NORTHBROOK, IL – Impossible Objects proudly announces plans to exhibit at Apex 2024, scheduled to take place April, 9-11, 2024 at Anaheim Convention Center. The focus of this exhibition is the game-changing CBAM-25 industrial 3D printer, a true paradigm shift in high-speed, high-performance additive manufacturing.

CBAM 25: Step into the in the Future of 3D Printing Impossible Objects’ CBAM-25 3D printer marks a monumental leap forward in additive manufacturing capabilities. Setting new industry standards, this cutting-edge machine stands out as a true game-changer for electronics tooling (and more), boasting a remarkable fifteen-fold increase in speed compared to the fastest competition.

With the CBAM-25, a new era dawns for electronics tooling, one characterized by unprecedented speed and efficiency, in addition to all of the benefits of 3D printing that shatters traditional limitations. The first CBAM-25 will ship in Q2 2024, heralding a seismic shift in manufacturing processes. This groundbreaking innovation brings 3D printing to the forefront of volume tooling manufacturing, tearing down barriers and expanding the horizons of what can be achieved with advanced materials, exceptional mechanical properties, and superior tolerances.

Design and Manufacturing Renaissance

The CBAM-25 opens doors for engineers to design parts that are not only stronger but also lighter and more durable. Its high-performance composite materials, notably Carbon Fiber/PEEK, offer remarkable chemical and temperature resistance, along with mechanical properties that surpass those of many engineering plastics.

Carbon Fiber/PEEK components have proven to be an exceptional alternative for electronics tooling, as well as a wide range of additional applications, including, aerospace, defense, transportation industries, and beyond. “Our innovative 3D printer represents a quantum leap in additive manufacturing technology, enabling engineers and manufacturers to achieve feats previously considered impossible,” says Robert Swartz, Founder and Chairman of the Board at Impossible Objects.

“We are also committed to serving the global electronics manufacturing community as a premier tooling supplier, providing cutting-edge solutions for their evolving needs.”

Experience the future of 3D printing and discover how Impossible Objects redefines the boundaries of design and manufacturing.

Visit Impossible Objects at APEX 2024, booth #2715 or fill out a contact us form to get in touch with us directly and schedule a dedicated time slot to discuss your specific tooling needs.

ISLE OF WIGHT, UK – EVS International, the leader in solder recovery, today announced plans to exhibit in Booth 730 at the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. The company is set to showcase its EVS 18KLFHS Solder Recovery Systems, a revolutionary innovation that is transforming the solder recycling process.

The key to the EVS 18KLFHS's exceptional performance is its innovative design, featuring a sealed cabinet that cleverly integrates the dross bucket and fume extraction. This groundbreaking concept ensures both security and efficiency in the solder recovery process.

At its core, the system features the Tilting Pot Mechanism, an industry-first innovation that eliminates the need for traditional twin opposed air rams and doors, resulting in a substantial boost in efficiency and productivity.

What truly sets the EVS 18KLFHS apart is its ability to invert and rotate the dross/solder pot, combined with an ingenious hot air-activated auto drain tap. This remarkable combination results in the creation of clean ingot bars, enabling the recovery of up to 80 percent of solder from the dross. This remarkable efficiency is made possible through EVS's patented technology.

With an expanded 18-kilo/40lbs pot, the system empowers users to recover more dross, promising a faster return on investment (ROI). It simplifies components, extends running times, and boasts an extraordinary availability rate of 90% and above, reinforcing its reputation for unmatched reliability in the industry.

Additionally, the EVS 18KLFHS Solder Recovery System is now available in a lead-free version, providing a compelling price-performance ratio. This inclusive offering opens doors for businesses of all sizes, from small job shops to those using both lead and lead-free units, to invest in this game- changing technology. With the promise of delivering pure solder and a swift ROI within months, the system propels production efficiency and sustainability to new heights.

Visit the EVS booth at the 2024 IPC APEX EXPO, where the 18KLFHS Solder Recovery System will be on display, showcasing the most advanced solder recovery solution in the industry.

For more information about EVS International’s industry-leading systems, visit www.solderrecovery.com

OSAKA, JAPAN – Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth 1325 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Renowned for its commitment to innovation, Nihon Superior will present a range of groundbreaking products, including the SN100CV® P608 solder paste and the TempSave™ series of low-temperature soldering materials.

SN100CV® P608 sets a new standard as a completely halogen-free, lead-free, and no- clean solder paste by Nihon Superior. In contrast to silver-containing alloys relying on a dispersion of fine particles of eutectic Ag3Sn for strength, SN100CV achieves its robustness from solute atoms within the tin matrix of the joint. Remarkably, in tensile tests, SN100CV matches the strength of SAC305 while retaining a high resistance to impact loading, offering exceptional performance in various applications.

For high-reliability applications demanding strength surpassing SAC305, Nihon Superior introduces the LF-C2 lead-free alloy. Leveraging both dispersion and solid solution strengthening, LF-C2 delivers superior strength. With a liquidus temperature of 213°C, it facilitates reflow at a lower temperature than SAC305.

The P608 flux medium ensures wetting comparable to halogen-containing pastes, despite being completely halogen-free. SN100CV P608 and LF-C2 exhibit outstanding performance across diverse component types and process parameters.

Additionally, Nihon Superior presents the TempSave™ series of low-temperature soldering materials, addressing industry goals such as reducing peak reflow temperature, minimizing package warpage, lowering energy consumption during reflow, and protecting temperature- sensitive devices.

• TempSave B58: A eutectic SnBi alloy with a low melting point of 139°C.
• TempSave B37: A ductile hypoeutectic SnBi alloy without Ag, offering exceptional drop performance, surpassing SAC305. The P610 flux medium, specifically designed for Bi alloys, ensures halogen-free compatibility. The TempSave B37 P610 solder paste can be reflowed with a peak temperature of 190°C. Additionally, a high-speed jetting paste version, TempSave B37 P611, provides consistent dot sizes.

Visit Booth 1325 at the 2024 IPC APEX EXPO to explore Nihon Superior's latest alloys, solder pastes, and lead-free products. For more information, please visit www.nihonsuperior.co.jp/english 

Kubler High Tech Solutions US is thrilled to announce its debut representation of Arcadia in booth 1715 at the upcoming IPC APEX Expo, taking place from April 9-11, 2024, in Anaheim, CA. This marks the first time Kubler US will exhibit the Galileo and Archimede machines stateside, highlighting the innovative solutions offered by Arcadia in the field of smart storage systems.

Arcadia's Archimede system isn't just about storage; it's about revolutionizing efficiency in vertical component storage. With features like optimized space efficiency, rapid reel storage and retrieval, versatile configurations, and Industry 4.0 readiness, Archimede is set to redefine how manufacturers manage their components.

The Galileo Incoming System from Arcadia streamlines component management with automated barcode detection, eliminating manual labeling errors and accelerating data collection. With its Industry 4.0 readiness, Galileo optimizes processes, minimizes management time, and eliminates sorting errors, making it an essential tool for efficient operations.

As part of its expansion strategy, Kubler US has secured top-tier reps SmartSol in Mexico, The Murray Percival Co in the Midwest, and PIT Equipment Services in the Northeast, with more signing on currently. These partnerships will ensure wider accessibility to Arcadia's innovative solutions across North America.

Don't miss out on the largest event in North America for the electronics manufacturing industry…join us in booth 1715 in Anaheim, California, from April 6-11, 2024!

For further information on Kubler US, ARCHADIA SRL and its pioneering inventory control solutions, please visit https://www.arcadiasrl.it/?lang=en