Press Releases
AUSTIN, TX - ROCKA Solutions Mexico is proud to announce its new partnership with Hanwha Semitech Americas as the exclusive sales representative in Mexico. Under this agreement, ROCKA provides Hanwha’s full range of award-winning SMT assembly solutions exclusively in Mexico.
Hanwha Semitech is a globally recognized leader in advanced automation solutions, providing cutting-edge equipment designed to maximize productivity, flexibility, and efficiency. The company’s award-winning precision machinery solutions cover a wide range of applications, including semiconductor manufacturing (flip chip & die bonders), microLED (HM520h), odd-form/hybrid (SM485P), and conventional component mounting (HM, Decan, and SM series pick-and-place systems).
Hanwha’s single-source, fully supported PCB assembly line solutions include printing, pick-and-place, inspection, reflow, and board handling equipment, ensuring seamless integration for any production environment.
“With this exclusive partnership, ROCKA Mexico is well-positioned to bring Hanwha’s industry-leading automation solutions to manufacturers across Mexico,” said Rodrigo Cacho, President & CEO of ROCKA Solutions. “The ROCKA team has a strong reputation in the territory for providing customers with the most effective solutions to help them excel in their respective markets.”
Founded in 2018, ROCKA Solutions is a North American company with over 35 years of combined industry experience and an international presence in Mexico, the United States, Canada, Brazil, an Argentina. The company specializes in warehousing, new technology distribution, shipping solutions, and technical expertise for the electronics and mechanical industries. As an active member of SMTA, with certified Black Belt, SMTA, and IPC engineers, ROCKA Solutions provides unmatched technical support and market insight.
By partnering with Hanwha Semitech, ROCKA expands its product offerings in Mexico along with its reputation for competitive pricing, inventory management, on-time deliveries, and expert technical assistance. The partnership ensures that manufacturers in Mexico can access the highest quality automation solutions, backed by local storage, service, and support.
PUNE, INDIA - Atlas Copco Tools and Assembly Systems has officially launched its first Smart Factory Innovation Centre in India, located in Pune. This cutting-edge facility is designed to highlight the latest technologies driving Smart Integrated Assembly systems. It will serve as a central hub for innovation, collaboration, and hands-on experiences, providing businesses across industries like automotive, aerospace, electronics, heavy machinery, and manufacturing with an opportunity to explore next-generation automation and smart manufacturing solutions aimed at achieving zero-defect production.
Visitors to the Innovation Centre can experience firsthand the latest advancements in torquing and dispensing technologies. The centre will demonstrate how software-driven solutions are transforming manufacturing efficiency, offering flexibility in processes, and supporting sustainability goals. This initiative reflects Atlas Copco’s commitment to Industry 4.0, helping industries streamline their operations and build smarter, more efficient production systems.
he Innovation Centre is not only a showcase of cutting-edge technologies but also a collaborative space where businesses can explore tailored solutions and address specific manufacturing challenges. It provides an opportunity for companies to engage with advanced systems that enhance operational efficiency and productivity. By combining live demonstrations with practical applications, the centre fosters a deeper understanding of how these technologies can be integrated into real-world production environments.
Key features of the Innovation Centre include Automated Tightening and Dispensing Technologies, which offer live demonstrations of fully automated solutions designed to improve precision and productivity. These systems help streamline assembly processes while reducing human error. Additionally, the Error Proofing Solutions demonstrate how modern technologies can seamlessly integrate into production lines to minimize defects and rework, significantly lowering operational costs and improving overall quality.
The centre also highlights Software Suite Integration, which provides businesses with real-time insights for better quality control and the achievement of zero-defect manufacturing. Smart Integrated Assembly solutions further align with sustainability goals, helping companies reduce their carbon footprint while improving operational efficiency. Together, these innovations pave the way for smarter,
Chandrashekhar Pathak, General Manager of Industrial Technique at Atlas Copco India Pvt. Ltd., expressed, “Our Innovation Centre is about more than just showcasing technology; it’s about fostering collaboration and driving growth across industries. This new centre marks a key step in our commitment to Industry 4.0 and smart manufacturing. By integrating intelligent tightening and torquing technologies, we’re not only boosting efficiency but also helping to create a more sustainable and intelligent manufacturing ecosystem.”
With the launch of this centre, Atlas Copco aims to accelerate the adoption of smart manufacturing technologies across India and globally, providing businesses with the tools to increase productivity, sustainability, and quality. By offering a dedicated space for experimentation, testing, and problem-solving, the Innovation Centre will support companies in navigating the challenges of modern manufacturing. Atlas Copco continues to lead the way in developing products and solutions that empower customers to succeed in an increasingly competitive global market.
