OULU, FINLAND – Scanfil and Framery have signed a framework agreement on the manufacture of components that contain electronics at the factories in Pärnu, Estonia. Framery is a Finnish pioneer in the design and manufacture of soundproof workspaces.

“We are happy that Framery chose us as the production partner for its value chain. Framery is a dynamic company with a great new product range. Together, we can support Framery’s value chain in terms of quality and competitiveness while taking into account both companies’ social responsibility goals”, says Juuso Boman, Global Account Manager at Scanfil.

Framery’s story started in 2010 when it was observed how office background noises disturb the working environment, thereby impacting job satisfaction and performance. From the moment the company was founded, it has grown rapidly, reaching the milestone of EUR 151 million in 2023. Framery employs 440 people, and the company’s products are exported to 90 countries.

The launch of the new Smart Pod range introduces significantly more intelligent functions and technology in Framery’s workspaces. As we bring next-generation products and novel office technology to the market, we need the best possible suppliers and partners. We want to make the best pods in the world and ensure an optimized supply chain, thereby reaching high levels of customer satisfaction today as well as in the future, says Karolina Aromaa, Senior Sourcing Manager at Framery.

More information about Framery and the soundproof workspaces that the company designs and manufactures is available at: https://www.frameryacoustics.com/en/

HAVERHILL, MA – Seica, Inc. is pleased to announce its participation in SEMICON West 2024, where it will be showcasing the groundbreaking Pilot VX, a flexible and configurable flying probe test system that sets new standards in test performance for electronic board manufacturers. Attendees can visit Seica at Booth 6048 at the SEMICON West event, held at the Moscone Center in San Francisco from July 9-11, 2024.

The Pilot VX is engineered to address the critical needs of today’s diverse electronics industry, providing unmatched versatility and cutting-edge technology to optimize testing processes and investment returns. Seica’s innovative solutions offer significant advancements in time reduction, flexibility, traceability, precision and automation.

Key Features of the Pilot VX:

Unrivaled Time Efficiency: The Pilot VX reduces test time by 50% through state-of-the-art mechanical performance and motion control. With 12 multi-function test heads capable of contacting up to 60 points simultaneously, the system’s advanced measurement hardware and optimized VIVA software enable parallel testing, significantly saving time and costs. Smart analysis capabilities and AI-based algorithms further streamline the test flow, ensuring comprehensive test coverage.

Unmatched Flexibility: The Pilot VX’s adaptable configuration allows manufacturers to meet diverse production needs with a single system or optimize throughput by integrating multiple systems. This flexibility supports various test requirements, from simple bare printed circuit boards to complex, fully loaded double-sided boards, wafers, probe cards and components that require programming, including LEDs, flex circuits, and very large or small boards.

Comprehensive Traceability: The Pilot VX offers complete visibility of the test process, essential for certifying product quality and improving yields. It stores detailed data, including the mechanical pressure applied by test probes, available for visual, graphical, and statistical analysis, enhancing upstream manufacturing processes.

High Precision Performance: With positioning precision of +/- 10µm, the Pilot VX excels in probing miniaturized circuits and measuring small electrical values. It can probe 30µm pads, measure capacitances as low as 0.05pF, resistances of 100 µohms, and perform inspections of 01005 SMDs with its integrated laser tool.

Advanced Automation: In an era of pervasive automation, the Pilot VX integrates seamlessly into roboticized production lines. The Seica Asset Manager (SAM) software suite connects test systems to factory MES and supervises all line assets according to MQTT Broker IIOT standards. This allows remote monitoring and management via the customizable Seica Dashboard App on PCs, tablets, and mobile devices.

Visit Seica at SEMICON West 2024

Join us at Booth 6048 at SEMICON West 2024 to see the Pilot VX in action and learn how Seica’s advanced test solutions can transform your electronic manufacturing processes. Our team of experts will be available to discuss the capabilities of the Pilot VX and how it can meet your specific needs.

