacturing team is encouraged as well,” stated Chad Burdick, NEOTech Westborough General Manager. “As the production volumes for several of our key customers continues to grow, our manufacturing teams knew it was vital for us maintain the highest levels of quality with increased accuracy and reduced manufacturing times. Our employees are being trained on the new machines to operate all the equipment proficiently and are enthusiastic about taking on new, challenging projects.”
Emilio Ramirez, NEOTech Global Vice President of Engineering, also commented, “At NEOTech, we continue to invest in equipment as part of our technology roadmap. By investing in the latest placement technologies, we remain committed to improve our efficiencies, reducing manufacturing cycle times and improving quality yields.”
CLINTON, NY – Indium Corporation’s senior product specialist Jenny Gallery will deliver a presentation at the International Conference and Exhibition on High Temperature Electronics (HiTEC), hosted by IMAPS, in Albuquerque, New Mexico. The presentation, scheduled for April 20, will cover the findings from a technical paper titled AuSn Preform Thickness’s Effect on Thermal Management in Semiconductor Laser Applications.
80Au20Sn is a great choice to ensure good performance and reliability for the plethora of applications that require a high-melting die-attach solder, especially when used in one of its most highly demanded applications: semiconductor laser die-attach. However, the widespread use of semiconductor lasers has been prevented due to the difficulty managing thermal heat transfer. The longevity and potential of these devices become limited when the operational heat increases. One option to improve thermal transfer is the use of a thinner 80Au20Sn preform in the bondline, which allows the heat to transfer to the heat-sink more quickly and efficiently. Defining the voiding percentages for several 80Au20Sn preform thicknesses—ranging from 0.002” to 0.00035” thick—allows for conclusions to be drawn on 80Au20Sn preform thickness’s effect on thermal management in semiconductor laser applications.
“At Indium Corporation, we are constantly improving and expanding our capabilities and the development of an innovative material such as the AuLTRA™ ThInFORMS™—a product that is four times thinner than the average human hair—embodies that core value. In addition to being able to manufacture such a product, generating the data to support its unique qualities authenticates our dependability as a solder materials supplier,” said Gallery. “The opportunity to educate others in the field of electrical and electronic manufacturing on this new technology is a great privilege and I would like to thank IMAPS for giving me the platform to share my expertise at HiTEC.”
As a senior product specialist for the high-temperature business, Gallery is responsible for driving and supporting precious metal-based sales activity and revenue growth by identifying regional market opportunities, leading product and process support, facilitating relationships and driving new business development in the field. She also provides product and process support for solder preforms, wire, ribbon, and paste. Gallery earned her bachelor’s degree in chemistry at the University at Albany. She has past experience as a Pharmaceutical Scientist in the clinical and non-clinical research industry, is certified in TEFL (Teaching English as a Foreign Language), and is also a Certified SMT Process Engineer (CSMTPE).
NEW BRITAIN, CT – MicroCare, a global supplier of critical cleaning solutions, is pleased to announce the hiring of Rebecca Mahoney as Senior Quality Control Chemist. Mahoney brings over 12 years of experience in the pharmaceutical and industrial biotechnology industries, where she conducted analytical techniques to support product development.
As Senior Quality Control Chemist, Mahoney will be responsible for developing, conducting, and overseeing analytical methods to test incoming raw materials and approve outgoing MicroCare products. She will manage and maintain MicroCare's quality inspection and product release programs through best practices for raw materials and finished goods.
"Rebecca's extensive experience and skill in analytical methods, development and validation will undoubtedly make a great contribution to the continued success of our organization. We are excited to add her to the MicroCare team,” said Marufur Rahim, Technical Laboratory Director at MicroCare.
Before coming to MicroCare, Mahoney held analytical chemist and quality assurance chemist roles at Pfizer, Thor Specialties and most recently, Invicro, LLC.
"I am thrilled to be joining MicroCare, a company that is at the forefront of innovation in the critical cleaning industry," said Mahoney. "I look forward to using my expertise to ensure that the quality control criteria at MicroCare is met and to assist in the development of new products.”
Mahoney earned a Bachelor of Science in Chemistry from Western New England University in Springfield, Massachusetts, and a Master of Science in Chemistry from Sacred Heart University in Fairfield, Connecticut.
PALO ALTO, Calif.— April 2023 – Arch® Systems, the leading provider of machine data and analytics for electronics assembly operations, is pleased to announce the appointment of Dinu Ionescu as Head of Customer Success. With a 25-year background in building world-class operations across multiple global industries and technologies, Ionescu will focus on Arch Systems’ customer satisfaction. Ionescu has extensive experience building and scaling successful, highly performant teams in early and mid-stage startups. His substantial experience with hyper-growth startups has allowed him to develop a blueprint for building and scaling customer success teams that deliver an outstanding customer experience to Arch users.
Ionescu will support Arch Systems’ efforts to scale the customer operations team with a focus on accelerating growth and increasing customer satisfaction. He holds a BSc in Economic Cybernetics from the University of Bucharest and looks forward to helping Arch become the undisputed leader in the manufacturing decision intelligence space.
Arch has built the largest collaboration of industry domain experts working hand-in-hand with data scientists to constantly map new signals from the noisy data, adding them to the ever-growing library of actionable insights. These insights are changing how manufacturers tackle their most complex problems, allowing them to simplify and align actions both on the shop floor and the top floor. Arch also is a recipient of a 2022 NPI Award, 2022 Global Technology Award, 2022 Mexico Technology Award, and a 2022 SMT China Vision Award. The ArchFX Platform provides the machine connectivity, data management, and advanced insights needed to achieve digital transformation across the manufacturing organization. For more information, visit archsys.io or follow us on LinkedIn or Twitter.
PCB East, the electronics industry trade show for the East Coast
May 9-12, 2023