REDDITCH, UK – Solderstar, a technology leader in the design and manufacture of thermal profiling systems, has expanded its current partnership with Altus Group to include distribution and sales support of the company’s innovative thermal profiling systems in the UK and Ireland.

The two companies already have a strong working relationship, collaborating successfully to deliver Solderstar’s equipment in Eastern Europe through Altus’ sister company, Danutek.

Joe Booth, Altus CEO, said: "It is clear that Solderstar is a top-quality provider of profiling systems, and after partnering successfully in Eastern Europe, we are pleased to be offered the opportunity to proactively support Solderstar in the UK and Ireland.

"We are a big believer in Solderstar’s equipment capabilities and have used their profilers for some time to support our routine servicing of reflow processes. We know that the products are the best in the business having already used their technology to ensure ovens operate at optimum levels for customer’s applications.

"I am eager to see how many of our UK-based installations adopt the Solderstar technology. Every user of reflow should have external validation of their processes for auditing purposes, so the potential is huge. I look forward to building a successful future together."

Altus' full spectrum range of reflow solutions is an ideal fit for Solderstar because of its large install base of existing prospects and users. The team looks forward to introducing Solderstar’s innovative technology, including the newest equipment release, the intelligent SLX zero set-up profiler, which quickly and easily gains accurate parameters to make insightful decisions.

Chris Williams, Solderstar Business Development Manager, said: "As many will already see, Altus has been on an exciting and transformative journey over the last years. Their complete range of reflow processes makes them a good fit for our technology.

"Working with reliable partners is crucial for our business, and the trust built thus far in our collaborations with Danutek and Altus provides a foundation for further strengthening our outstanding network of distributors in the UK and Ireland.

"We are expecting a very bright future for us both and look forward to accelerating the knowledge of our leading profiling hardware and software across the region."

To learn more about Solderstar’s advanced SLX system or the company’s extensive portfolio of products, contact Altus www.altusgroup.co.uk

TYNGSBORO, MA – Transition Automation, Inc. is pleased to announce that Ilona Navez has joined the TA team as Accounting Manager. Ilona brings more than 15 years of direct accounting experience at several high-tech companies, most recently at Yamaha Unified Communications. Mrs. Navez was born in Poland and studied at The University of Economy, Kalowice, Poland, with a degree in Finance and Banking, and at MassBay College in Wellesley, MA with a degree in Accounting.

Mark Curtin, Technical Support Manager, stated, “To be a great supplier, a company must have good accounting with quality and accurate information to correspond with our leading customers. We are on a growth trajectory with several recently released new products and Ilona is an exceptional candidate that joins at an opportune time to support our business and customers. We are pleased and honored to have Ilona join our team.”

TOKYO – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting for the first time at Smart SMT & PCB Assembly 2023 to be held from April 5 to 7, 2023 in Suwon, Korea. Saki’s latest automated inspection solutions for SMT processes that contribute to the realization of Smart Factories will be exhibited on Booth #I 102.

Show visitors will be invited to discover the latest 3D-AOI and 3D-AXI inspection solutions including the 3Xi-M110 V3 ultra-high-speed X-ray automated inspection system (AXI) that enables in-line operation, and the award-winning 3Di-LS3 3D automated optical inspection system (AOI) with 8µm resolution that achieves the fastest cycle time in the industry.

Alongside its partners JS TECH and H&J Corporation, the Saki technology team will also present a 2D-AOI benchtop model BF-Sirius. To demonstrate its Full SMT Line, Smart Factory and M2M capabilities, Saki’s QD-Analyzer Software Suite completes the show line-up.

Saki’s booth will allow visitors to experience the company’s latest hard- and software innovations up-close, including：

3Xi-M110 V3
True-Inline Operation with the high-speed 3D-CT X-ray Inspection System

3Di-LS3 (with 8μm resolution camera system)
Revolutionary 3D-AOI for the industry's fastest, highest-performance inspection and easy on-site upgrades and interchangeability

3Di-LS2 (with 18μm resolution camera system)
High-speed 3D-AOI with a height measurement range of 20mm and an imaging speed of 5,700 mm2/s for improved productivity

BF-Sirius
Benchtop 2D-AOI for L-size substrates

QD Analyzer
The SPC software suite offers a data-driven approach to continuous productivity improvement by collecting and statistically analyzing the operating status and inspection results of all equipment in the production line.

"We are very pleased to be exhibiting at Smart SMT & PCB Assembly for the first time and introducing Saki's latest solutions for SMT processes to our customers in Korea and around the world,” said Mr. Kim Kyu Seob, General Manager of Saki Corporation Korea Representative Office. “Visitors to Saki's booth will be able to see our latest technology that contributes to the realization of Smart Factories through in-line automated inspection. We look forward to welcoming show visitors to our booth."

For more information about Saki visit www.sakicorp.com/en/ 

CLINTON, NY – Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch is set to present as part of the upcoming IMAPS Spring Seminar, March 23, in Ilmenau, Germany. The 2023 Spring Seminar will focus on sustainability in electronics production.

Andreas’ presentation will address energy efficiency in reflow soldering processes enabled by a new, low-temperature composite alloy. Additionally, he will cover its desirable mechanical properties also confirmed in multiple verticals.

Andreas provides technical support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials for customers in Germany, Austria, and Switzerland. Products include solder paste, solder preforms, fluxes, and thermal management materials. He has more than 20 years of automotive industry experience in PCB assembly and power electronics, including the advanced development of customized electronics. He received an award for developing one of the top 10 innovative patents for automotive LED assembly. Andreas is an ECQA-certified integrated design engineer and earned his Six Sigma Yellow Belt. His thorough understanding of process technologies and project management skills reinforce Indium Corporation’s commitment to providing world-class service to our customers in Europe.