SHANGHAI, CHINA – Heraeus Electronics is excited to announce its participation in SEMICON China, scheduled to take place June 29 - July 1, 2023 at the Shanghai New International Expo Center (SNIEC). Heraeus Electronics will showcase its innovative range of semiconductor packaging materials and printed electronics in booth E7355, Hall E7.

Delivering compact yet powerful electronic devices The semiconductor advanced packaging industry is at the forefront of meeting the growing demands for highly sophisticated and intricate electronic products utilized in a wide range of applications, including 5G communications, Internet of Things (IoT), augmented reality (AR), smart wearables, electric vehicles, and various consumer and industrial sectors. With a relentless focus on achieving superior performance and compactness, the industry is continuously pushing the boundaries by increasing the component density within semiconductor packages, such as the system-in-package (SiP), while simultaneously reducing the overall package size.

Heraeus Electronics’ solution:

Welco AP520: This state-of-the-art water-soluble type 7 printing paste is designed to solve the challenges of miniaturization, as it can create tiny and reliable joints with close to zero defects. With excellent paste release down to 90 µm pitch (55 µm stencil opening and 35 µm line spacing), no splashing and best-in-class low void performance, AP520 makes an excellent choice for fine-pitch components and flip chip attach for next-generation System-in-Package applications used in 5G communications, smart-wearables, and electric vehicles.

Development of defect-free HPC systems

High-Performance Computing (HPC) has become increasingly integral to everyday life, powering a range of applications including processors for Artificial Intelligence (AI), gaming computers and consoles, 5G smartphones, autonomous driving systems, memory controllers, and more. The key enabling technology for HPC lies in high bump-count and fine bump-pitch flip chips, which require reliable soldering onto substrates. However, the semiconductor industry faces significant challenges in eliminating defects such as cold joints, solder creeping, die shifting, voiding, underfill delamination, and others.

Heraeus Electronics’ solution:

AP500X: This water-soluble, halogen-free tacky flux is specifically engineered for ultra-fine bump-pitch flip chip attach and BGA attach applications. This new carefully designed flux plays an important part in eliminating defects such as cold joints, solder creeping, die shifting, voiding, underfill delamination, etc. in advanced semiconductor packages for high performance computing, memory, mobile and more.

Heraeus’ solution for EMI shielding in 5G technology

Offering accurate selective coating without any masking is the key benefit of the Prexonics® full system solution for EMI shielding on package level. This new technology is the first to enable a thickness aspect ratio of 1:1 at topside and sidewalls and thus only 1.5-2μm conductive film on topside is needed to achieve the required shielding performance. Prexonics® is a unique full system solution offered by Heraeus Printed Electronics, that consists of a special particle-free silver ink, an inkjet printer, and a manufacturing process that uses inkjet printing to apply full, partial or trench coating. This approach allows selective and precise deposition of the silver ink onto specific areas of the component, avoiding excess material and minimizing waste. By using the specialized silver ink customized thin metallization films are possible in the range of 150nm to 4µm.

Finally, Heraeus Electronics will announce its extended product portfolio towards sustainability initiatives with gold bonding wire made with 100% recycled gold and Welco solder paste series made with 100% recycled tin. By incorporating recycled tin or gold into our products, Heraeus Electronics contributes to environmental sustainability, significantly reducing energy consumption and carbon footprint. The pastes formulated with recycled tin maintain the same level of quality as those made with primary tin. Both recycled and non-recycled gold undergo the same meticulous refining process before being transformed into final products, including gold wires and gold-coated silver bonding wires. This ensures the consistent composition & properties across our offerings. Both Heraeus Electronics’ gold and tin suppliers comply with Responsible Materials Initiatives (RMI) and ISO14021:2016.

The Heraeus team also will conduct five live booth presentations that will discuss the company’s newly launched products, and show how its latest materials can further elevate your device performance.

To learn more about Heraeus Electronics, visit www.heraeus-electronics.com

BOCA RATON, FL – Inovaxe, a world leader and provider of innovative material handling and inventory control systems, is pleased to announce that Assembly Solutions has made a strategic investment in its Smart Racks to optimize their assembly processes. An Inovaxe customer since 2021, Assembly Solutions recently purchased two new Inovaxe Smart Racks, making a total of seven. Assembly Solutions, a trusted provider of electronic manufacturing services, recognized the value and efficiency offered by Inovaxe’s state-of-the-art solutions.

As a rapidly growing company, Assembly Solutions understands the importance of staying ahead in a competitive manufacturing landscape. The addition of the newest Inovaxe Smart Racks to their assembly line demonstrates their dedication to leveraging advanced technologies that streamline processes and optimize productivity.

Currently using five Smart stationary SREX racks, Assembly Solutions has recognized the tremendous value these intelligent storage solutions bring to their operations. The seamless integration of the Smart Racks has significantly improved their inventory management, ensuring accurate and efficient component organization.

The recent purchase of two new Smart Racks further solidifies Assembly Solutions’ commitment to continuously enhance their assembly capabilities. Now, with seven Smart Racks in their arsenal, they are well-equipped to meet the growing demands of their customers and provide reliable, on-time delivery of quality products.

