DORNSTADT, GERMANY – The ASYS Group, a leading provider of automation solutions, announces the establishment of ASYS Automation Switzerland AG. From January 1, 2025, the newly founded company will take over responsibility for sales and service of all three business units of the ASYS Group – Electronics, Life Science and Energy – in Switzerland.

With this strategic step, the ASYS Group is intensifying its presence in the region and underlining its long-term commitment to supporting its Swiss customers. “The establishment of ASYS Automation Switzerland AG enables us to be even closer to our customers and to support them locally with first-class solutions and services,” explains Thomas Endler, Head of Sales DACH + BeNeLux at ASYS Group.

Special thanks go to Delsys AG, the ASYS Group's previous distributor in Switzerland. “The long-standing and successful cooperation with Delsys AG has played a decisive role in establishing our products and services in Switzerland. We would like to express our sincere thanks for this commitment and look forward to building on it,” emphasizes Endler.

The new Swiss subsidiary is located in Steinhausen in the canton of Zug and offers customers a central point of contact:

ASYS Automation Switzerland AG
Sumpfstrasse 26
6312 Steinhausen
Switzerland
E-Mail: info.switzerland@asys-group.com 

With this expansion, the ASYS Group continues to position itself as a reliable partner for innovative automation solutions in Switzerland and worldwide. Customers benefit from direct support, short communication channels and customized solutions for a wide range of industries.

CLINTON, NY – Indium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to global electronics, semiconductor, thin-film, and thermal management industries, today announced the advancement of two executives to top posts in the corporation. Former CEO Greg Evans now serves as executive chair of the board of directors. Ross Berntson has been appointed CEO and continues as president.

As executive chair, Evans provides guidance to the organization, facilitating a constructive and collaborative agenda that supports the CEO's leadership. His duties also include facilitating communication between the board and executive management and providing guidance and support in the strategic and operational execution of the corporation's objectives.

“During Greg’s tenure, Indium Corporation achieved significant growth by creating value for our customers through the delivery of innovative technical support and the development of yield- and productivity-enhancing products,” said Libby Macartney Mitchell, Indium Corporation owner and president of The Indium Corporation & Macartney Family Foundation. “Most importantly, Greg has led and supported our Indium Corporation culture, instilling the core values of respect, appreciation, and achievement.”

As president and CEO, Berntson is responsible for the overall strategic direction and key decision-making that impacts the company's future. His focus will be nurturing and promoting the Indium Corporation culture, in which employee aspirations, ingenuity, and creativity continue to flourish. Additionally, Berntson will keep a high priority on the company's growth and development, particularly innovations and capabilities that anticipate customer needs and further advance the industry.

Berntson joined Indium Corporation in 1996 and has had a career marked by leadership positions in product management, market development, and technical support. During his tenure as president and COO, significant advances were achieved in all functions and global activities, strengthening Indium Corporation’s promise of exceptional materials science and best-in-class technical support. His immersion in global operations also included serving as president of Indium Corporation’s Asia Holdings, living in Singapore for two years to be directly involved in the needs and opportunities in Southeast Asia and China. Through Berntson’s leadership, Indium Corporation has achieved stable and robust growth, including expansion into multiple markets around the world.

“Ross has promoted creativity, curiosity, and innovation across all areas of our company,” said Mitchell. “Under his leadership, Indium Corporation has advanced in its organizational structure and in operational capabilities that are core to our growth, stability, and strength.”

“Throughout their decades of service, these two exceptional leaders have contributed to nearly every aspect of Indium Corporation’s growth and success,” said William Macartney IV, Indium Corporation owner. “Thanks to our company founders, superior employees, and leaders like Greg and Ross, our company has grown from 100 employees to approaching 1,500 employees, as well as from one facility in Utica, N.Y., to 16 facilities in the United States, United Kingdom, Singapore, China, South Korea, India, Germany, and Malaysia.”

CHELMSFORD, MA – VJ Electronix, Inc., a global leader in advanced rework technologies, is excited to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum. The event will take place on Thursday, December 5, 2024, from 8:30 a.m. to 3:30 p.m. (US Pacific) at the Fremont Marriott Silicon Valley in Fremont, CA.

Attendees will have the opportunity to explore VJ Electronix’s cutting-edge rework solutions, including the Summit LT120 and Summit LXi, systems specifically designed to handle large boards and components with unmatched precision and efficiency. These systems set the benchmark for rework performance, making them the go-to solutions for 5G and advanced large-board applications.

Summit LT120: High-Performance Rework for Extra-Large Components

The Summit LT120 is engineered to tackle the most challenging rework tasks, capable of handling components as large as 120 x 120mm and boards up to 25” x 47”. Key features include:

• 1-2-3-GO Software: Simplifies operation with intuitive thermal profile development and automatic rework sequences.
• Efficient Convection Heating: Delivers high thermal uniformity and repeatable rework processes.
• Non-Contact Site Scavenging: Automatically removes residual solder without risking damage to pads or solder masks.
• Dynamic Height Sensing (DHS): Ensures precise scavenger tip-to-board gap, guaranteeing consistent results.

Summit LXi: Precision Rework for Large Boards

The Summit LXi is ideal for reworking very large boards, with capabilities including:

• Board Capacity: Handles boards up to 25” x 47” and components as small as 01005.
• Automatic Alignment: Two-color LED optical alignment and motorized Z, Theta, and optional X-Y axes ensure precise component placement.
• MES Integration: Provides comprehensive traceability and profile sharing between systems.
• Advanced Profile Analysis: Streamlines thermal profile development for efficient and repeatable rework.

Both systems are designed for the demanding requirements of modern manufacturing, offering robust capabilities for applications in 5G, aerospace, and defense.

“We are thrilled to showcase our Summit LT120 and Summit LXi systems at the SMTA Silicon Valley Expo,” said David Hamel, Director of Global Sales and Marketing at VJ Electronix. “These rework solutions exemplify our commitment to advancing the industry with innovative, high-performance technologies that meet the challenges of today’s electronics manufacturing.”

For more information about VJ Electronix and its range of rework technologies, X-ray inspection systems and component counting solutions, visit www.vjelectronix.com 

PEORIA, AZ ― HyRel Technologies, a global provider of quick-turn semiconductor modification solutions, is proud to announce the sale of its first Versacell Robotic Solder Dip & BGA Reballing System to one of the top five defense contractors. Originally developed for internal use, the revolutionary Versacell System drew the attention of the contractor, who recognized its impressive precision, accuracy, and efficiency.

The Versacell System is intended to be the most precise and efficient soldering and reballing platform in the world, featuring a custom robotic architecture and modular capabilities. It supports a variety of applications, including solder dipping, BGA reballing, and pick-and-place operations. The Versacell can accommodate a wide arrat of solder pots, reels, trays, tubes, or custom-designed fixtures, making it a versatile solution for even the most demanding manufacturing environments.

“We originally developed the Versacell System to address our own internal needs, but its capabilities quickly attracted the attention of our customer,” said Brian Watson, founder of HyRel. “Its touchless technology for tin dendrite removal and solder alloy replacement ensures reliability and quality, redefining industry standards for component processing. We’re thrilled to see a leading defense contractor recognize its value and integrate it into their operations.”

The Versacell System is designed to cater to industries where precision and reliability are critical, including defense, aerospace, and high-reliability electronics. By combining cutting-edge robotics with modular flexibility, HyRel’s Versacell is poised to set a new standard for soldering and reballing equipment worldwide.

For more information, visit www.HyRel.tech