CAMBRIDGE, UK – With 3D electronics, bulky PCBs can be replaced, resulting in sleek and integrated designs. The automotive industry is one of the largest sectors benefiting from this technology, as electronics can be printed in a thin layer onto surfaces or integrated within components, which can be particularly useful for human-machine interfaces (HMIs).

In-mold electronics

Streamlined automotive interiors are a large market for 3D electronics, where the technology can incorporate electronic functions into new form factors with aesthetic appeal and modern design features. There are many possibilities for 3D electronics on a number of surface materials. The IDTechEx report, “3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets”, explores these further, alongside market predictions for the future of the technology.

Touch-sensitive interfaces are an example of a component that could use in-mold electronics (IME), using screen printing with conductive inks and adhesives. IME can make components completely functional and built-in with no excess materials and are most suited to HMIs in automotive interiors.

Higher outputs with lower production costs are a benefit of IME technology and are cheaper to install than touch screens. There are lots of surface opportunities for 3D electronics within automotive displays and dashboards, where buttons might otherwise look bulky and not conform to the desired aesthetic. IME can also be suitable for mass production, with its use of simple and trusted technology and very few process restrictions.

Partially additive electronics

Partially additive electronics, or applying electronics to a surface, include methods like laser direct structuring (LDS), aerosol, or inkjet printing. The technology uses conductive inks or LDS-compatible thermoplastics to create electronic capabilities over 3D structures, adding a circuit to a surface rather than integrating it, and also removing the need for a PCB. LDS is currently the most popular, allowing electronics to be incorporated into a number of surfaces quite easily, and it is commercially used in the automotive industry. Other methods of additive electronics are still in the prototyping stages.

Film-insert molding and capacitive switches with foils are other new alternative manufacturing technologies for automotive interiors and have already been launched into the market. They could work alongside IME and LDS technologies to produce modern, high-tech hardware.

3D printed electronics

3D printed electronics or fully additive electronics are known for being hard-wearing and can provide reliable quality with electronics embedded within products. The technology allows for mass customization and minor changes to be made and can create the most complex of designs, including medical devices such as prosthetics and hearing aids.

Rapid prototyping is also possible with fully additive electronics, using materials from conductive inks to thermoplastics. It could also be used to make spare parts, highlighting versatility in a number of sectors. However, this method is still in the semi-commercial prototyping stage for the automotive industry, just behind in-mold and 3D additive electronics, so it could soon make progress to be a top contender for HMI opportunities, especially with its possibilities of prototyping and spare part manufacturing.

The report highlights that the sales of 3D electronics are increasing rapidly and that overall, IME technology appears to be better for human-machine interfaces than additive electronics. IDTechEx does identify some challenges for this technology within the report, which include the speed at which 3D electronics can be produced, product reliability, and acceptability within the market as various sectors and consumers adjust to this new technology.

Drivers for 3D electronics include reduced shipping volume, cost, and material consumption. In a market as large as the automotive industry, these new technologies will be hugely beneficial for new vehicle designs. With reduced materials, new components could promise to be simpler to assemble and, therefore, simpler to fix or replace.

To find out more, please see the IDTechEx report, “3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets”, by visiting www.IDTechEx.com/3DElec. Downloadable sample pages are available.

DENVER – Governments around the world are pursuing a growing number of co-investment programs with the microelectronics packaging and semiconductor industries, in order to build and expand infrastructure in their own jurisdictions. In a special session at the 2024 IEEE Electronic Components and Technology Conference (ECTC), representatives from Canada, the European Union, India, Korea and the U.S. described the differing goals, frameworks, challenges and achievements of their efforts to increase advanced packaging technology and infrastructure development.

Interest in advanced packaging is surging, because without new packaging approaches it is unlikely the electronics industry will be able to achieve the performance gains and energy savings needed to support fast-growing, demanding applications like artificial intelligence (AI), high-performance computing, wireless and high-speed communications, and quantum computing.

