JENA, GERMANY – The increasing networking and artificial intelligence of inspection systems are just as much in demand as electrical testing and programming - and GÖPEL electronic wants to help shape this future as a leading test specialist. At the SMTconnect in Nuremberg, we will inform how we meet the coming requirements in electronics manufacturing with our solutions in a forward-looking way. Together with the trade visitors we follow current topics and trends and show the latest test technologies and systems at booth 222 in hall 4A from 9 to 11 May.

With the FlashFOX, GOEPEL electronic has launched an innovative solution for embedded in-system programming (ISP) that reduces time and costs in the production process of electronic assemblies. The technology, called "Embedded In-System Programming (ISP)", programs microcontrollers, flash components and PLD/FPGA on-board, i.e. in the already installed state. The FlashFOX can be flexibly integrated into ATE systems and infrastructures. It is compatible with all existing technologies such as SCANFLEX, VarioTAP, X-Bus and SYSTEM CASCON and thus represents a native extension of the existing embedded product portfolio.

The new AOI system software PILOT AOI version 7 offers many new features, especially in terms of performance and convenience. Particularly noteworthy is the ability to automatically generate Gerber data using a bareboard, which helps small and medium-sized service companies that do not have such data. The award-winning MagicClick function can then be used to create test programmes automatically. Test programme generation for THT-specific information of through-hole components has also been simplified by importing ODB++ process (OPM) data. The new software version also offers a Mission Commander, which acts as an intelligent to-do list to guide through tasks related to AOI testing.

The artificial intelligence-based assistance function AI Advisor reduces the workload and protects against human error decisions at AOI and AXI verification and repair stations. Based on pre-trained models, the AI makes a decision for each anomaly found by the inspection system. Similarly, the AI Advisor can also warn if an error occurs due to an incorrect decision by the user. Particularly in the case of difficult interpretations, such as X-ray images, the AI Advisor is a welcome support.

The new Reflex Reducer for the 3D THT AOI system enables the measurement of critical solder joints and pins whose detection was previously only possible to a limited extent or not at all. Physically caused effects due to certain pin geometries and solder joint characteristics, which occurred equally with all 3D AOI systems, are thus greatly reduced.

Diverse systems for THT and SMD production, based on our many years of know-how, will also be presented. The MultiEyeS Plus and the THT Line - 3D are available for the optical inspection of THT assemblies, while Basic Line - 3D and Vario Line - 3D can be used for the 3D inspection of SMD assemblies. High-end inspection in large-scale production is covered by automatic X-ray inspection with the X Line - 3D. In addition, automatic solder paste inspection using the SPI Line - 3D should not go unmentioned.

Two excellent embedded JTAG solutions will also be presented. BARCUDA VP230 is a complete turnkey solution with VPC interface that enables flexible testing and programming of electronic assemblies with and without JTAG/Boundary Scan. JULIET as a professional, fully production-ready JTAG/Boundary Scan tester will also be part of GÖPEL electronic's trade fair presence at SMTconnect 2023.

HANOVER, GERMANY – At SMTconnect in Nuremberg, Germany, Viscom AG will showcase the successor of the almost legendary S3088 ultra gold, the iS6059 PCB Inspection Plus. Its new and faster sensor technology, data processing and analysis functions all stand for the best 3D AOI performance that meets the highest requirements in industrial use. The latest AI-supported software applications and technical advancements in X-ray inspection will also be presented to visitors "hands-on" at the booth.

Viscom's product portfolio is growing and offers a very wide variety of powerful systems for different production stages and inspection requirements – especially for quality control in modern electronics manufacturing. Automatically monitored operational stability, location- independent networked condition monitoring, cloud-based solutions, the integration of manufacturer-independent interfaces and targeted use of artificial intelligence are just as much a part of this as ensuring audit-proof repeat accuracies or ever higher resolutions while maintaining low cycle times. At booth A4, 120, Viscom will provide detailed information on the latest trends in various areas of its in-house inspection technologies from May 9 to 11, 2023.

If, for example, electronic components need to be inspected for presence as quickly as possible or the heights on an assembly need to be measured precisely, the existing 3D methods of automatic optical inspection (3D AOI) are the recognized industry standard. Complementing the above two features, reliable 3D solder joint inspection also plays a significant role – all distinguished by impressive reliability with systems such as the new iS6059 PCB Inspection Plus from Viscom. Featuring nine views in first-class resolution and with 26% more pixels, variable illumination, larger angular field of view sizes at the same resolution, further increases in data transfer rates combined with 25% faster image capture and extensive networking options – it provides a solid basis for unbeatable line-integrated performance. The iS6059 PCB Inspection Plus offers advanced inspection methods for fully automated verification of whether the solder joint of even the smallest electronic component is normal or too thin – no matter if cycle times are short. Another 3D AOI system at the Viscom booth is the S3088 ultra chrome, which is successfully used worldwide today – giving it a role akin to company "work horse". It will be presented in combination with state-of-the-art handling and smart verification – which now additionally offers new forms of assistance with artificial intelligence.

AI is currently a major topic at Viscom. It is also used when it comes to measuring voids in solder joints as part of an X-ray inspection and excluding defects due to individual factors. Viscom systems such as the iX7059 PCB Inspection XL shown at SMTconnect detect these and other hidden defect types. Viscom offers high-performance 3D inline X-ray for a very wide range of products – be they flat assemblies up to 1600 mm long or compact, solid objects weighing up to 40 kg. Thanks to its tremendous international success, the X7056-II combined 3D AXI / 3D AOI will also be showcased. Special features of manual and semi-automatic X-raying will be demonstrated on the X8011-III 3D MXI system. Inspection solutions specifically for power electronics requirements will be presented by Viscom at booth 6-114 at the neighboring PCIM Europe, which is taking place in parallel.