Press Releases
CHICAGO – In a strategic move to enhance its presence in the electronics market, Bimos, a leading innovator in seating for industrial and laboratory environments, proudly announces the appointment of Don Dennison as its new representative for ESD Seating, covering the Northeast. This partnership is set to redefine standards in ergonomic and safe seating solutions within the electronics sector.
Don Dennison, known for his extensive experience and significant contributions to the electronics industry through his leadership at PIT – Equipment Services, LLC, brings a wealth of knowledge and a track record of success to Bimos. His expertise will be instrumental in introducing Bimos’ high-quality, ergonomically designed ESD seating solutions to a market that demands precision, reliability, and comfort.
“Bimos' ESD seating solutions stand out for their innovative design and exceptional ergonomics, ensuring that they meet the rigorous demands of the electronics industry,” commented Dennison. “Their commitment to quality, combined with a focus on ergonomic benefits, makes these chairs essential for any high- tech workspace. I’m excited to represent a brand that so perfectly aligns with the needs of our clients, providing not just seating, but a foundation for better work and health.”
“We are thrilled to have Don Dennison on board to introduce our ESD seating solutions to the electronics market,” added Mark Scelfo, US Managing Director, Bimos. “His expertise and deep understanding of the industry’s needs make him the ideal partner for Bimos. This is a significant step forward in our mission to enhance workplace ergonomics and safety. We are excited about the opportunities this partnership will unlock and look forward to making a substantial impact on the electronics sector together.”
Bimos’ ESD seating offering, including the acclaimed Neon, Nexxit and Labsit series, is designed to meet the specific requirements for the electronics industry. The Bimos products embody the brand’s commitment to design innovation, exceptional quality, safety certifications and ergonomic excellence, making them a preferred choice for businesses looking to invest in their employees' health and productivity.
For more information about Bimos and its ESD seating solutions, please visit https://www.bimos.com/B/uk-en/products/esd-area
OLDHAM, UK – Solderstar, a global leader in temperature profiling equipment for soldering processes, is set to showcase its latest innovation, the Reflow Shuttle with O2 measurement module, at the IPC Apex Expo 2024 from April 9th to 11th. This eagerly anticipated event, to be held in Anaheim, California, marks Solderstar's debut presentation of this advanced new technology to the US market.
The Reflow Shuttle O2 represents a significant advancement as the first repeatable verification tool that combines real-time oxygen (O2) measurement in parts per million (ppm), vibration levels in three axes, vacuum reading, temperature profiles, and conveyor speed onto a single robust platform. This ground-breaking consolidation of key parameters gives manufacturers comprehensive insights to make informed decisions and optimize their reflow soldering processes to achieve higher precision in their advanced soldering applications.
Precise control over O2 levels is paramount in electronics manufacturing due to its potential impact on solder joint quality. Oxygen can lead to oxide formation on metal surfaces during heating, purging the reflow process with nitrogen results in improved wetting and solder joint integrity. The Reflow Shuttle O2 enables granular monitoring of oxygen levels within each zone, allowing nitrogen consumption to be quantified and process issues detected such as oven sealing issues.
CEO of Solderstar, Mark Stansfield said: "Reflow soldering demands precision and control. The Reflow Shuttle O2 delivers a detailed insight into critical parameters, equipping manufacturers with the tools needed for informed decision-making and process optimization. By consolidating measurement systems onto a single, robust platform, including O2 ppm, vibration levels, vacuum, temperature profiles, and conveyor speed, we're providing manufacturers with the knowledge to enhance quality and efficiency in their soldering operations with a single pass through the machine.
“We're looking forward to introducing this solution to visitors at IPC Apex, demonstrating our ongoing commitment to advancing industry standards."
A key feature of the Reflow Shuttle O2 is its zone-by-zone analysis of oxygen levels throughout the reflow process. This granular insight allows manufacturers to monitor oxygen content precisely and detect nitrogen leaks throughout the oven zones, pinpointing any oxygen fluctuations. Manufacturers can use this data to optimize nitrogen consumption and ensure process quality is maintained.
Moreover, the Reflow Shuttle O2 offers seamless integration into existing reflow ovens, eliminating downtime during verification. Its user-friendly interface enables machine operators to initiate data collection effortlessly, facilitating immediate adjustments if irregularities are detected. The tool's versatile design, including a specially designed battery pack and Smartlink connector, ensures uninterrupted verification across multiple production lines.
In addition to the Reflow Shuttle O2, Solderstar will also showcase its zero set-up SLX thermal profiler during the exhibition. The SLX unit, renowned for its accuracy and compact design, offers comprehensive data capture capabilities, further enhancing process control and product quality.
Attendees are invited to visit Booth 2538 at IPC Apex Expo 2024 in Anaheim, California, to see the new Reflow Shuttle O2 in action and explore Solderstar’s latest profiling equipment for reflow, wave, vapor, and selective soldering.
MARKHAM, ON – Bittele Electronics, a leading provider of prototype and small-to-mid volume PCB assembly services, announces the expansion of its Markham assembly facility. The strategic move aims to improve inventory accuracy and streamline operations for valued customers.
The expansion primarily focuses on enhancing the component warehouse, allowing Bittele Electronics to provide more storage space for consigned inventory. As extended part lead times continue to challenge the component market, Bittele Electronics recognizes the importance of efficient inventory management. With the expanded warehouse, the company can now store consigned parts for ongoing and upcoming orders. Additionally, they offer the option of purchasing and stocking critical items from a customer’s Bill of Materials (BOM) upon request.