The annual ECTC conference is the world’s leading forum for advancements in microelectronics packaging and component science and technology. The growing momentum for advanced packaging solutions can be seen in the attendance figures for the 74th annual ECTC, held here from May 28-31. Registered attendance at ECTC 2024 hit an all-time high of more than 2,000, up from 1616 in 2023, and higher than the previous record of 1,738 in 2018.

“Governments are striving to find ways to build their own semiconductor ecosystems in order to gain access to leading-edge technologies, to secure their supply chains, and to open up educational and employment opportunities for their populations,” said Przemyslaw Gromala, co-Chair of the ECTC special session, Exploring the Impact of Industry-Government Co-Investments for the Advanced Electronics Sector in North America, Asia and Europe, along with fellow co-Chair Erik Jung.

“The introduction of the CHIPS and Science Act in the United States has been inspiring similar programs elsewhere. The speakers in our lively special session detailed their programs and co-investments, and also discussed the prospects of global collaborations and partnerships between national semiconductor and microelectronic packaging centers and industry leaders. They also outlined mechanisms for knowledge exchange, joint research initiatives, and mutually beneficial outcomes,” he said.

Highlights from the panelists:

Canada
CMC Microsystems is a non-profit founded in 1984 as a Canada-wide collaboration between 69 universities/colleges. It connects 10,000 academic participants with 1,200 companies to design, build and test advanced prototypes. At ECTC, David Lynch, CMC’s Vice President of Technology, discussed FABrIC, a proposed 5-year $200M-plus project to be led by CMC and 14 other founding organizations to accelerate the development of made-in-Canada microchip manufacturing processes, Internet of Things (IoT)-based products and services, and quantum technologies.

FABrIC would build on Canada’s strengths in compound semiconductors, micromechanical systems (MEMS), photonics and superconductors. It would work with subject matter experts in these technologies to commercialize products, and would create and share IP resources to help build a national semiconductor ecosystem, including relevant packaging approaches.

Europe
The European Chips Act, passed in July, 2023 and funded by the European Union, member states and the private sector, has enabled significant investments in first-of-a-kind fabs in Europe, but it hasn’t focused specifically on packaging. At ECTC 2024, Elisabeth Steimetz, Office Director of the European Association on Smart Systems Integration, known as EPoSS, gave an outline of the major activities taking place and under consideration in Europe. One is the evolving Pack4EU initiative, whose objective is to create a pan-European network for advanced packaging, and a roadmap to boost packaging in Europe.

EPoSS is an international non-profit organized under German law that leads the development and integration of intelligent and green smart-systems technologies and solutions for a sustainable society. It comprises major industrial companies and research organizations from more than 20 European Member States, with the goal of developing a vision and setting up a strategic research agenda to coordinate their activities in these areas.

India
At ECTC 2024, Rao Tummala, Advisor to the Government of India, described the semiconductor industry landscape in India and the tremendous potential for industry development there, in the context of the large size and growth of India’s economy; the many partnership opportunities among academia, industry and government; India’s skilled, highly educated and large technical workforce; the potential for collaboration with academic experts globally, who are from India and elsewhere; and the India Semiconductor Mission (ISM) a government-led strategic initiative to bolster India’s semiconductor ecosystem.

He said the strategic R&D focus in India is to develop integrated semiconductors and systems packaging to serve large, fast-growing markets.

Korea
Korea’s Chips Act, passed in March, 2023, provides significant tax breaks and deductions for investments in Korea’s semiconductor industry. Kwang-Seong Choi, from Korea’s Electronics and Telecommunications Research Institute, described a packaging initiative that will concentrate on technology segments where South Korean companies have demonstrated prowess, such as 2.5D package-based high-bandwidth memory (HBM) optimization, 10-40 µm bonding, and hybrid bonding.

United States
In the U.S., the CHIPS for America Act which passed in 2022 authorized $39 billion to attract large-scale investments in facilities, equipment and manufacturing capacity for advanced technologies such as leading-edge logic and memory, and for advanced packaging as well. It also authorized $11 billion in R&D programs that would, among other things, lead to more advanced semiconductor assembly, packaging and test capabilities.

