NASHVILLE – KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (iMAPS) Wire Bonding 2025 Workshop and Tabletop Exhibition, scheduled to take place February 3-4 at the Westin San Diego Bayview. The KYZEN clean team will showcase multi-process power module cleaner MICRONOX MX2123 during the event.

With the continued rise in demand for high- performance advanced packaging devices, KYZEN remains dedicated to providing cleaning chemistries like MICRONOX MX2123 and process optimization services to meet the array of challenges faced by manufacturers.

MICRONOX MX2123 is a balanced, multi-phase chemistry designed to remove flux residues from a wide range of IGBT module devices that utilize combinations of copper, silver and nickel DBC as substrates. It can also remove fluxes from PCBs. MX2123 can remove slight metal oxidation from base metals for post wire bond and potting processes, leaving exceptional surface conditions after cleaning. It is effective at low temperatures, in low concentrations, and is easily monitored in in-line SIA or Ultrasonic Immersion cleaning systems.

The iMAPS Wire Bonding 2025 Workshop and Tabletop Exhibition is an advanced technical workshop presenting a unique forum to unite scientists, engineers, manufacturing, academia and others working in Wire Bonding. The workshop was established to provide a platform for presentations and debate regarding the latest technologies and applications of Wire Bonding use in battery pack, semiconductor, and microelectronic packaging.

For more information regarding these products and the full line of MICRONOX products, visit www.kyzen.com 

STEINACH, SWITZERLAND – Variosystems, the globally operating system provider for high-quality electronic solutions, reaches another milestone moment in the company's development. In opening of the global Engineering Service Center in Colombo, Sri Lanka, the company is expanding its engineering expertise to meet the demand for advanced services such as obsolescence management, electronics design and test development.

Electronics and test development, PCB layout design, embedded software engineering, proactive obsolescence management: all offered by Variosystems under a single roof at the global Engineering Service Center in Colombo. The globally active system provider for high-quality electronics solutions opens the new location in the capital of Sri Lanka. “Our customers continue to benefit from close support on the ground. We develop solutions and directly interact with customers at our regional engineering locations. The Service Center in Colombo is the backbone that supports this local presence with additional expertise and expanded capacities,” emphasizes Stephan Sonderegger, CEO of Variosystems.

Engineering expertise under a single roof


The new global Engineering Service Center in Colombo expands the portfolio of engineering services, increases capacities and supports the regional engineering organizations across Europe, North America, China and Asia-Pacific. “Using Colombo as a strategic location, we can draw on highly qualified talent and make the best use of being close to our production facility in Badalgama,” explains Markus Dillinger, Global Head of Engineering.

The Service Center team is set to grow to over 20 experts by 2027. “Our investments in personnel and technology reinforce our goal of providing even better support to customers across the globe,” continued Dillinger. Aside from PCB layout design and life cycle management, the extended services also include design-for-assembly, design-for-testability and design-for-manufacturing. Now that these are offered, the Service Center is strengthening its regional expertise, allowing the company to adapt to customer requirements even more precisely.

Regional customer experience combined with global support


For years, Variosystems has specialized in offering customers from across the globe individualized testing technology and development services. Alongside the regional teams, the existing network of test engineers works closely with the new location in Colombo to take both efficiency and quality to the next level. The customer experience remains clearly rooted in the regions here: Interacting with customers, individual customization and developing specific solutions will continue to take place at a local level across Europe, North America, China and Asia-Pacific. The Service Center in Colombo works as a central engine that supports and accelerates these processes.

Taking a strategic step into the future


By expanding its range of global engineering offers, Variosystems is following hard after its strategy of acting as a system provider along the entire value chain – from development, industrialization and production through to life cycle management.

The acquisition of development partner SOLVE and rapid prototyping specialist KUBEG in recent years reinforces the company’s desire to combine innovation and efficiency. The new Engineering Service Center in Colombo is another piece of the puzzle for overcoming technological challenges and supporting customers worldwide with first-class solutions.

WILMINGTON, DE – Cybord, a provider of advanced AI-powered component analytics, has partnered with Fuji America Corporation, a global leader in surface mount technology (SMT) equipment. As part of the agreement, Cybord becomes one of Fuji America’s preferred technology partners, delivering cutting-edge AI solutions to SMT customers.

The collaboration cements Fuji America’s position at the forefront of manufacturing excellence by integrating Cybord’s unique, visual AI solution to provide unprecedented electronic component quality assurance and traceability to its customers across all industries.

