CLINTON, NY – As an industry leader in innovative materials solutions for heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications, Indium Corporation® will feature innovative products designed to meet the evolving challenges of SiP and HIA at the 19th International Conference and Exhibition on Device Packaging hosted by IMAPS, March 13‒16, in Fountain Hills, AZ.

Indium Corporation’s proven SiPaste® series is specifically designed for fine feature printing with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. The newly released SiPaste® C201HF offers the same superior printing performance with the benefit of having a cleanable chemistry with semi-aqueous-based solutions.

As the industry leader in no-clean semiconductor flux, Indium Corporation will feature the first low-residue no-clean, ball-attach flux on the market, NC-809. NC-809 is a dual-purpose flux, engineered with high-tack characteristics for flip-chip applications and with adequate wetting power for ball-attach applications. This material is designed to hold die or solder spheres in place without risk of die shift or solder sphere movement during the assembly process.

NC-809 is designed to leave minimal residue after reflow, at the level of Indium Corporation’s proven ultra-low residue (ULR) flip-chip fluxes, such as NC-26S and NC-699. NC-809 exhibits superior wetting performance and is the first ULR flux qualified for ball grid array ball-attach applications for packages that are sensitive to traditional water cleaning processes. NC-809 also improves production yields by eliminating costly cleaning steps that can increase substrate warpage, both after reflow and before the underfilling steps, creating the potential for die damage and cracked solder joints.

Indium Corporation will also feature Indium12.8HF, an award-winning, no-clean, halogen-free solder paste formulated to be compatible with a wide range of microdispensing and jetting systems. Indium12.8HF provides exceptional deposition performance, and its unique oxidation barrier promotes complete powder coalescence during reflow to eliminate graping and similar reflow issues.

Additionally, Indium Corporation will showcase QuickSinter®, a high metal content paste, redefining sinter technology. Available in pressureless and pressure formulations, this portfolio of sintering solutions delivers products engineered for customers’ specific application needs.

To learn more about Indium Corporation’s innovative solutions for HIA and SiP, visit our experts at booth #56 at IMAPS Device Packaging Conference or online at indium.com/HIA.

SAN DIEGO – KIC will exhibit at the SMTA Dallas Expo & Tech Forum, scheduled to take place Tuesday, March 28, 2023, at the Plano Event Center in Texas. KIC provides the most accurate Heat to Data™ solutions including its award-winning support with onsite service and application knowledge from the thermal process experts.

KIC brings Heat to Data™ for all its solutions with a complete ecosystem that covers all electronics assembly and semiconductor packaging thermal processes. The inventors of automatic profiling and real-time process inspection with RPI and WPI for reflow/cure/wave, KIC has continued to innovate. Now with the best tools for machine performance tracking with HTI – Heat Transfer Index!

KIC’s has 45+ years of experience in automated process data collection and a worldwide network of KIC service and application support in the field in every region. With more than 28,000 systems in the field KIC offers the most reliable, accurate, and innovative solutions for electronics manufacturing thermal process challenges. Experts in turning Heat to Data™. For more information: www.kicthermal.com 

STOCKHOLM – The demand from a large industrial customer with high requirements, with whom NOTE has successfully collaborated with for several years, is developing very strongly. NOTE is therefore facing a sharp increase in both manufacturing and deliveries within the framework of the existing collaboration. NOTE's sales to the customer last year amounted to approximately SEK 50 million. The production rate has increased significantly and sales to the customer this year are estimated to amount to at least SEK 200 million.

“NOTE is growing successfully with new customers and through expanded collaborations in our strong customer base. Important factors for customers are our methodical investment in ensuring high quality and delivery precision in our services. It is very gratifying that we continue to be trusted to be the customer's production partner in the face of the strong growth that has now begun. I estimate that this business will be one of our largest already in 2023. And together with the customer, we see very good conditions to significantly grow the business in the coming years as well”, says Johannes Lind-Widestam, CEO and President.

REDDITCH, UK – On the heels of the company’s strong sales growth in Ireland in 2022, Altus Group, a leading distributor of capital equipment for electronics assembly, will continue to increase its presence in the region when it exhibits at The National Manufacturing and Supply Chain in Dublin from 23-24th May 2023.

In the last two years, Altus has invested in new staff with the expertise and experience to offer unrivalled customer service and pre-sales validation of new processes for the region. Exhibitions are an important part of the company’s growth plan, with The National Manufacturing and Supply Chain an important date in the diary to expand its reach.

Gareth Fenton, Altus Sales Manager Ireland, said: “We are delighted to be back at RDS Simmonscourt and supporting a local show and our local sector. We had an excellent first year as a new team in 2022, with existing and new customers trusting us with significant projects. So we are really pleased to say that 2023 looks like it will be more of the same.

“During the exhibition, we will be presenting cutting-edge technologies that the market is calling out for. It’s a, excellent chance for visitors to get hands on with the latest equipment to assist with electronics manufacturing.

“Together with Michael Ostrykiewicz, Senior Applications Engineer, I will be available to discuss specific projects and show how Altus can support companies with innovative equipment from the world’s leading suppliers.”

Technology taking centre stage at the Altus stand includes the Koh Young Zenith Alpha HS+ 3D AOI inspection platform. Combining the best hardware and 3D algorithm technologies and teamed with artificial intelligence, it delivers the first-class accuracy for any inspection application.

The team will also demonstrate the YJ Link YLM Laser Marker, which helps ensure manufacturers easily meet high production targets. Another machine earmarked to create interest at the exhibition is the Scienscope AXC-800 III Xray component counting unit, designed with smart camera technology and automatic label reading and printing, to offer uses automated and de-skilled abilities to count components in their facility. With an increases global focus on component supply, this solution is proving to be hugely popular in the Irish market already.

To learn more about Altus' range of equipment, visit stand J02 at The National Manufacturing and Supply Chain at RDS Simmonscourt, Dublin, from 23-24th May 2023.