FREMONT, CA – Datest, a trusted leader in advanced testing, engineering, inspection, and failure analysis services, is excited to announce the addition of Whitlock Associates to its network of sales representatives. This collaboration strengthens Datest's presence in Florida and highlights its commitment to providing exceptional solutions and support to the electronics manufacturing industry.

Whitlock Associates brings decades of sales expertise and a deep understanding of Florida’s electronics market. Their strong industry connections and customer-focused approach make them the perfect partner for introducing Datest’s services to regional companies.

"We’re thrilled to join forces with Whitlock Associates," said Rob Boguski, Datest's President. "Their understanding of the local market and its unique needs, combined with our testing and failure analysis capabilities, enable us as a unified and skillful team to provide timely, on-the- spot support to Florida’s electronics manufacturing and engineering communities."

With this partnership, Datest is taking another step toward expanding its reach and strengthening its reputation as a leader in advanced testing and failure analysis. Datest and Whitlock Associates are ready to bring innovative solutions and unparalleled support to Florida’s electronics manufacturing community.

For more information about Datest and its comprehensive suite of services, please visit www.datest.com 

NASHVILLE – KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the International Symposium on Microelectronics (iMAPS) Wire Bonding 2025 Workshop and Tabletop Exhibition, scheduled to take place February 3-4 at the Westin San Diego Bayview. The KYZEN clean team will showcase multi-process power module cleaner MICRONOX MX2123 during the event.

With the continued rise in demand for high- performance advanced packaging devices, KYZEN remains dedicated to providing cleaning chemistries like MICRONOX MX2123 and process optimization services to meet the array of challenges faced by manufacturers.

MICRONOX MX2123 is a balanced, multi-phase chemistry designed to remove flux residues from a wide range of IGBT module devices that utilize combinations of copper, silver and nickel DBC as substrates. It can also remove fluxes from PCBs. MX2123 can remove slight metal oxidation from base metals for post wire bond and potting processes, leaving exceptional surface conditions after cleaning. It is effective at low temperatures, in low concentrations, and is easily monitored in in-line SIA or Ultrasonic Immersion cleaning systems.

The iMAPS Wire Bonding 2025 Workshop and Tabletop Exhibition is an advanced technical workshop presenting a unique forum to unite scientists, engineers, manufacturing, academia and others working in Wire Bonding. The workshop was established to provide a platform for presentations and debate regarding the latest technologies and applications of Wire Bonding use in battery pack, semiconductor, and microelectronic packaging.

For more information regarding these products and the full line of MICRONOX products, visit www.kyzen.com 

STEINACH, SWITZERLAND – Variosystems, the globally operating system provider for high-quality electronic solutions, reaches another milestone moment in the company's development. In opening of the global Engineering Service Center in Colombo, Sri Lanka, the company is expanding its engineering expertise to meet the demand for advanced services such as obsolescence management, electronics design and test development.

Electronics and test development, PCB layout design, embedded software engineering, proactive obsolescence management: all offered by Variosystems under a single roof at the global Engineering Service Center in Colombo. The globally active system provider for high-quality electronics solutions opens the new location in the capital of Sri Lanka. “Our customers continue to benefit from close support on the ground. We develop solutions and directly interact with customers at our regional engineering locations. The Service Center in Colombo is the backbone that supports this local presence with additional expertise and expanded capacities,” emphasizes Stephan Sonderegger, CEO of Variosystems.

Engineering expertise under a single roof


The new global Engineering Service Center in Colombo expands the portfolio of engineering services, increases capacities and supports the regional engineering organizations across Europe, North America, China and Asia-Pacific. “Using Colombo as a strategic location, we can draw on highly qualified talent and make the best use of being close to our production facility in Badalgama,” explains Markus Dillinger, Global Head of Engineering.

The Service Center team is set to grow to over 20 experts by 2027. “Our investments in personnel and technology reinforce our goal of providing even better support to customers across the globe,” continued Dillinger. Aside from PCB layout design and life cycle management, the extended services also include design-for-assembly, design-for-testability and design-for-manufacturing. Now that these are offered, the Service Center is strengthening its regional expertise, allowing the company to adapt to customer requirements even more precisely.

Regional customer experience combined with global support


For years, Variosystems has specialized in offering customers from across the globe individualized testing technology and development services. Alongside the regional teams, the existing network of test engineers works closely with the new location in Colombo to take both efficiency and quality to the next level. The customer experience remains clearly rooted in the regions here: Interacting with customers, individual customization and developing specific solutions will continue to take place at a local level across Europe, North America, China and Asia-Pacific. The Service Center in Colombo works as a central engine that supports and accelerates these processes.

Taking a strategic step into the future


By expanding its range of global engineering offers, Variosystems is following hard after its strategy of acting as a system provider along the entire value chain – from development, industrialization and production through to life cycle management.

The acquisition of development partner SOLVE and rapid prototyping specialist KUBEG in recent years reinforces the company’s desire to combine innovation and efficiency. The new Engineering Service Center in Colombo is another piece of the puzzle for overcoming technological challenges and supporting customers worldwide with first-class solutions.

WILMINGTON, DE – Cybord, a provider of advanced AI-powered component analytics, has partnered with Fuji America Corporation, a global leader in surface mount technology (SMT) equipment. As part of the agreement, Cybord becomes one of Fuji America’s preferred technology partners, delivering cutting-edge AI solutions to SMT customers.

The collaboration cements Fuji America’s position at the forefront of manufacturing excellence by integrating Cybord’s unique, visual AI solution to provide unprecedented electronic component quality assurance and traceability to its customers across all industries.

With electronic component supply chains in flux and under constant stress, it is increasingly difficult to predict the next disruption. Product recalls in the US, for example, are expected to surge this year, and many will be due to faulty, damaged, or inauthentic electronic components. Electronic component analysis is thus crucial for manufacturers to reduce costly recalls, rework, and scrap, and to ensure product quality for their customers and end-users. The Fuji America-Cybord solution provides the only way to inspect 100% of the components on an assembly line to mitigate against these disruptions.

“This is truly a great and exciting partnership for the SMT industry,” said Hirofumi Yoshimi, president of Fuji America Corporation. “This partnership leads the entire manufacturing level at our customers to the next step. Cybord’s total electrical components quality control system powered by their own developed AI strengthens our well-known equipment quality and reliability even more, and contributes to better than today quality and productivity for our customers production.”

Cybord’s visual AI-powered solution provides real-time inspection of 100% of electronic components during PCBA assembly with 99.9% accuracy, preventing defective, counterfeit or non-compliant parts from being placed on the printed circuit board (PCB). Leveraging its immense database of nearly five billion components, Cybord analyzes components with exceptional precision, enabling manufacturers to vastly limit the scope of recalls, reduce their exposure to supply chain vulnerabilities, and reduce rework and scrap rates – thereby safeguarding both their reputation and profitability.

“We are honored that Fuji America, a world-leading company, has chosen Cybord as a preferred AI technology partner,” said Oshri Cohen, CEO of Cybord. “Utilizing our cutting-edge innovation, Fuji-America sets a new industry standard for quality, reliability, and efficiency in the electronics manufacturing industry. Fuji America’s dedication to ensuring quality aligns perfectly with Cybord’s mission. Together, we’re empowering manufacturers to stay ahead of market demands and enhance end products with the combined strengths of Fuji America’s equipment and Cybord’s revolutionary technology.”

The Fuji America-Cybord partnership is slated to launch in January 2025, ushering in a new era of quality and efficiency for SMT manufacturing across the Americas.