With electronic component supply chains in flux and under constant stress, it is increasingly difficult to predict the next disruption. Product recalls in the US, for example, are expected to surge this year, and many will be due to faulty, damaged, or inauthentic electronic components. Electronic component analysis is thus crucial for manufacturers to reduce costly recalls, rework, and scrap, and to ensure product quality for their customers and end-users. The Fuji America-Cybord solution provides the only way to inspect 100% of the components on an assembly line to mitigate against these disruptions.

“This is truly a great and exciting partnership for the SMT industry,” said Hirofumi Yoshimi, president of Fuji America Corporation. “This partnership leads the entire manufacturing level at our customers to the next step. Cybord’s total electrical components quality control system powered by their own developed AI strengthens our well-known equipment quality and reliability even more, and contributes to better than today quality and productivity for our customers production.”

Cybord’s visual AI-powered solution provides real-time inspection of 100% of electronic components during PCBA assembly with 99.9% accuracy, preventing defective, counterfeit or non-compliant parts from being placed on the printed circuit board (PCB). Leveraging its immense database of nearly five billion components, Cybord analyzes components with exceptional precision, enabling manufacturers to vastly limit the scope of recalls, reduce their exposure to supply chain vulnerabilities, and reduce rework and scrap rates – thereby safeguarding both their reputation and profitability.

“We are honored that Fuji America, a world-leading company, has chosen Cybord as a preferred AI technology partner,” said Oshri Cohen, CEO of Cybord. “Utilizing our cutting-edge innovation, Fuji-America sets a new industry standard for quality, reliability, and efficiency in the electronics manufacturing industry. Fuji America’s dedication to ensuring quality aligns perfectly with Cybord’s mission. Together, we’re empowering manufacturers to stay ahead of market demands and enhance end products with the combined strengths of Fuji America’s equipment and Cybord’s revolutionary technology.”

The Fuji America-Cybord partnership is slated to launch in January 2025, ushering in a new era of quality and efficiency for SMT manufacturing across the Americas.

NEW YORK, NY – RENEX, a European leader in advanced electronics manufacturing solutions, is pleased to announce its exclusive distribution agreement with Technica USA, a leading distributor in the United States. Under this partnership, Technica USA will distribute the REECO brand of ESD and cleanroom products in key territories, including California, Oregon, Idaho, Nevada, Arizona, New Mexico, Colorado, and Wyoming, with nonexclusive coverage in Washington and Utah.

Technica USA, established in 1985, is recognized for its expertise in providing advanced equipment and materials to the PCB Fab, Substrate, PCB Assembly, and MEMS markets. Known for delivering comprehensive solutions, Technica USA specializes in sales, installation, service, and inventory management, making it a trusted partner for manufacturers across North America.

Frank Medina, President/CEO of Technica USA, expressed his enthusiasm about the partnership: “We are honored to be chosen as the first distribution partner for RENEX in the United States, representing and supporting the REECO brand of ESD and cleanroom products. These products meet the highest quality standards, and their design reflects a deep understanding of the needs of end-users. The addition of the REECO brand complements our portfolio of best-in-class solutions for our customers.”

“This milestone is the result of over a year of hard work in the North American market. Having Technica USA as our official distributor is not just a partnership – it is a testament to the strength and potential of our business outside the EU,” added Robert Beber, Export Director at RENEX. “Technica’s trust in RENEX and the REECO brand confirms the quality of our products. We are thrilled to join forces at the APEX show to showcase REECO to the North American audience and look forward to expanding our distribution network in other U.S. regions."

Predrag Topić, owner of RENEX, also commented on the significance of the partnership: “This agreement with Technica USA is an important step in strengthening the presence of the REECO brand in the United States. Technica’s professionalism, market expertise, and dedication to customer satisfaction make them an ideal partner. Together, we aim to ensure that the REECO product line exceeds the expectations of industry professionals, delivering reliable solutions tailored to their needs.”

RENEX and Technica USA invite attendees to visit their booths at the upcoming IPC APEX EXPO, taking place March 18-20 in Anaheim, CA. REECO products will be showcased at booth #1629, while Technica USA will be at booth #4110. This collaboration marks a significant step in bringing world-class ESD and cleanroom solutions to U.S. industries.

For more information or for a copy of their product brochure, visit www.renex.pl