To learn more about Seica’s Pilot VX, visit www.seica.com 

GUADALAJARA, MEXICO – Test Research, Inc. (TRI), the leading Test and Inspection systems provider for the electronics manufacturing industry, recently opened a new office in Guadalajara, Mexico, to accommodate the industry's rapid growth.

Company Name: Test Research Innovation Mexico
Address: Av. Vallarta 6503, Local E-36, Col. Cd. Granja, Zapopan, Jal., C.P 45010, México
Phone: +52 33 3794 8756
Email: trimx@tri.com.tw 

TRI's expansion in Mexico emphasizes its commitment to serving its growing customer base, reinforcing support and sales efforts in this vital region as part of its global growth.

TRI's Test and Inspection solutions range from Optical Inspection to Board Testing. These innovations optimize the electronics manufacturing production through AI-powered algorithms, precise metrology, smart programming, multiple sensing technologies, real-time SPC trends, and M2M communications. TRI's Smart Factory solutions comply with Industry 4.0 standards, such as the IPC-Hermes-9852, the IPC-DPMX, and the Connected Factory Exchange (IPC- CFX).

SCHRAMBERG, GERMANY – To achieve a CO2-neutral world and an All-Electric Society, where electricity is the primary energy source, innovations like high power densities, reduced losses and system cost advantages are essential. However, the All-Electric Society also requires innovation and collaboration among companies working in these very technology areas to achieve a sustainable transition to energy efficiency. Two traditional companies in the microelectronics ecosystem are now forming a strategic partnership in the field of power embedding. The common goal – a proven increase in efficiency – will be achieved with the p² Pack® embedding technology and its possible applications. This will create added value for the industrial and automotive markets and thus for climate protection and our society.

The power embedding partnership for Schweizer Electronic AG’s p² Pack® technology is a design-in collaboration that operates at multiple levels, from design support to system provider. The cooperation will enable a wider range of customers to gain access to power embedding technology. Zollner will provide customers with the support they need to move from traditional designs to embedding design in their products to maximize the technology’s benefits. The partnership will also enable Zollner to integrate the technology directly into its own applications. This partnership is a significant growth opportunity for both companies, fostering the development of new applications and expanding their customer base.

Schweizer Electronic AG’s p² Pack® is a power embedding technology that integrates SiC chips directly into printed circuit boards. All applications requiring high power switching can benefit from the advantages of this technology. The most important applications are in the conversion between DC and AC systems. These systems are increasingly confronted with higher power requirements and with expectations for high energy efficiency, maximum reliability and long service life. Schweizer Electronic AG has already been able to demonstrate the superior performance, advantages, and savings that this technology brings to the market in recent years: the patented cutting-edge technology contains both extensive development experience and technological depth, which is already being used in series production by major Tier-1 companies in Europe.

Nicolas-Fabian Schweizer, CEO of Schweizer Electronic AG, is looking forward to the future partnership and collaboration: “Zollner will benefit from our expertise in complex PCB and chip embedding while we will gain from their extensive application knowledge as a leading European EMS service provider. This synergy is a powerful multiplier for both companies and creates the best conditions for innovation! Both family owned, based in Southern Germany and highly specialized, this partnership is a natural fit!” Nicolas Schweizer is the 6th generation to lead the family business of the same name, which is headquartered in Schramberg and has five locations worldwide. SCHWEIZER is one of Europe’s largest suppliers of printed circuit boards and embedding technologies, with a portfolio that includes RF & sensor technology, logic circuits and various technologies for power electronics technologies, including p² Pack.

Ludwig Zollner, CEO of Zollner Elektronik AG, is optimistic about the future collaboration: “We see SCHWEIZER as a partner with whom we can offer our European customers a first-class service. Power embedding is an important topic for the future and we are convinced that we will be able to use the synergy effects resulting from the cooperation to offer our customers added value. We look forward to working together and using the innovative power embedding technology to implement challenging projects!”