CAMBRIDGE, UK – 3D electronics is an emerging manufacturing approach that enables electronics to be integrated within or onto the surface of objects. 3D electronic manufacturing techniques empower new features, including mass customizability, greater integration, and improved sustainability in the electronics industry. There are three main approaches to 3D electronics: applying electronics to a 3D surface, in-mold electronics, and fully printed 3D electronics. Each approach is discussed in detail in the newly launched IDTechEx report "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets".

The report weighs the pros and cons of each approach with numerous case studies showing how different manufacturing techniques and materials meet the requirements for application opportunities across the automotive, consumer goods, IC packaging, and medical device sectors.

Applying electronics to 3D surfaces

The most established approach to adding electrical functionality onto the surface of 3D objects is laser direct structuring (LDS). LDS saw tremendous growth around a decade ago and is used to manufacture hundreds of millions of devices each year, including antennas and simple conductive interconnects to the surface of 3D injection-molded plastic objects. However, despite its high patterning speed and widespread adoption, LDS has some weaknesses that leave space for alternative approaches to surface metallization. For example, valve jet printing, also known as dispensing, is already being used for a small proportion of antennas. This technique enables the rapid deposition of a wide range of materials.

Aerosol jetting and laser-induced forward transfer (LIFT) are other digital deposition technologies covered in the report. These technologies offer higher resolutions and rapid deposition of a wide range of materials, respectively. The IDTechEx report also benchmarks other emerging techniques, such as ultra-precision dispensing, electrohydrodynamic printing, impulse printing, pad printing, and spray metallization. IDTechEx forecasts a gradual growth in the market for partially additive electronics, particularly in the telecommunications and microelectronics sectors.

In-mold electronics

In-mold electronics (IME), in which electronics are printed/mounted prior to thermoforming into a 3D component, facilitate the transition towards greater integration of electronics, especially where capacitive touch sensing and lighting are required. IME offers multiple advantages relative to conventional mechanical switches, including a reduction in weight and material consumption of up to 70% and much simpler assembly.

The IME manufacturing process can be regarded as an extension of the well-established in-mold decorating (IMD) process. Thus, much of the existing process knowledge and capital equipment can be reused. IME differs from IMD through the initial screen printing of conductive thermoformable inks, followed by the deposition of electrically conductive adhesives and the mounting of SMDs (surface mount devices, primarily LEDs at present). More complex multilayer circuits can also be produced by printing dielectric inks to enable crossovers.

Despite the advantageous features, commercial deployment of IME-integrated SMD components has thus far been fairly limited. This relatively slow adoption, especially within the primary target market of automotive interiors, is attributed to both the challenges of meeting automotive qualification requirements and the range of less sophisticated alternatives, such as applying functional films to thermoformed parts. Along with greater acceptance of the technology, the adoption of IME will require clear design rules, materials that conform to established standards, and, crucially, the development of electronic design tools. IDTechEx predicts that the most significant growth in 3D electronics will occur in in-mold electronics (IME) once it passes its validation stage.

Fully printed 3D electronics

Arguably, the most innovative approach to additive electronics is fully printed 3D electronics, in which dielectric and conductive materials are sequentially deposited. Combined with placed SMD components, this results in a circuit, potentially with a complex multilayer structure embedded in a 3D plastic object. The core value proposition is that each object and embedded circuit can be manufactured using a different design without the expense of manufacturing masks and molds each time.

Fully 3D printed electronics are thus well suited to applications where a wide range of components need to be manufactured at short notice. The technology is also promising for applications where a customized shape and even functionality are important. The ability of 3D printed electronics to manufacture different components using the same equipment and the associated decoupling of unit cost and volume could also enable a transition to on-demand manufacturing.

The challenge for fully 3D printed electronics is that manufacturing is fundamentally a much slower process than making parts via injection molding since each layer needs to be deposited sequentially. While the printing process can be accelerated using multiple nozzles, it is best targeted at applications where customizability offers a tangible advantage. Ensuring reliability is also a challenge, considering different material properties; additionally, with embedded electronics, post hoc repairs are impossible - one strategy is using image analysis to check each layer and perform any repairs before the next layer is deposited.

Comprehensive analysis and market forecasts

The new IDTechEx report, "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets", analyzes the technologies and market trends that promise to bring electronics manufacturing into the 3D realm. Drawing from over 30 company profiles, the report assesses three distinct segments of the 3D electronics landscape. The IDTechEx report evaluates each segment's different technologies, potential adoption barriers, and application opportunities.

