AUSTIN, TX – Flex (NASDAQ: FLEX) today announced that Kevin S. Krumm will join the company as Chief Financial Officer (CFO), effective January 6, 2025. He will succeed Jaime Martinez, interim CFO, who will remain with Flex and support a smooth transition. Reporting to Flex CEO Revathi Advaithi, Mr. Krumm will focus on driving the company's long-term financial strategy and creating shareholder value.

Mr. Krumm joins Flex with more than 20 years of experience across industrial, chemical, and healthcare industries. Previously, he served as Executive Vice President and Chief Financial Officer of APi Group Corporation, a global market-leading business services provider of safety and specialty services. Prior to APi Group, Mr. Krumm had a 15-year tenure at Ecolab Inc. in various roles of increasing responsibility, most recently as Corporate Treasurer and Senior Vice President of Global Financial Shared Services.

"Kevin's demonstrated leadership and success across several industries is well aligned with Flex's strategy," said Revathi Advaithi, CEO, Flex. "I look forward to partnering with Kevin to continue to create shareholder value and drive Flex's long-term financial success."

"I am delighted to be joining the Flex team. Flex is uniquely positioned at the intersection of innovation and operational excellence, with a strong legacy of collaboration and execution," said Mr. Krumm. "I look forward to working with the Flex team to build on its track record of financial performance and continue to deliver shareholder value."

Mr. Krumm holds a bachelor's degree in accounting from the University of Northern Iowa and a master's in business administration from the University of Chicago Booth School of Business.

SAN JOSE, CA – Green Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, has further elevated its quality assurance capabilities with the installation of the cutting-edge DAGE Quadra 5 Pro X-ray System from Nordson TEST & INSPECTION.

This state-of-the-art system, installed at Green Circuits’ advanced manufacturing facility, allows the company to inspect PCBs and components with unmatched accuracy, reduce errors due to board warpage, and streamline workflows for faster turnaround times.

The Quadra 5 Pro offers exceptional inspection performance, enabling Green Circuits to achieve the highest precision in detecting and analyzing defects. With its 3.3 MP ultra-high-quality imaging, sub- micron resolution, and advanced Revalution™ control software, the system delivers highly detailed, accurate images to support key manufacturing processes, including in-line electrical testing, automated visual inspections, and failure analysis.

“We are excited to integrate the Quadra 5 Pro into our inspection processes,” said Mark Evans Chief Operating Officer at Green Circuits. “This technology will enable us to identify and resolve issues with greater precision and efficiency, ensuring that our customers continue to receive products of the highest quality. Its ability to handle complex assemblies aligns perfectly with our mission to support cutting-edge technologies and rapid turnaround demands.”

The Quadra 5 Pro’s features, including optimal clarity from the Onyx™ HL Detector, customizable filtering, and intuitive point-and-click controls, allow Green Circuits to enhance defect analysis and streamline workflows. The system’s oblique angle viewing and anti-vibration capabilities ensure consistent and reliable inspection results, even for the most challenging applications.

As a global EMS leader, Green Circuits offers a comprehensive suite of services, including PCB design and engineering, fabrication, assembly, system and box build, supply chain and logistics, test and burn- in, BGA rework, and failure analysis. With the addition of the Quadra 5 Pro, Green Circuits strengthens its ability to meet the stringent quality and reliability standards required by OEMs in high-tech industries.

For more information, visit www.greencircuits.com 

WASHINGTON – The Semiconductor Industry Association (SIA) today announced Western Digital CEO David Goeckeler has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.

“We are thrilled to welcome our new chair for 2025, David Goeckeler of Western Digital,” said SIA President and CEO John Neuffer. “David possesses years of experience in the technology and semiconductor industries, and is an outstanding advocate for our work. He will be a fantastic leader of the SIA Board of Directors in 2025.”

Over more than four decades, Goeckeler has focused on innovating and growing industries ranging from semiconductors to global networking to enterprise software. As CEO of Western Digital, Goeckeler has led the company’s transformation as a leading data storage producer in the industry. Prior to this, he served as Executive Vice President and General Manager of Cisco’s Networking and Security Business, after starting his career at Bell Laboratories. Goeckeler was recently appointed Chairman of the U.S. Chamber’s U.S.-Japan Business Council (USJBC).

“Semiconductor innovation is the transformative backbone of everything from the smartphone in your pocket to hyperscale cloud infrastructure to artificial intelligence that uplift society and improve our quality of life,” said Goeckeler. “As we grow our industry, the role of effective government policies is more crucial now than ever to accelerate innovation and expansion in this sector. Through partnership with my colleagues on the SIA Board, I look forward to strengthening our shared industry priorities in Washington and around the world.”

CHATSWORTH, CA – NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%. This improvement reflects NEOTech's commitment to continuous process enhancement and operational excellence.

The wire bond pull test is a critical method used to assess the quality and integrity of wire bonds in microelectronics. Leveraging extensive historical data and its exceptional process yield rate, NEOTech’s manufacturing engineers developed a robust random sampling methodology that ensures testing efficiency without compromising quality. The new sampling plan has dramatically reduced average testing time from 2.5 hours per assembly to approximately 1 hour per assembly.

This innovative process is fully compliant with the stringent requirements of MIL-PRF-38534 and MIL- STD-883, ensuring that NEOTech meets the highest quality and reliability standards. The process has been implemented on mission-critical, high- frequency RF assemblies — products recognized in the industry as highly complex and challenging to manufacture. NEOTech’s success in achieving these advancements demonstrates its expertise in addressing the rigorous demands of such sophisticated microelectronics applications.

“Achieving greater than 99.99% production yields is a remarkable milestone,” said Daniel De Haro, General Manager of the NEOTech Chatsworth site. “But our team didn’t stop there. They went above and beyond to implement innovative sampling techniques and streamline testing processes to significantly improve production cycle times. I’m incredibly proud of our engineers, technicians, and manufacturing teams for their dedication to excellence and their commitment to setting new benchmarks in microelectronics manufacturing.”

The transition to a sample-based testing methodology was supported by enhanced data collection and analysis, as well as the development of comprehensive training procedures. These efforts ensured that the NEOTech team could maintain its exceptional yield rates while increasing throughput and efficiency for its customers’ microelectronics circuit assemblies. At the core of NEOTech’s success is its customer-centric approach. Offering a comprehensive suite of services — from design and prototyping to full-scale production and post-production support — NEOTech tailors its solutions to meet each customer’s specific needs. The company’s ability to provide personalized solutions, while also reducing time-to-market and optimizing costs, has earned it a strong reputation for delivering exceptional value.

With more than 40 years of heritage in electronics manufacturing, NEOTech specializes in high- reliability programs in the aerospace/defense industry, medical products, and high-tech industrial markets. NEOTech is well recognized as a premier EMS provider with in-depth experience manufacturing high-tech products and managing stringent US government requirements. For more information about NEOTech’s Microelectronics manufacturing capabilities, please visit www.NEOTech.com/microelectronics