MILTON, NY – Sono-Tek Corporation (Nasdaq: SOTK), a leading manufacturer of precision ultrasonic coating solutions, is excited to announce its participation in SEMICON West 2024, taking place July 9-11 in San Francisco, CA. Visit the company at booth 6186 to explore advanced ultrasonic coating solutions designed for precision and efficiency in semiconductor manufacturing.

Highlighted Products and Innovations:

SPT200 Photoresist Coating Machine: The SPT200 is designed to provide uniform photoresist coverage on deep well topographies, ensuring optimal performance for MEMs and other intricate applications. Capable of handling 100, 150, 200, and 300mm wafers, this machine leverages ultrasonic technology to form highly controlled droplets, delivering superior coating uniformity.

Wafer Handling System: Sono-Tek’s new Wafer Handling System is tailored for higher automation and throughput, accommodating 4-8” wafers with automated wafer loading. This system enhances efficiency and precision in semiconductor manufacturing processes.

Flexicoat System for EMI Shielding: The Flexicoat system, equipped with ultrasonic coating technology, is ideal for EMI (electromagnetic interference) shielding at the packaging level. This system replaces the costly sputtering process, uniformly applying coatings over various structures while maintaining a clog-free environment through our ultrasonic nozzle.

Additional Coating Applications:

• Polyimide Coatings and Protective Films for Dicing: Sono-Tek’s ultrasonic technology ensures uniform application of polyimide coatings and protective films, essential for semiconductor manufacturing.
• Flux Dispensing for Flip Chip Applications: Sono-Tek’s precise flux dispensing solutions enhance the reliability and performance of flip chip assemblies.
• Thin Film Solar and Display Applications: Sono-Tek provides advanced coating solutions for thin film solar cells and display technologies, including TCO layers, nano suspensions (CNT, graphene, nano-wires), OPV polymers, AR, and Perovskite layers.

Visit Sono-Tek at booth 6186 to learn more about the company’s cutting-edge ultrasonic spray coating solutions and how they can enhance your semiconductor manufacturing processes. For further details, visit www.sono-tek.com/industry/semiconductor/mems-semiconductor/ 

Sono-Tek Corporation is a leading provider of precision ultrasonic coating solutions for a wide range of industrial applications. The company’s advanced technology helps customers increase efficiency, reduce costs and improve product quality.

For more information about Sono-Tek Corporation and its products, please visit www.sono- tek.com 

MINNEAPOLIS, MN – Nordson TEST & INSPECTION today announced plans to exhibit at SEMICON West 2024, scheduled to take place July 9-11 at the Moscone Center in San Francisco, California. Visitors to booth 1233 will have the opportunity to see demonstrations of Nordson's WaferSense® semiconductor sensors, Quadra Pro™ Manual X-Ray System (MXI), and Gen 7™ Acoustic Micro Imaging (AMI) system. Additionally, the innovative SpinSAM™ AMI system will be unveiled in a video presentation for the first time at the show.

The new SpinSAM AMI system delivers industry-leading throughput with unparalleled sensitivity for accurately locating defects in wafer based assemblies. The SpinSAM’s innovative spin scanning method scans up to 4 (300mm) wafers simultaneously at 41 wafers per hour, with best-in-class defect capture and image quality. With 4 matched waterfall transducers, the system was meticulously engineered to attain full wafer scans in less than 6 minutes. Ideal semiconductor mid-end applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more.

Setting a new industry benchmark for 3D/2D manual inspection in back-end semiconductor applications, the Quadra 7 Pro MXI system revolutionizes the inspection experience with its Onyx® detector technology. This advancement ensures exceptional image clarity and elevated levels of precision and efficiency. The Dual Mode Quadra NT4® tube provides unprecedented flexibility. This innovative technology offers both brightness and resolution modes, enabling operators to seamlessly transition between them according to specific application requirements. This ensures optimal results for a wide range of semiconductor inspection needs.

The Gen7 AMI system powered by C-SAM technology, provides fast and highly accurate inspection for detecting delamination and voiding with the most sophisticated microscope. Ideal for lab analysis and specialized high-resolution applications.

Lastly, for front-end semiconductor tool set-up and maintenance, the WaferSense® ATS2 multi-camera sensor, paired with CyberSpectrum™ software captures offset data (x, y and z) to quickly teach wafer transfer positions in real-time without opening the tool. Visit Nordson Test & Inspection at booth 1233 to experience the future of semiconductor inspection and metrology technology that improves yields, processes, throughput and productivity.

For more information, visit www.nordson.com/testinspect

NASHVILLE – KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is excited to announce its participation in SEMICON West 2024, taking place July 9–11 at the Moscone Center in San Francisco. KYZEN will be exhibiting in Booth 1841, where attendees will have the opportunity to learn about their latest advancements, including the spotlight product: MICRONOX® MX2123 Multi-Process Power Module Cleaner.

MICRONOX MX2123 is an advanced, aqueous, multi- phase cleaning solution specifically engineered to remove flux residues from a variety of IGBT module devices that utilize a combination of copper, silver and nickel DBC substrates, as well as PCBs. Its meticulously balanced formula ensures superior surface conditions for subsequent wire bonding and potting processes.

Key Features of MICRONOX® MX2123:

Exceptional Cleaning Performance: Designed to effectively eliminate flux residues, MICRONOX MX2123 ensures optimal surface conditions for critical downstream processes.

Versatile Application: Suitable for use in both Spray-In-Air in-line and Ultrasonic Immersion cleaning systems, providing flexibility for diverse manufacturing setups.

Low Temperature and Concentration Efficiency: Operates effectively at low temperatures and concentrations, reducing energy consumption and operational costs.

Enhanced Surface Preparation: Ensures exceptional surface conditions for subsequent wire bonding and potting, crucial for high-reliability applications in power devices and advanced packaging.

In addition to MICRONOX MX2123, KYZEN will also discuss its range of other high- performance cleaning solutions tailored for power devices and advanced packaging applications. The company’s experts will be available at Booth 1841 to provide insights and answer questions about their comprehensive product portfolio.

For more information, visit www.kyzen.com 

HANAU, GERMANY – Heraeus Electronics GmbH & Co KG (“Heraeus”), a global leader in electronic materials and technologies, announces the successful defense of its key European patent no. EP 3215288 B1. This patent encompasses the use of specific metal sintering preparations for connecting electronic components in Germany, as well as the metal sintering preparations themselves in France, Italy, Hungary and Romania. This patent is important for those involved in using such preparations for connecting electronic components, such as semiconductors, in these regions.

The validity of the patent, particularly concerning the use of specific metal sintering preparations for connecting electronic components, was recently confirmed by the Federal Patent Court. This follows an attempt by Vibrantz GmbH (“Vibrantz”) to invalidate the German part of the patent through a nullity suit (file no. 3 Ni 26/21 (EP) – also published as BPatG GRUR-RS 2023, 44592 - Metallsinter). The court's decision in favor of Heraeus has now become final after Vibrantz withdrew their appeal to the Federal Court of Justice (file no. X ZR 21/24).

Heraeus is committed to take proactive steps to protect its intellectual property. The above patent is also subject to an infringement lawsuit (case no. ACT_13227/2024) with the Local Chamber Munich of the Unified Patent Court (UPC) concerning the German, French and Italian parts of the patent.

Heraeus’ patented metal sintering technology is significant for the reliable and efficient connection of electronic components, offering excellent performance and stability. By defending this patent, Heraeus ensures that its technologies remain protected, enabling continued innovation and progress within the semiconductor industry.