INDIANAPOLIS, IN – Specialty Coating Systems (SCS) is excited to announce its participation in The ASSEMBLY Show 2024, taking place Oct. 22-24, 2024 at the Donald E. Stephens Convention Center in Rosemont, Illinois. At Booth 1711, SCS will showcase its advanced PrecisionCoat VI and PrecisionAdvance systems, offering attendees the opportunity to explore the latest innovations in selective conformal coating and automated manufacturing solutions.

The SCS PrecisionCoat VI is a fully programmable, multi-purpose selective conformal coating and dispense system, known for its reliability, precision and flexibility. Designed to meet the demands of today’s electronics manufacturing industry, the PrecisionCoat VI applies a wide range of materials, including 100 percent solids, solvent-based and water-based coatings with high efficiency. The system's direct-drive, three-axis configuration delivers accuracy to 0.001 inches, while optional fourth and fifth axes provide tilt and rotate capabilities for even greater control. With the Automatic Quick Change (AQC) feature, users can seamlessly switch between eight separate tools within a single machine, automating and controlling the application of multiple materials with ease.

In addition, SCS will exhibit the PrecisionAdvance conveyor system, a modular, pin-type-edge handling solution designed to fully integrate with the PrecisionCoat and PrecisionCure systems. The PrecisionAdvance provides seamless line management, automating the movement of circuit boards through coating and assembly processes. Available in four configurations, the conveyor system ensures precise control of board flow, inspection and transit, enhancing overall operational efficiency.

Attendees are encouraged to visit Booth 1711 to experience how SCS’s advanced solutions streamline production processes and enhance product quality in electronics manufacturing.

For more information about the PrecisionCoat VI, PrecisionAdvance and other SCS products, please visit www.scsequip.com 

SEOUL – PEMTRON, an inspection equipment developer and supplier, is pleased to announce its participation in SEMICON Europa, scheduled to take place Nov. 12-15, 2024 at the Messe München in Munich, Germany. In Booth C2844, PEMTRON will feature a lineup of state-of-the-art solutions, including the MARS System, APOLLON System, and the 8800WI Wafer Inspection System, all designed to elevate quality control and efficiency in electronics manufacturing.

MARS AVI System
PEMTRON’s MARS system is a high-speed Automated Visual Inspection (AVI) solution developed specifically for memory modules. Known for its precision and reliability, the MARS system employs advanced image processing technology to deliver fast and accurate inspection results. Designed to handle the rigorous demands of memory module manufacturing, the MARS system ensures consistent performance and enhances quality control while improving production efficiency.

APOLLON Package Inspection System
The APOLLON system is optimized for package inspection and supports a wide variety of package types, including BGA, LGA, QFN, QFP, CSP, and SOP. With real-time defect identification and automated reporting capabilities, APOLLON enhances manufacturing efficiency by reducing downtime. The system’s ability to quickly detect and address defects ensures that high-quality standards are met throughout the packaging process.

8800WI Wafer Inspection System
The 8800WI wafer inspection system employs advanced 2D and 3D imaging technologies to inspect various types of bumps, including micro bumps. This system is essential for identifying and addressing quality issues early in the semiconductor manufacturing process. Its cutting-edge imaging capabilities enable detailed inspection of even the smallest defects, ensuring superior quality control in wafer production.

Attendees of SEMICON Europa 2024 are invited to visit PEMTRON at Booth C2844 to experience live demonstrations of these advanced inspection systems and explore how PEMTRON’s solutions can enhance manufacturing efficiency and product quality.

For more information about PEMTRON, please visit www.pemtron.com.

MUNICH – The Electronica 2024, one of the world’s most important trade fairs for electronics being held from November 12 to 15, will once again bring leading experts, users and manufacturers to Munich. ASMPT will present its latest technical innovations in the field of bonding for co-packaged optics components and power modules in Hall C3, Booth 300.

“Artificial intelligence and electromobility will be the main trends and drivers of technological and economic change in the coming years,” says Dr. Johann Weinhändler, Managing Director of ASMPT AMICRA and responsible for ASMPT’s Semiconductor Solutions Division in Europe. “These rapidly growing markets place special demands on interconnect technologies in semiconductor manufacturing. With hybrid bonding and silver sintering we are opening up new opportunities in these fields.”

AMICRA NANO: Hybrid bonding for super-fine structures

Exploiting the power of future high-performance computers and AI systems to the fullest requires extremely fast fiber-optic data links. Co-packaged optical components, in which tiny light-emitting and light-receiving components must be placed with an exceptional degree of precision, are essential for such connections.

Hybrid bonding is the right technology for such highly miniaturized structures because it does not require any solder paste or adhesives. In a two-stage process, a chemical bond is first created between two silicon oxide layers, and then the underlying copper layers are activated through thermal treatment so that they form a mechanically stable and electrically conductive bond.

The highly flexible die and flip-chip AMICRA NANO bonder was developed for such tasks and will be on display at the booth. With a placement accuracy of ±0.2 µm, several integrated heating systems and a high-purity processing environment, the AMICRA NANO is extremely flexible and can be used for various bonding technologies.

SilverSAM: Sintering instead of soldering

For power modules that must withstand high currents, conventional soft soldering is not always suitable. With videos and sample products, ASMPT will show at this year’s Electronica how the sintering process can be used to create temperature-resistant and highly conductive connections in power electronics.

The versatile SilverSAM platform uses a combination of pressure, temperature and time to bond silver particles in the previously applied paste. To protect the components, this is done at temperatures that are well below the melting point of silver (961°C or 1,762°F). The machine can process different materials such as DBC (direct bonded copper) and AMB (active metal brazing) and supports various processes such as wet and dry pastes as well as die transfer films (DTF). With an automatic tool changer and a bonding force of up to 588 N, the SilverSAM delivers high productivity and scalability for the mass production of power modules. The SilverSAM platform thus combines flexibility, productivity and high sintering quality, making it ideal for applications in modern power electronics.

Altus Group, a leading distributor of capital equipment in the UK and Ireland, is pleased to announce the appointment of Ella Gwilliam as their new Operations and Planning Assistant. She will play a key role in further strengthening the company’s capacity to support customers through improved project management and breakdown recovery.

Ella brings a wealth of experience to Altus, having previously worked in resource planning within the technology sector. Her background includes close collaboration with customers to assess issues and coordinating with engineering teams to deliver effective solutions. This experience will be invaluable as Altus continues its rapid growth and expands its network of partnerships.

Altus has seen sustained growth, with the number of machines supported by the company increasing year on year. The company is adding over 100 new machines annually, servicing both existing and new customers. Ella’s addition to the team is part of Altus’s broader strategy to bolster their operations and planning capabilities, ensuring they maintain high standards of support as their business evolves.

“Ella’s arrival marks an important step forward for our Aftersales and Engineering Support teams,” said Mike Todd, Operations and Planning Manager at Altus. “We’re pleased to have her on board, and I’m confident she will make a significant impact on the support side of our business.

“At Altus, we set the highest standards for customer service, and efficient operations and planning are vital to ensuring satisfaction, successful project delivery, and quick recovery from breakdowns. With the addition of Ella to the team, we are better equipped to handle the increasing demands as we continue to take on larger, more complex projects with a growing customer base. This is a strong move for our future!”

Ella’s ongoing onboarding process will equip her with a thorough understanding of Altus’ processes, so that she is ready to hit the ground running. Her addition represents just one of many new hires aimed at supporting Altus’s continued modernization and growth.