MILLEDGEVILLE, GA – TopLine® Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025. MRQW provides a forum for discussing issues in all areas of microelectronics reliability and qualification for high-reliability and commercial applications.

TopLine recently announced the availability of Braided Solder Columns as drop-in replacements for BGA balls for Quantum Computers and next generation applications including Very Large 2.5D Packages. The Microelectronics Reliability and Qualification Workshop (MRQW) won the topic, which will be addressed by Hart, including the application of braided solder columns to aerospace applications and extreme environments.

NEW YORK, NY – Kubler US Corp, a leader in high-tech electronics solutions and strategic market development, is proud to announce the appointment of Cope Assembly Products (CAP) as its exclusive sales representative for Delaware, Maryland, West Virginia, Virginia, North Carolina, and South Carolina. This partnership will strengthen Kubler’s market presence and support its mission to deliver cutting-edge solutions to OEMs, contract manufacturers, and hybrid facilities in the region.

CAP brings decades of expertise in serving the electronics manufacturing sector, specializing in surface mount technology and expanding into the front-end wafer and hybrid markets. Known for its exceptional customer service and deep understanding of industry needs, CAP is well- positioned to represent Kubler’s innovative solutions, including the revolutionary Arcadia Smart Storage System, in these key markets.

“We are delighted to partner with Cope Assembly Products, a company that shares our commitment to innovation and customer satisfaction,” said Boris Kubler, CEO of Kubler US Corp. “With its established presence in the Mid-Atlantic and Southeastern United States, CAP will be instrumental in bringing our smart storage and material management solutions to manufacturers seeking to optimize efficiency and achieve Industry 4.0 capabilities.”

The Arcadia Smart Storage System offers unmatched benefits to electronics manufacturers, including:

• Compact Design: Store up to 720 reels in 0.45 m², maximizing floor space.
• Speed and Precision: Retrieve components in under three seconds with error-free, LED-guided picking.
• Industry 4.0 Integration: Seamlessly connect with pick-and-place machines, ERP systems, and production lines.

Travis Cope, CAP Sales Representative, expressed his enthusiasm about the partnership: “We’re thrilled to represent Kubler US and introduce its game-changing technologies to our customers. The Arcadia system, with its space-saving design and advanced automation, perfectly aligns with the needs of manufacturers focused on efficiency and scalability. We’re excited to see the impact it will have on the region’s electronics industry.”

Kubler US and CAP are committed to providing exceptional support to manufacturers in the region. CAP’s experienced team, including Travis Cope, Dick Cope, and Ted Kress, will leverage their expertise to ensure seamless integration of Kubler’s solutions into production environments.

For more information or to schedule a demo, contact Boris Kubler at boris@kubler-us.com or visit www.kubler-us.com 

CLINTON, NY – Indium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.

The presentation, High Reliability and Low-Temperature Solder Solutions for AI and Automotive Application, will explore cutting-edge solder solutions designed to meet the demanding requirements of the evolving automotive and AI industries. Modern automotive electronics require robust solder solutions that can withstand extreme temperatures while maintaining long-term reliability. Meanwhile, AI applications demand solders compatible with High-Performance Computing (HPC) requirements, where thermal management during processing is critical.

Additionally, Chou will discuss Indium Corporation's innovative Durafuse® LT and Durafuse® HR solder technologies. These solutions address two critical industry challenges: the need for high-reliability solder joints in high-temperature automotive environments and low-temperature processing solutions for complex AI computing modules.

“As the automotive and AI industries continue to push the boundaries of electronic performance, traditional solder solutions are no longer sufficient,” said Chou. “Durafuse® technology represents a significant breakthrough, offering solutions that handle both the intense heat of automotive applications and the precise, low-temperature requirements of AI processing.”

Chou is Indium Corporation’s senior area technical manager for the company’s customers in Taiwan, with a focus on the semiconductor industry. His strategic location in southern Taiwan provides timely customer response, as well as efficient sales and marketing team support. Chou has 10 years of industry experience, including specialization in front-end wafer fabrication processes, thin-film modules, and defect analysis for wafer metrology.

Chou earned a master’s degree in chemistry from National Tsing Hua University and a bachelor’s degree in chemistry from National Cheng Kung University. He served as the group leader for the National Nano Device Laboratory in Tainan, Taiwan, where he collaborated with university professors and industry professionals on special projects for semiconductor manufacturing.

Visitors can view the presentation on Thursday, January 23, at 3:00 p.m. in East Hall 7. To learn more information on Indium Corporation’s solder solutions, visit or www.indium.com/durafuse or speak to our experts at NEPCON Japan at booth E66-22.

ST. LOUIS PARK, MN – E-tronix, a Stromberg Company, is excited to announce that they will partner with ELMOTEC to showcase the SolderSmart® TOP Automated Soldering Equipment at APEX 2025 Booth #1703.

As a leader in advanced soldering solutions, ELMOTEC delivers consistent, high-quality results with its SolderSmart® robotic soldering technology. Offering a wide range of products, such as laser, high-frequency, hot-bar, and flame soldering solutions, available in both standard and customizable configurations. With features like VisionSystem™ technology, ELMOTEC provides unprecedented quality of your solder joints.

The E-tronix and ELMOTEC teams are excited to provide live demonstrations of the SolderSmart® TOP Automated Soldering Equipment at Booth #1703. Attendees can experience firsthand the SolderSmart® TOP’s precision, reliability, and unmatched efficiency. Key benefits include low energy consumption, improved quality, reduced maintenance, and minimized downtime. Additional features, such as automated tip measurement, integrated position correction, and traceability with VisionSystem™ technology, ensure your soldering process is reliable and efficient.

Let’s solder the future together.

For more information about the ELMOTEC SolderSmart® TOP and other SolderSmart® products, visit: https://elmotec.ch/en/