Ben Peng Yang, CEO of Bittele Electronics, expressed his enthusiasm about the expansion: “We are committed to delivering exceptional service to our clients. By expanding our Markham facility, we strengthen our ability to meet their needs promptly and accurately. The increased storage capacity ensures that our inventory remains well-organized and readily accessible.”
In addition to the expanded warehouse, Bittele Electronics has invested in cutting-edge technology. They have recently installed a new Soltec Wave Soldering Machine, which will be utilized for larger-volume, through-hole assembly. This addition complements their existing Ersa Selective Soldering Machine and will be operational later this summer.
Bittele Electronics remains dedicated to innovation, quality, and customer satisfaction. Their expanded facility reflects their commitment to staying at the forefront of the electronics manufacturing industry.
SAN DIEGO – KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, will exhibit its latest breakthrough technology, Contact-less Thermal Analysis TM , at the SMTA Dallas Expo and Tech Forum. The event will take place on Tuesday, March 19, 2024 at the Plano Event Center.
In response to the ever-evolving challenges faced by today's manufacturing industry, KIC is proud to introduce Contact-less Thermal Analysis TM , a revolutionary advancement in electronics manufacturing. This groundbreaking technology directly measures board temperatures during production, enabling real-time monitoring of temperature and convection changes.
KIC's Contact-less Thermal Analysis TM is designed to redefine precision in reflow profiles by directly measuring board temperature at the end of the heated section of the reflow oven during production. This innovative capability ensures unparalleled accuracy and quality in monitoring the oven's influence on production boards, marking a monumental leap in reflow process inspection technology.
Furthermore KIC will be introducing its new profiling software platform, Thermal Analysis System, with the addition of a new recipe optimization search mode called Common Recipe Finder TM . The Thermal Analysis System software offers a state of the art User Interface, allowing complete flexibility in reflow and wave recipe setup with a “browser-like” user experience. Common Recipe Finder TM allows you to find a single recipe for multiple assemblies, streamlining your changeover time, and improving equipment utilization and OEE.
Visit KIC at the SMTA Dallas Expo & Tech Forum to engage with thermal process experts, learn more about Contact-less Thermal Analysis TM , and explore solutions for soldering and curing processes in electronics manufacturing and semiconductor advanced packaging. Learn more about KIC's Contact-less Thermal Analysis TM and Convection Detection at www.kicthermal.com/reflowheattransfer
For more information about KIC and its revolutionary solutions, please visit www.kicthermal.com
WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the administration’s launch of over $5 billion in semiconductor R&D investments through the National Semiconductor Technology Center (NSTC), as well as funding for vital semiconductor workforce initiatives and other programs. The NSTC is a critically important entity established by the CHIPS and Science Act of 2022 to promote U.S. semiconductor R&D. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
“Today’s announcement ushers in the next phase of implementing the landmark semiconductor R&D and workforce initiatives in the CHIPS and Science Act and fulfilling its tremendous promise to reinforce America’s economy, national security, and technological leadership. We applaud leaders in Washington for advancing funding for the NSTC and other vital semiconductor programs. I was honored to attend today’s announcement at the White House, and we look forward to continuing to work with the administration to ensure effective and expeditious implementation of these initiatives, which will strengthen U.S. semiconductor innovation, production, and the domestic chip workforce for many years to come.”
Semiconductor R&D fuels America’s economic growth, national security, and technological competitiveness. The NSTC was established to invigorate semiconductor innovation in the U.S. and drive workforce development opportunities to meet the needs of our rapidly growing industry.
SIA and the Boston Consulting Group (BCG) in October 2022 released a report identifying five key areas of the semiconductor R&D ecosystem that should be strengthened by the CHIPS Act’s R&D funding. The report, titled “American Semiconductor Research: Leadership Through Innovation,” highlights the importance of government-industry collaboration on the NSTC and the National Advanced Packaging Manufacturing Program (NAPMP). The study also calls for CHIPS funding to be used to bridge key gaps in the current semiconductor R&D ecosystem to help pave the way for sustained U.S. chip innovation leadership.
The CHIPS Act’s manufacturing incentives have already sparked substantial investments in the U.S. In fact, companies in the semiconductor ecosystem have announced dozens of new projects across America—totaling more than $220 billion in private investments—since the CHIPS Act was introduced. These announced projects will create more than 40,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout this economy.
CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming IPC APEX EXPO 2024 taking place April 9-11 at the Anaheim Convention Center in Anaheim, California. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.
NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.
AIM’s Timothy O’Neill and Gayle Towell will also be presenting a paper titled “Advancing the Understanding of Low-Temperature Solder in Electronics Rework and Assembly.” This presentation will outline the current low-temperature solder landscape, unveil new research and the case for low temperature rework, and discuss use cases and the future prospects of low-temperature solder more broadly.
Timothy O'Neill is the Director of Product Management for AIM Solder. Mr. O’Neill has over 25 years of industry experience and is a Certified IPC Specialist. He is a technical writer and presenter for industry trade publications and events and has been recognized as a Speaker of Distinction by the SMTA. Gayle Towell is AIM Solder’s Content Specialist. Holding master’s degrees in both mathematics and physics from the University of Oregon, Mrs. Towell facilitates communications, develops presentations, and ensures AIM's technical papers and documentations meet the highest scientific standards.
To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the IPC APEX EXPO, booth 1623 April 9-11, or visit www.aimsolder.com. To catch the presentation on low temperature solder, attend Assembly Materials Session 1 on Wednesday, April 10 from 1:30-3:00PM.