“Inovaxe Smart Racks have been a game-changer for our assembly process,” said Mike Franklin, Operations Manager at Assembly Solutions. “The innovative technology and intelligent design of these racks have revolutionized our inventory management, enabling us to minimize errors, reduce setup time, and increase overall productivity. The decision to expand our Smart Rack inventory was an easy one, as we experienced firsthand the significant impact they had on our operations.”

Inovaxe Smart Racks offer a range of features that align perfectly with Assembly Solutions’ commitment to excellence. The racks’ intelligent tracking system ensures accurate inventory counts, eliminates the need for time-consuming manual processes, and reduces the risk of misplaced or lost components. The flexibility and scalability of the Smart Racks also allow Assembly Solutions to adapt to changing assembly requirements and accommodate future growth seamlessly.

Assembly Solutions is poised to take their assembly services to new heights. By optimizing their inventory management, increasing operational efficiency, and reducing setup time, Assembly Solutions is well-positioned to meet the evolving demands of the manufacturing industry.

To learn more about Assembly Solutions and their advanced assembly capabilities, please visit their website at www.assemblys.com . To learn more about Inovaxe and their advanced material handling solutions, visit their website at www.inovaxe.com

ORLANDO, FL – Tompkins Robotics, a global leader focused on the robotic automation of distribution and fulfillment operations, announced it has named Tony Villanova Vice President, PickPal Solutions. In this new senior leadership role, Villanova will spearhead the development of the company's flagship picking solution in support of the continued growth of its industry-leading autonomous mobile robotic (AMR) system, tSort.

"We are pleased to welcome Tony to help lead our PickPal Solutions business," said Mike Futch, President & CEO of Tompkins Robotics. "He is a collaborative leader, strategic thinker and skilled communicator with hands-on experience with AMR solutions, and we look forward to his contributions to the company."

The PickPal robotic technology follows Tompkins Robotics core design elements of producing adaptive, flexible, and scalable solutions. The system can be quickly implemented, features low operating costs and is compatible with a range of existing fulfillment operations in a scalable RaaS model. PickPals ability to handle the rising number of SKUs and faster delivery demands make it an ideal low-risk choice to help 3PL, e-commerce and other fulfillment customers handle the growing problems that traditional, large-scale systems cannot easily address. To date, the company has introduced two models in its PickPal Solutions series that can pick and carry up to 220 lbs/100 kg and 440 lbs/200 kg of orders, respectively, and plans to announce additional models in the near future.

Villanova brings more than two decades of supply chain operations expertise to Tompkins Robotics, with demonstrated success and commitment to driving lean methodologies and fostering continuous improvement within his teams and customer base. His supply chain, operations management and finance experience includes roles in various industry sectors including retail, 3PL, and industrial companies. Most recently, he worked with 6 River Systems designing and delivering AMR solutions.

Villanova earned a Bachelor of Science degree in Corporate Finance from West Virginia University, and was awarded an MBA with honors from Salisbury University, Maryland. He is a former non-commissioned officer with the US Marine Corps Reserves.

SHENZHEN, CHINA – King Field Electronic Co., Ltd. (www.kingfieldpcb.com), a leading electronic OEM PCB printed circuit board and PCB assembly (PCBA) manufacturer, is making waves in the industry with its commitment to scale production and bulk procurement of materials. By effectively controlling costs, the company is able to provide customers with more favorable prices while delivering high-quality electronic components and parts.

With its own cutting-edge factory, well-equipped workshop, and a dedicated team of experts, King Field offers a comprehensive range of services, including PCB design, fabrication, electronic component sourcing, PCB assembly, IC programming, and function testing. The company's specialization spans various sectors, such as Communications, Aerospace, Industrial Control, Medical Care, Automotive Electronics, and Wearable Smart Devices.

One of the key advantages that sets King Field apart is its ability to leverage scale production and bulk procurement to optimize costs. By purchasing materials like circuit boards and electronic components in large quantities, the company effectively controls expenses, enabling it to offer customers more competitive prices without compromising on quality.

King Field's commitment to excellence is exemplified by its certifications, including ISO9001, ISO14001, IATF16949, and UL. The company employs stringent quality control measures, including AOI testing for each production line, solder paste checking for every component, and X-Ray Inspection for BGA and 0201 offset checking. Additionally, video quality assessments and factory inspections ensure that all products meet the highest industry standards, providing users with PCB products of superior quality, cost-effectiveness, and faster delivery.

"Helping customers bring their ideas to life is our primary focus at King Field," stated Mr. Michael Reynolds, Director of Operations at King Field Electronic Co., Ltd. "With our extensive experience and highly skilled staff, we are able to provide concrete and competitive pricing support within one hour, addressing urgent orders promptly."

The company's dedication to customer satisfaction is reflected in its long-term mission of achieving mutual profitability and fostering enduring cooperation. King Field is proud to be recognized as a reliable PCB and PCBA supplier, offering a comprehensive one-stop service to clients around the globe.

To learn more about King Field's extensive range of services, including printed circuit board assembly, electronic components, and electronic parts, please visit their official website at www.kingfieldpcb.com