PEORIA, AZ - HyRel Technologies, a global provider of quick turn semiconductor modification solutions, is proud to announce its selection as one of only 25 companies nationwide to participate in the highly competitive Blackstone LaunchPad Summer 2025 Internship Program. Through this program, HyRel Technologies has secured one of 40 available internships, providing a valuable opportunity for students to gain hands-on experience in the industry.
Blackstone LaunchPad is a nationally recognized initiative designed to connect students with high-growth companies, fostering career development and innovation. The program is open exclusively to students from Arizona State University (ASU) and Maricopa County Community College District (MCCCD).
“We are honored to be part of such a prestigious program,” said Brian Watson, Founder at HyRel Technologies. “This internship represents a unique opportunity for students to gain real-world experience in advanced manufacturing and technology while contributing to cutting-edge projects at HyRel.”
How to Apply
Students interested in applying must first join the Blackstone LaunchPad WorldLabs group to ensure proper data tracking and program eligibility. They can then search for HyRel Technologies within the platform to locate available internship positions. For more information and to apply, visit: Blackstone LaunchPad Internships .
HyRel is dedicated to not only advancing its business but also to fostering the growth and potential of individuals who will shape the future of the semiconductor industry. For more information about HyRel’s innovative internship program and its dedication to community engagement, visit www.HyRel.tech .
About HyRel Technologies
HyRel is a worldwide provider of high quality, quick turn semiconductor modification solutions serving the military, space, automotive, energy and commercial markets to companies seeking to improve product reliability. HyRel provides robotic hot solder component tinning, component solder ball removal and replacement, component tape and reel packaging services and component bake and dry pack services to customers worldwide. HyRel is also developing proprietary micorobotic innovations to elevate the speed, reliability, and safety of standard semiconductor processes. For more information about HyRel Technologies, please visit www.HyRel.tech.
NORTH BILLERICA, MA - BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is pleased to announce an exclusive webinar, Solder Reflow Oven Fundamentals and Thermal Profiling Approaches, hosted by E-Tronix, BTU’s representative. This in-depth session, presented by Bob Bouchard, will equip SMT engineers, process managers, and production supervisors with the knowledge and tools to optimize their reflow processes for maximum yield and reliability.
Scheduled to take place Thursday, April 17th, from 1-2 p.m. CST, this webinar will cover key aspects of reflow oven technology, including:
- Heating methods and atmosphere control
- Hardware configurations and thermal profiling
- Aligning profiles with solder paste specifications
- Process monitoring and troubleshooting strategies
Participants will gain valuable insights into fine-tuning thermal profiles, leveraging process monitoring tools, and addressing common challenges in PCB manufacturing. By attending, industry professionals will walk away with practical techniques to enhance soldering quality, improve process consistency, and reduce defects.
Don’t miss this opportunity to elevate your reflow soldering expertise!
Register now: https://meet.zoho.com/qAeP-C9f-NmC
For more information about BTU International and its industry-leading reflow solutions, visit www.btu.com.
About BTU International
BTU International, a wholly-owned subsidiary of Amtech Group, is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, and sintering. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available at www.btu.com.
ANN ARBOR, MI - Aven proudly announces that Tom Jura and Jon Moore of Z TECH SERVICES, INC. have achieved the Sales Buster Goal Award for 12 consecutive months — a first in the company’s history. This remarkable accomplishment is a result of their exceptional dedication and sales performance.
Aven’s Sales Buster program, in place for nearly a decade, sets ambitious monthly sales targets for field representatives, rewarding those who meet these goals with commission bonuses. Achieving this award for an entire year without interruption is unprecedented, highlighting the outstanding efforts of Jura and Moore.
Z TECH was established in 1993 and serves Illinois, Kentucky, Indiana, Michigan, Wisconsin, Iowa, Missouri, Kansas, and Nebraska with a sales
staff that combines experience and technical ability to provide clients with an efficient and effective sales call.
Z TECH represents Aven’s product line, featuring over 750 tools for optical inspection and precision assembly. Their offerings include stationary and portable microscopes, video inspection systems, high-resolution digital and video cameras, lenses, illuminated magnifiers, software for image analysis, and various precision assembly tools.
For more information, visit www.aventools.com.
About Aven
Aven is a solutions provider for binocular & trinocular stereo zoom microscope systems; digital microscope systems, numerous led magnifier lights, and a wide variety of precision hand tools used for micro-assembly. Aven’s key customer markets are in the electronic assembly, military/ aerospace & defense, medical device manufacturing and more.
DALLAS, TX – The IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world’s semiconductor packaging industry, has for years organized special events for students. This year, given the urgent need for workforce development in this globally critical industry, the ECTC conference has made student engagement and involvement a major focus.
More than 2,000 scientists, engineers and businesspeople from more than 20 countries are expected to attend the 75th annual ECTC, which will take place May 27-30, 2025 at the Gaylord Texan Resort & Convention Center in Dallas, along with 135+ exhibitors.
