PLYMOUTH, WI – Kurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to announce plans to showcase its latest advancements and a range of cutting-edge soldering machines at the 2024 IPC APEX EXPO. The event is scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Attendees can visit Kurtz Ersa at Booth #2320, with additional machinery available for viewing in Booth 2620.

This year, Kurtz Ersa will debut several new products, making their first appearances in the Americas:

1. HOTFLOW THREE – Ersa Reflow Soldering Machine The Ersa HOTFLOW THREE, manufactured in Mexico starting in 2024, utilizes patented Ersa heating technology for optimal heat transfer with minimal energy and nitrogen consumption. Setting the industry standard for productivity to footprint ratio, this reflow soldering system offers double to quadruple transport options, enabling remarkable throughput increases without additional floor space. With up to four transport speeds and precisely adjusted transport widths, a wide variety of assemblies can be efficiently processed.
2. VERSAFIT 500 – Press-Fit Technology The Ersa VERSAFIT 500 is a highly flexible inline system designed to significantly enhance the competitiveness of press-fit technology in electronics production. This alternative connection technology reduces production costs and improves assembly quality. At its core is the servo- electric press cylinder, offering precise control and monitoring of force and travel.
3. VERSAFLOW ONE X-Series – Enhanced Selective Soldering Building on the success of the VERSAFLOW ONE, the X-Series introduces variability, optimizing throughput, economic efficiency, and soldering quality. This compact in-line selective soldering system features a dual-pot soldering module, providing exceptional flexibility and performance.
4. ERSA MK2 Soldering Stations The new ERSA MK2 line of soldering stations boasts the patented Tip’n’Turn concept for quick and secure tip exchanges, coupled with a remarkable performance increase of 20%. These stations, starting at 150 Watts, ensure optimum performance for manual applications. With advanced soldering tip technology, precise temperature control, and rapid heating and reheating capabilities, the MK2 series sets new standards for soldering stations.

In addition to these groundbreaking products, Kurtz Ersa will present its comprehensive range of equipment, including selective soldering, reflow soldering, wave soldering, stencil printers, rework systems, optical inspection devices, hand tools, and additive manufacturing solutions.

Visit Kurtz Ersa at Booth #2320 to explore the latest soldering technology advancements. For more information about Kurtz Ersa Inc., visit www.ersa.com

CLINTON, NY – Indium Corporation Senior Area Technical Manager Jason Chou will present at the SMTA Taiwan Tech Forum on March 26 in Taoyuan City, Taiwan. Chou’s presentation will highlight the growing demand for high reliability and low-temperature solder solutions brought on by the rapidly developing electric vehicle (EV) and artificial intelligence (AI) industries.

The growing EV market is fueling demand for more sensors and power moderators. Devices used under the hood now require service temperatures up to 150°C, posing a challenge for traditional lead-free Sn-rich solder alloys, which are increasingly unsuitable for harsh environments. For AI applications, where High-Speed and High-Performance Computing (HPC) are paramount, the complexity of module packaging poses its own set of complications such as warpage-induced non-wet-opens.

Chou’s presentation will examine a novel, mixed-alloy solder technology that demonstrates the combined strengths of each constituent solder powder in the paste. This new system has proven to improve the thermal fatigue resistance of solder joints in harsh thermal cycling and thermal shock conditions. It has also been shown to reduce the reflow peak temperature from ~240°C (SAC305) to ~200–210°C.

“I believe that this new, award-winning mixed-alloy solder system provides an innovative solution to many of the challenges posed by the emergence of EV and AI technologies,” said Chou. “I look forward to sharing more about this cutting-edge solution with my industry colleagues at the SMTA Taiwan Tech Forum.”

As Senior Area Technical Manager in Taiwan, Chou provides technical support to customers with a focus on the semiconductor industry. He has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology. Chou earned a master’s degree in Chemistry from National Tsing Hua University and a bachelor’s degree in Chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory, Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.

ATLANTA – Koh Young, the industry leader in True3D measurement-based inspection solutions and the Premier Sponsor of IPC APEX EXPO, invites electronics manufacturers to see its innovative data-driven approach to measurement-based inspection. Join us for live demonstrations at booth 2112 from April 9-11, 2024, at the Anaheim Convention Center.

At our booth, visitors will learn about the latest inspection machines and smart factory offerings while discovering solutions designed to address the industry's toughest challenges. Joel Scutchfield, General Manager of SMT Operations and Director of Sales at Koh Young America, extends an invitation to our booth, accessible at https://www.linkedin.com/feed/update/urn:li:activity:7171854393045164033/

Scutchfield emphasizes, "This year, the Koh Young booth will showcase our commitment to advancing electronics inspection by integrating our award-winning solutions with AI-powered engines. From new hardware to enhanced software, we will feature the latest inspection machines for solder paste, components and joints, dispensed products, advanced packages, and even semiconductors. As a testament to our smart factory focus, our booth will include the ITW EAE (https://www.itweae.com) MPM Momentum II printer in our KPO Printer demonstration area. Additionally, we will showcase our connectivity to industry leaders like Panasonic Connect (https://na.panasonic.com/us/industries/manufacturing) in booth 2332 and ASYS Group (https://www.asys-group.com/en/) in booth 2414. Let us demonstrate how our data-driven approach can elevate your operation to new heights."