IDTechEx's new report also includes detailed 10-year market forecasts for each 3D electronics manufacturing technology, segmented by application sector and delineated by both revenue and area/volume.

To find out more about this report, including downloadable sample pages, please visit www.IDTechEx.com/3DElec 

For the full portfolio of printed & flexible electronics market research from IDTechEx, please see www.IDTechEx.com/research/pe 

TAIPEI – Hon Hai Technology Group ("Foxconn") (TWSE:2317) announced its worldwide operations will run fully on green electricity by 2040 and has joined the global initiative RE100, in a milestone on Earth Day 2024 that adds the world's largest electronics manufacturer and technology solution provider among the most influential businesses committed to 100% renewable electricity.

The pledge, at the company's 50th anniversary, is an acceleration of Foxconn's determination to move its operations towards a more environmentally friendly and sustainable direction. Foxconn's renewable energy ratio now exceeds 40%, two years after it first publicly pledged on Earth Day 2022 to use at least 50% green power by 2030.

Led by the Climate Group and in partnership with CDP, RE100's mission is to accelerate change towards zero carbon grids at scale. Foxconn has joined multiple international sustainability initiatives, including environmental reporting non-profit CDP and the GHG emissions validation Science Based Target initiative (SBTi), because it is the right thing to do for ensuring a safer, sustainable world.

"In promoting sustainability, Foxconn will continue to seek the most suitable international standards. This decision to respond to RE100 is based on this thinking. More importantly, we hope to set an example with our supply chain and partners so they will prioritize sustainable management as well," said Foxconn Chairman and CEO Young Liu, who also heads the Group's Sustainability Committee. "Foxconn will also promote green energy at its global locations to share, collaborate and thrive with all stakeholders."

Earlier this month, Foxconn shared its latest CDP scoring for environment stewardship in 2023. It earned an (A-) in climate change and an (A) in supplier engagement rating, demonstrating leadership in both areas. It scored a (B) in water security, indicative of good environment management. All three metrics improved from the previous year.

In 2020, the Group formally responded to the three goals proposed by the Climate Action 100+ by pledging to achieve net-zero emissions in the value chain by 2050, and in 2023 its short-term emission reduction targets were validated by SBTi. Last year, Foxconn released its first Net Zero Vision Report, based on Task Force on Climate-related Financial Disclosures (TCFD) recommendations.

MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is thrilled to announce the launch of its newest webinar series as part of ZESTRON Academy, focusing on Surface Mount Technology (SMT). This series is designed to provide unparalleled insights into the latest trends, technologies, and best practices in the field of SMT cleaning.

With advancements in electronics manufacturing constantly evolving, staying ahead of the curve is paramount. ZESTRON Academy’s SMT Webinar Series is an invaluable resource for engineers, technicians, and industry professionals seeking to enhance their knowledge and skills in SMT cleaning processes.

The SMT Webinar Series will cover various topics tailored to meet the diverse needs of today's electronics manufacturing industry. Participants can expect deep dives into subjects such as:

• Advancements in Solder Paste Printing
• Overcoming the Challenges for Implementing IPC J-STD-0001 in Your Factory
• Optimizing Removal of Conformal Coating Residues
• Surface Reliability
• Advanced Cleaning and Coating Solutions for Enhanced Performance in E-Mobility
• Maximizing Efficacy for Cost Savings and Increased Capacity in Cleaning Processes

Each webinar will be presented by ZESTRON’s seasoned experts, who bring decades of collective experience in precision cleaning and SMT manufacturing. Attendees will interact with these industry leaders, gaining valuable insights and practical solutions to address their specific challenges.

The ZESTRON Academy SMT Webinar Series will kick off in May 2024. Registration is now open, and interested individuals can secure their spots by visiting the ZESTRON Academy Webinar Series Page. Don’t miss this exclusive opportunity to gain expert insights and elevate your SMT cleaning practices.

For more information about the ZESTRON Academy SMT Webinar Series and to register, please visit https://www.zestron.com/usa/en/education/2024_cleaning-webinars#SMT%20Topics 

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Juarez Expo & Tech Forum taking place on May 9 at the Injectronic Convention Center in Ciudad Juarez, Chihuahua, Mexico. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Juarez Expo & Tech Forum on May 9th, or visit www.aimsolder.com