In celebration of the 75th anniversary of this great conference, the ECTC Executive Committee is announcing three new initiatives to complement our existing student-focused offerings. They are a Local Student Engagement Program, a Student Volunteer Service Program, and a Student Competition. They aim to inspire students, enhance their participation, foster engagement, and provide valuable learning opportunities in the fascinating and fast-growing field of microelectronics packaging.
The three new student initiatives are:
- Local Student Engagement Program: On Wednesday, May 28, this program will bring ~25 students and their teachers and professors from local high schools/community colleges to the conference, offering a unique opportunity for young students to interact with industry professionals and gain insights into the electronics packaging and semiconductor manufacturing industries. ECTC will provide complimentary transportation and one-day registration to all participants. The agenda includes breakfast with ECTC Executive Committee members; attendance to the keynote presentation and an exclusive Q&A session with the keynote speaker; a guided tour of the Exhibit Hall and individual meetings with industry participants there; participation in the Wednesday morning Interactive Presentations session and discussions with the paper presenters; a luncheon with ECTC Technical Committee members; and a closing Q&A session with ECTC Executive Committee members. All participants will receive a certificate of attendance and a gift from the ECTC conference.
- Student Volunteer Service Program: This will enlist ECTC student attendees who have already chosen the electronic packaging industry as their career path to build and expand their professional network through working with ECTC Technical Committee members. Participating students will be assigned to technical sessions and will help the session chairs with session-related duties. The activities include breakfast with the session chairs, counting the attendees during the session for each talk, and collecting scoring sheets at the end of the session. The students will receive a certificate of appreciation from ECTC for their service.
- Student Competition: In this previously announced competition, students will describe their innovative solutions to enhance the thermal performance and reliability of high-temperature microelectronic components and systems in five key technical areas:
- Predictive Modeling and Mitigation of Warpage in Optical MEMS Bare Die Integration on PCB or Flex Substrate
- Modeling CTE Mismatch Effects in Multi-Material Packages
- Reducing Thermal Resistance and Improving Reliability in High-Temperature Power Electronics Modules
- Addressing Thermal-Mechanical Challenges in Heterogeneously Integrated Opto-Electronic Packages
- Developing a Condition Monitoring Concept for Electronic Components or Systems
- The winning three teams will present their work at the Student & Start-up Innovation Challenge on Wednesday, May 28 from 6:30–8:30 p.m. to an international audience of industry leaders, researchers, and academics.
ECTC 2025 offers other opportunities to students as well:
- Student Reception: On Tuesday, May 27 from 5-6 p.m., Texas Instruments will host a student reception during which students attending the conference can engage with members of the ECTC Executive Committee and top leaders from industry, research, and academia to explore the latest trends in microelectronics technology.
- Student Interactive Presentation (IP) session: On Friday, May 30 from 10 a.m. to noon, students whose papers have been accepted will present their research during this dedicated session, enabling them to receive direct feedback from industry and academic leaders on their work.
- Awards: ECTC recognizes students’ contributions to microelectronics packaging research through several prestigious awards. Intel sponsors the Intel Best Student Paper Award and the Intel Outstanding Student Paper Award to honor exceptional student research. Texas Instruments awards the TI Best IP Student Paper Award to the top student in the IP session.
- ECTC Student Travel Award: To encourage student participation, the IEEE Electronics Packaging Society which sponsors the ECTC conference offers the ECTC Student Travel Award, providing 15 students with a certificate and reimbursement for travel expenses (up to a specified limit).
Follow ECTC on social media
Flickr: https://www.flickr.com/photos/38916807@N07/albums/
LinkedIn: https://www.linkedin.com/groups/1916290/
About ECTC, EPS & IEEE
The ECTC technical program addresses new developments, trends and applications for a broad range of topics, including components, materials, assembly, reliability, modeling, interconnect design and technology, device and system packaging, heterogeneous integration, wafer level packaging, photonics and optoelectronics, IoT, 5G, quantum computing and systems, 2.5D and 3D integration technology, and other emerging technologies relevant to electronics packaging.
The IEEE’s Electronics Packaging Society (EPS) sponsors ECTC. EPS is the leading international forum for scientists and engineers engaged in research, design and development of revolutionary advances in microsystems packaging and manufacturing. It encompasses all aspects of packaging and integration of electrical, electronic, optoelectronic, biological, micromechanical and sensing components.
IEEE is the world’s largest technical professional organization and a public charity dedicated to advancing technology for the benefit of humanity. Through its highly cited publications, conferences, technology standards, and professional and educational activities, IEEE is the trusted voice on a wide variety of areas ranging from aerospace systems, computers, and telecommunications, to biomedical engineering, electric power, and consumer electronics.
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