Circuits Assembly Online Magazine - Current

Press Releases

AUSTIN, TX – Cetec ERP, a leading cloud ERP software provider, will exhibit at the SMTA Dallas Expo & Tech Forum on Tuesday, March 28, 2023, at the Plano Event Center in Plano, TX. The Cetec ERP team will discuss a new generation of cloud ERP software for manufacturers and distributors during the event.

Cetec ERP delivers a web-based ERP system in a practical, logical and low-cost manner that dramatically helps small and mid-sized companies. The all-in-one platform includes everything from sales and quoting to inventory management, document management, shop floor control, quality management and financial accounting.

The Cetec ERP team is committed to working closely with manufacturing companies around the world who want to take advantage of a completely full-suite platform. Its leading-edge system helps customers handle stringent regulatory requirements and track dynamic production environments, all from a single, friendly web interface. All modules, support, maintenance and upgrades are included in the monthly subscription.

To learn more, meet with the Cetec ERP team during the SMTA Dallas Expo or visit http://cetecerp.com/

NEWMAN LAKE, WA – Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that InSource Technologies Inc. has finalized the purchase of their second Hentec/RPS Vector 460 selective soldering system.

The Vector 460 is a lead-free compatible selective soldering system that features an integrated computer with unlimited program storage, integrated system software, witness camera and auto fiducial correction. Available in either standalone or SMEMA in-line configurations, the Vector 460 is offered with topside preheat, spray or drop-jet fluxer, dual flux nozzles, and custom or wave solder nozzles. The Vector 460 is UL and CE compliant and carries both a two-year system warranty and a four-year solder pot warranty.

MONTERREY, MEX – Pemtron Technology, an inspection equipment developer and supplier, is pleased to announce plans to exhibit at the SMTA Monterrey Expo & Tech Forum, scheduled to take place Thursday, April 20, 2023 at the Cintermex Convention Center (CENTRO INTERNACIONAL DE NEGOCIOS MONTERREY) in Nuevo León.

Jaime Arreola, Pemtron’s MX General Manager, will be available to meet with customers to demonstrate the Athena 3D Automated Optical Inspection System and Mercury Automated X- ray SMD Counter.

The Athena 3D Automated Optical Inspection (AOI) System uses 12-way projection for 3D measurements on all models to minimize errors due to shadow effects, and performs 100 percent of 2D & 3D inspection concurrently in all FOV areas. This significantly reduces false calls while providing near-perfect detection. The system offers 10/15 or 18um resolution, a 10MP camera (optional 12MP) and a three-stage conveyor.

The Mercury Automated X-ray SMD Counter provides real-time data with Artificial Intelligence. The system offers a reel capacity of up to four 7” reels or a single 13” reel, a scanner and label printer interface, real-time ERP reporting and annual stock through barcode monitoring.

For more information about Pemtron, visit https://pemtron.com/

MOUNT PLEASANT, PA – Intervala LLC, a premier full-service electronics manufacturing services (EMS) provider, today announced that Sara Fenimore has been named corporate director of supply chain. William Hibbs and Laura Bradbury also have joined Intervala in newly created purchasing manager roles.

As director of supply chain, Fenimore is responsible for leading the strategy and day-to-day operations of Intervala’s global supply chain across multiple sites. She joined Intervala from ILC Dover, where she served as supply chain manager following a series of progressively responsible supply chain and procurement management roles for the company. Fenimore previously was employed as a buyer with defense prime contractor Leonardo DRS. She replaces Bill Nolan who recently retired after 19 years with Intervala.

“Managing our complex supply chain for the benefit of Intervala’s customers is critical to our business and part and parcel of our company culture,” said Teresa Huber, president and CEO. “It was with these priorities and our future growth in mind, that we expanded our supply chain team to include purchasing manager roles.”

Hibbs joined Intervala from Kitron Technologies, Inc. where he served as supply chain manager. Kitron is a provider of high-reliability products for a variety of markets, including medical devices, aerospace and defense, and industrial.

Bradbury was previously employed as purchasing and planning manager for HIPER Global (formerly, Network Allies), which designs industrial, military and medical computing systems for customers in the industrial, communications, defense and medical appliance markets.

“Intervala has built a strong, world-class supply chain organization that is tuned to our customers’ requirements,” said Huber. “We are excited to welcome Sara, Bill and Laura to Intervala and look forward to the contributions of these three accomplished supply chain professionals.

SIOUX FALLS, SD – Electronic Systems, Inc. is pleased to announce the purchase of an ERSA VERSAFLOW 3/45 machine as an addition to our existing selective soldering equipment. To keep up with increasing demands, Electronic Systems, Inc. will not only increase Soldering capacity and improve flexibility, but also meet customers’ increasingly diverse product needs.

“This addition of new equipment will further advance our services for our customers and the markets we serve. From our experience, Ersa has always been viewed as the leader in selective soldering equipment and they continue to be a trusted source for us.” said Gary Larson, President of ESI.

“With designs becoming more intricate all the time, versatile, high-accuracy selective solder is the future of the EMS business,” said Larry Jark, ESI Technical Resources Manager. “The VERSAFLOW is top-of-the-line technology offering many enhancements that will help us to meet our customers’ ever-changing and diverse needs well into the future.”

CLINTON, NY – Indium Corporation technical support engineer Ryan Mayberry will host a webinar about optimizing reflowed solder thermal interface material (sTIM) processes for emerging heterogeneous integrated assembly (HIA) packages. The webinar, a part of the company’s InSIDER Series, will be held live at 2:00 p.m. (EST), March 30, and made available for on-demand viewing afterward.

Reflowed indium metal has for decades been the standard for sTIMs in most high-performance computing (HPC) TIM1 applications. The IEEE heterogeneous integration thermal roadmap states that new thermal interface material solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed sTIMs in both CPU and GPU “die to lid/heat spreader” (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses.

In this webinar, Mayberry will present on the effects of reflow methodology, solder flux type/fluxless processing, and preform design parameters, such as alloy type. Data will be provided on various reflow processes including pressure (autoclave) and vacuum reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultra-low voiding. The use of sTIMs in the context of alternative TIM applications and technologies, such as thermal greases, pads, and phase change materials, as well as liquid metals, will also be considered.

You may register for Mayberry’s webinar at: https://indium.news/sTIMsWebinar. The webinar link will be shared with registrants the day of the event. Registrants must use a company email account to avoid Indium Corporation’s spam filters. This is a first-come, first-served event.

As a technical support engineer, Mayberry is responsible for providing technical assistance to resolve soldering process-related issues. This includes assisting customers with optimizing their use of Indium Corporation’s soldering materials, as well as providing product and process training to current and potential customers. Prior to Indium Corporation, he was a R&D scientist for a global metallization paste business, where he developed novel glass and paste metallization compositions tailored for emerging technologies. Mayberry holds a bachelor’s degree in materials science and engineering from Rutgers University, N.J. He is a Certified SMT Process Engineer (CSMTPE) and is certified as a Lean Six Sigma Green Belt.