Cranston, Rhode Island USA – AIM Solder, a global leader in solder assembly materials, proudly announces the expansion of its patent for the innovative REL22™ lead-free solder alloy to Mexico. The patent extension represents a pivotal step in AIM Solder's mission to offer the most innovative and reliable product solutions.

The award-winning REL22™ alloy, known for its enhanced durability and superior performance, is specifically designed to meet the rigorous demands of harsh environments such as those found in the automotive, aerospace, and geographical exploration sectors.

Key Features of REL22™:

• Enhanced durability for use in extremely harsh environments
• Reliability equal to Sn/Ag/Bi/Sb/Ni/Cu alloys, but with a wider assembly process window
• High reliability and strength with improved thermal cycling performance
• Superior wetting capabilities versus all low/no-silver alloys

"With the patent expansion of REL22™ to Mexico, AIM Solder solidifies its position as a market leader in providing robust and reliable soldering solutions on a global scale," said Tim O’Neill, Director of Product Management at AIM Solder. "This milestone not only reflects our unwavering commitment to quality and innovation but also reinforces our dedication to meeting the evolving needs of the electronics industry."

AIM Solder's REL22™ is available in various forms, including bar, wire, and paste, to accommodate diverse manufacturing requirements. For more information about REL22™ and other innovative solutions from AIM Solder, please visit www.aimsolder.com.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit www.aimsolder.com.

WASHINGTON – February 7, 2024 – In a letter signed by 54 microelectronics executives, IPC and the Printed Circuit Board Association of America (PCBAA) are calling on Congress to fully fund the Defense Production Act Purchases Account at the House-passed level of $618 million and $1.08 billion for the Industrial Base Analysis and Sustainment program.

These funding sources are crucial to restore American leadership in the strategically vital printed circuit board (PCB) industry. The United States currently produces only four percent of the world’s supply compared to 30 percent at the turn of the century. PCBs are central to all electronics across all industries including defense, healthcare, telecommunications, aviation, and automotive.

The semiconductors funded by the CHIPS and Science Act gain functionality through their placement on PCBs. As chips have increased in sophistication, so too have the PCBs upon which they are placed. U.S. armed forces depend on PCBs found in everything from night vision goggles and drones to avionics and satellites.

“Semiconductor chips are powerful examples of modern innovation, but they require an electronic system to operate,” said John W. Mitchell, IPC president and CEO. “Chips have no functionality until they are packaged and placed on PCBs by electronics manufacturers who assemble systems. IPC and our member companies urge Congress to reinvigorate a domestic PCB industry that is critical to U.S. industrial resiliency, economic competitiveness, and national security.”

“America’s leadership in microelectronics has implications for our national and economic security,” said PCBAA Chairman Travis Kelly, “As they did with the CHIPS Act, Congress must invest in American printed circuit boards.”

For years, experts inside and outside of government have warned that the Department of Defense’s (DOD’s) reliance on a long and vulnerable supply chain creates unacceptable risk.

• 2017: The Department of Commerce Bureau of Industry and Security issued a warning to DOD regarding the health of the PCB industry
• 2018: The White House recommended that the DOD expand direct investment in the lower tier of the industrial base.
• 2022: The Departments of Commerce and Homeland Security warned of serious risks because of the lack of PCB manufacturing and recommended investment incentives and funding of Title III of the Defense Production Act.
• 2023: The House Select Committee on the United States Competition with the Chinese Communist Party recommended financial assistance programs for American PCB manufacturing and research. This was the first of 150 recommendations in their report.
• 2024: The Department of Defense named microelectronics as a key area of risk for the defense industrial base.

For the full text of the letter, please visit https://emails.ipc.org/links/IPC-IndustryLetter_FY24Appropriations.pdf

PCB East, the electronics industry’s East Coast conference and trade show. Coming June 4-7 to the Boston suburbs. pcbeast.com

CLINTON, NY – As one of the leading materials providers to the power electronics assembly industry, three Indium Corporation team members will share their insights and knowledge on a variety of industry-related topics throughout APEC 2024, February 25-29, in Long Beach, CA.