Koh Young is revolutionizing process improvement for electronic manufacturers by harnessing the power of AI tools. Discover the benefits of tools like:

• Smart Review 3.0 to minimize false calls and prevent escapes, while reducing operator subjectivity
• Koh Young Auto Programming (KAP) to simplify programming and expedited production
• KPO Printer and KPO Mounter for real-time process optimization and automated correction

These are just a few examples of the advancements you can explore during the show.

To learn more about how our solutions can enhance your quality, visit us at the IPC APEX EXPO in Booth 2112 at the Anaheim Convention Center in California. Register to attend the in-person conference and exposition at https://www.ipcapexexpo.org/. If you are unable to attend the show, explore our best-in-class inspection solutions on our regional website www.kohyoungamerica.com 

REDMOND, WA – Data I/O Corporation (NASDAQ: DAIO), the leading global provider of advanced security and data deployment solutions for security ICs, microcontrollers and memory devices will showcase device programming and security provisioning solutions delivering high-performance, configuration flexibility automated device programming systems with security provisioning and industry 4.0 integration capability to enable traceability, process analysis and two-way communication that improves factory efficiency and quality at the lowest total cost of ownership. Data I/O will demonstrate a 64% increase in programming performance on Lumen®X Programmers with VerifyBoost™, the PSV family automated device programming systems, SentriX® security provisioning platform and the ConneX® software application that enables Data I/O’s device programming systems to integrate into the connected factory at the IPC APEX Expo in booth #3107 in Anaheim, California from April 9 th – 11 th at the Anaheim Convention Center.

About LumenX Programming Platform & VerifyBoost

VerifyBoost delivers rapid verify performance up to 750 MBps High-speed Gear3 x 2-Lane support for UFS devices for a massive 4.5x increase in performance. This enables our customers to immediately leverage existing production capacity for significant throughput gains, reduce the total cost of programming by up to 39% and maximize their existing investment in Data I/O’s programming technology. High-throughput PSV programming systems using LumenX programmers with high socket capacity and VerifyBoost enable manufacturers to use one PSV system to program what previously required multiple systems to produce. Learn more about VerifyBoost for LumenX programmers at www.dataio.com/VerifyBoost 

About ConneX Service Software

Electronics manufacturers, focused on operational efficiency to drive down costs and increase production capacity, are expanding their smart factory initiatives to integrate offline pre- programming processes into their Manufacturing Execution Systems (MES). ConneX enables customers to directly integrate data programming and security provisioning inputs and outputs between a Data I/O PSV programming system and an external application such as MES systems and analytics or web dashboards via industry standard protocols, to enable traceability, process analysis and two-way communication that improves factory efficiency and quality. To show the power of ConneX, Data I/O will display an example of a factory monitoring application with samples of dashboards a customer can build by accessing key areas of data collected during the programming process including system status, availability, utilization, socket adapter usage statistics and more. Learn more about ConneX at www.dataio.com/Solutions/ConneX 

PSV7000

The PSV7000 is the world’s premier automated programming solution with speed, flexibility, fast changeover, and small parts handling to manage any job for the lowest total cost of ownership. Engineered for velocity and versatility, the PSV7000 combines industry leading robotics handling, the LumenX revolutionary programming technology for fastest device programming and highest socket density ideal for automotive applications. A comprehensive suite of process control software applications along with fiber laser marking and 3D co-planarity component inspection meets the demanding process requirements for automotive electronics applications and Industry 4.0 automation. Learn more at www.dataio.com/PSV7000 

PSV3500

The PSV3500 is the cost-effective entry point for high-quality automated device programming for low mix / high volume applications. Ideal for customers moving to automated pre- placement programming for the first time, the PSV3500 delivers trusted performance and reliability at an affordable price. The PSV3500 is ideal for customers setting up automated pre- placement programming for the first time.. Learn more at www.dataio.com/PSV3500 

SentriX Security Provisioning Platform with SentriX Product Creator

SentriX Security Provisioning Platform with SentriX Product Creator reduces the complexity inherent in defining security for mass production by an order of magnitude. SentriX delivers pre-configured security deployment profiles for the most popular IoT use cases such as cloud onboarding, secure boot, access control, device authenticity and others. OEMs can use the provided pre-defined use cases or customize their own security profile. Secrets and credentials input product definitions using SentriX Product Creator are protected in transport and at rest to a SentriX security provisioning system. The PSV7000 and PSV5000 systems are field-upgradable to support SentriX and secure provisioning. Learn more at www.dataio.com/sentriX 

Customers attending the IPC APEX Expo in Anaheim, California can visit Data I/O’s booth in booth #3107 to see product demonstrations including VerifyBoost for LumenX displaying up to 750 MBps performance, the ConneX Service Software with system monitoring dashboards, SentriX security provisioning platform and the PSV7000 and PSV3500 automated programming systems.