Among these are the National Advanced Packaging Manufacturing Program, to develop innovations that will help realize the ambitious goals for U.S. technology leadership in advanced packaging for the American semiconductor industry.

At ECTC 2024, Eric Lin, R&D Director in the CHIPS for America Research and Development Program, described these programs in the context of the international landscape for advanced packaging. He outlined U.S. R&D goals and detailed the tremendous engagement the U.S. has with international partners in Asia, Europe and the Americas to help advanced its strategic goals.

Looking Forward

Przemyslaw Gromala, co-Chair of the ECTC special session, said, “The worldwide semiconductor and packaging landscape is complex and dynamic. Our attendees had a unique opportunity to hear the differing perspectives of existing and up-and-coming participants in the worldwide advanced packaging industry, what their goals are, and the different ways in which they plan to meet them.”

Further information about ECTC 2024

Please visit https://www.ectc.net/index.cfm 

TORONTO – Bittele Electronics Inc., a Toronto-based PCB manufacturer specializing in prototype and low-to-mid volume printed circuit board assembly, announced that it has completed the expansion and improvements of its Markham, Ontario, PCB manufacturing facility.

These improvements have improved lead times, inventory management and production capacity, while maintaining a commitment to quality and responsiveness.

“The improvements we’ve made to our Markham facility have achieved better inventory accuracy, expanded our storage capacity, and increased our production capacity with the new Soltec wave soldering machine we’ve installed,” said Ben Yang, CEO of Bittele Electronics. “These improvements demonstrate Bittele’s commitment to offering high quality services that guarantee customer satisfaction."

The improvements of the Markham PCB facility can benefit a customer in three important ways:

• Inventory Accuracy: We can now store consigned parts for ongoing and upcoming orders. Upon request, we can also purchase and stock critical items in a customer’s Bill of Materials (BoM).

• Storage Capacity: By expanding the Markham facility, we are positioned to serve a customer’s needs in a prompt and accurate manner.

• Production Capacity: We have invested in a new Soltec wave soldering machine for larger-volume, through-hole assembly orders. This means we can meet a customer’s delivery deadlines more effectively.

In addition to the improvements of Bittele’s Markham facility, it has improved its online ordering process as well. By utilizing Bittele’s state-of-the-art online ordering engine, a customer can place a turnkey PCB fabrication and assembly order in less than 20 minutes while also obtaining exclusive discounts.

HALFMOON, NY – PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce its participation in Electric Vehicle Asia (EV Asia) 2024. The event will take place July 3-5, 2024 at the Bangkok International Trade & Exhibition Centre (BITEC) in Bangkok, Thailand. PVA will be co-exhibiting with its distributor, TKT Technology, in SIP Technology's booth, B1.

Paul Kim, Regional Sales Manager of PVA Asia, will be in attendance to engage with industry professionals, partners, and potential clients. Mr. Kim will be available to discuss PVA's latest advancements in fluid dispensing solutions, coating, and custom automation systems tailored for the electric vehicle industry.

Electric Vehicle Asia is a premier event that brings together leaders, innovators, and stakeholders from the electric vehicle industry. The exhibition focuses on the latest technologies, innovations, and solutions that are driving the future of electric mobility.

PVA is renowned for its high-quality dispensing and coating solutions used in various industries, including automotive, electronics, aerospace, and medical devices. The company is a trusted partner in precision automation and fluid dispensing technologies. TKT Technology, PVA's distributor in the region, shares a strong partnership with SIP Technology. This collaboration enhances PVA's reach and service capabilities in the Asian market. Visitors to the SIP Technology booth (B1) will have the opportunity to learn more about how PVA's solutions can be integrated into electric vehicle manufacturing processes.

PVA invites all attendees of Electric Vehicle Asia 2024 to visit booth B1 to meet with Paul Kim and the TKT Technology team. Learn how PVA’s cutting-edge solutions can enhance your manufacturing processes and support the evolving needs of the electric vehicle industry.

For more information about PVA, please contact PVA at info@pva.net or (518) 371-2684.