• Tuesday, February 27
  • 1:30 p.m. – 2:00 p.m. PST
    • Power Module Package-Attach Materials Technology by Product Manager – ESM/Power Electronics Joe Hertline
    • Hertline will explore new innovations and trends in power module package-attach materials technology, including a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. This alloy prevents warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. Sintering applications and thermal interface materials trends will also be discussed.
• Thursday, February 29
  • 2:45 p.m. – 3:10 p.m. PST
    • Material Considerations for Next Generation EV Inverter Architectures by Strategic Advisor Dongkai Shangguan
    • Dr. Shangguan will focus on the unique challenges posed by 800V inverter architecture, a field growing in complexity with the increasing size of power electronics. Key issues will include design considerations, thermal management, and the selection of suitable materials. Particular emphasis is placed on the problems of warpage and delamination, which present notable manufacturing challenges and have critical implications for the reliability and safety of end-products.
  • 2:50 p.m. – 3:10 p.m. PST
    • Low-Temperature Pb-Free Solder Preform Technology for Molded Power Module Package Attach Designed for Improved Thermomechanical Performance by Senior Applications Development Engineer Ryan Mayberry
    • Mayberry will examine a low-temperature Pb-free soldering solution for high-power density power electronics, addressing the trade-off between cost, complexity, and performance in thermal management/mechanical attach solutions for power modules. The proposed SAC-In alloy solution, in a solder preform configuration, has reflow temperatures below industry standard lead-free and high-temperature solders. It serves as a drop-in replacement, offering improved thermal performance compared to organic-based thermal management solutions, while mitigating risks of component damage, material stress, and reducing energy consumption with a peak reflow temperature below ~215°C. The Bi-free alloy also demonstrates robust lifecycle performance comparable to standard Pb-free alloys in thermal shock testing at -40°C/+125°C.

Hertline is responsible for driving the growth of the power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. He earned a bachelor’s degree in mechanical engineering and an MBA from Clarkson University and is a Certified SMT Process Engineer (CSMTPE).

Dr. Shangguan is a Strategic Advisor to Indium Corporation. In this role, he works on specific trends related to the advanced semiconductor packaging and SMT industries, and applies his significant industry experience to supporting customers. Dr. Shangguan is an IEEE Fellow and IMAPS Fellow, and has served on the boards of directors for several professional organizations and industry associations, including IPC, IEEE EPS, and iNEMI. He also serves as a Distinguished Lecturer for IEEE EPS. He has been honored with some of the industry’s most prestigious awards, including IPC’s President’s Award, the Society of Manufacturing Engineers’ (SME) Total Excellence in Electronics Manufacturing Award, the Electronics Manufacturing Technology Award and the Outstanding Sustained Technical Contribution Award from IEEE EPS, and the William D. Ashman Achievement Award from IMAPS, among others. Dr. Shangguan received a bachelor’s degree in mechanical engineering from Tsinghua University, China, an MBA from San Jose State University, Calif., and a Ph.D. in materials from the University of Oxford, U.K. He has held postdoctoral positions at the University of Cambridge, U.K., and the University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan has published three books, more than 200 scientific papers and technical articles, and has given numerous presentations to share knowledge and expertise with the industry. He is the inventor/co-inventor of 33 U.S. patents and several foreign patents.

Mayberry is responsible for generating test strategies, data sets, and application guidelines for Indium Corporation’s Engineered Solder Materials (ESM) product line. He collaborates with sales, R&D, operations, and quality departments as a subject matter expert to enable key pursuits in the power electronics and thermal market segments by developing process recommendations and supporting new product qualifications for a successful customer experience. Mayberry holds a bachelor’s degree in materials science and engineering from Rutgers University, N.J. He is a Certified SMT Process Engineer (CSMTPE) and is certified as a Lean Six Sigma Green Belt.

To learn more about Indium Corporation’s innovative products for EV and power electronics, visit us at booth #752 at APEC or online at indium.com.

ATLANTA – Koh Young, the leader in True3DTM measurement-based inspection solutions, is pleased to announce the newest addition to its growing family, Mr. Hector Hernandez. As part of our commitment to expansion and excellence, Hector joins Koh Young as the Regional Sales Manager for the regions of Baja, Sonora, Durango, Chihuahua, and Jalisco.

Bringing over 8 years of experience in sales, Hector Hernandez is a seasoned professional in our industry. His proven history and extensive knowledge make him an ideal fit to further elevate our market presence in Mexico. This strategic move underscores Koh Young's dedication to delivering innovative technology and customer satisfaction.

Hector Hernandez shared his excitement about the transition, saying, "Joining Koh Young America as a Regional Sales Manager was a natural progression for me as a sales rep. The dynamic and innovative environment at Koh Young left a lasting impression on me during my time as a sales rep. Koh Young's commitment to advanced technology and customer satisfaction aligns seamlessly with my professional values."

In his new role, Hector will be based at our Mexico Headquarters in Guadalajara, Jalisco, contributing his expertise to drive tailored solutions and address customer challenges. His genuine passion for the industry and dedication to building lasting relationships perfectly align with Koh Young's mission to actively contribute to the advancement of our customers.

Please join us in welcoming Hector Hernandez to the Koh Young family. We look forward to achieving new milestones and continued success with him as a valued member of our team.