Press Releases
W. CONSHOHOCKEN, PA – Heraeus Electronics, a leading provider of advanced materials solutions, is pleased to announce the successful acquisition of the PriElex electronics inks business line from Kayaku Advanced Materials Inc. The acquisition, effective January 31, 2024, strengthens Heraeus Electronics’ Thick Film business and expands its portfolio of offerings for the electronics materials industry.
PriElex, renowned for its expertise in electronics inks, has developed a strong reputation in the sector. By joining forces with Heraeus Electronics, a global leader in materials technology, the acquisition enables Heraeus Electronics to enhance its position and provide customers with an even broader range of high-quality and innovative solutions for thick film applications.
“We are excited to welcome PriElex into the Heraeus family,” said Mark Challingsworth, Global Head of Business Line Thick Film Materials at Heraeus Electronics. “This acquisition reinforces our commitment to deliver exceptional product quality- tailor-made and in-time, technical support, and customer service to our valued customers. The integration of PriElex's expertise and technology will enable us to offer a more comprehensive and tailored portfolio of solutions for thick film applications.”
Heraeus Electronics’ Thick Film business is globally recognized for its broad range of thick film materials. With our cutting-edge technologies and in-depth understanding of the industry, we have established ourselves as a reliable partner in enabling the success of various electronics applications across numerous sectors.
Partners and customers of both Heraeus Electronics and PriElex can expect a smooth transition and ongoing support throughout the integration process. Furthermore, customers can be assured of uninterrupted service and access to a broader portfolio of advanced solutions.
For more information about Heraeus Electronics and its comprehensive range of thick film materials, please visit www.heraeus-electronics.com. For details about PriElex, please visit www.kayakuam.com/prielex-full-product-listing.
WASHINGTON — The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending House passage tonight of the Tax Relief for American Families and Workers Act. The legislation includes two provisions critical to the semiconductor industry: the restoration of domestic R&D expensing and the United States-Taiwan Expedited Double-Tax Relief Act. The bill passed by a vote of 357-70.
“The Tax Relief for American Families and Workers Act would strengthen the U.S. semiconductor industry by promoting innovation and removing impediments to business with one of our top trading partners, Taiwan. The legislation restores domestic R&D expensing and aims to resolve tax matters between the U.S. and Taiwan, two provisions critical to boosting the competitiveness of the U.S. semiconductor industry and reaching the full potential of the CHIPS and Science Act. We applaud the House for approving the bill with strong, bipartisan support and urge the Senate to swiftly follow suit.”
BEWHOLME, UK – Bentec is pleased to announce that Prey By Detech has appointed Panatek CO., a leading provider of integrated in the electronics industry, to represent the company throughout the regions of Egypt, Saudi Arabia, and the UAE. With a commitment to delivering cutting-edge manufacturing technologies and smart solutions, Panatek is poised to enhance the presence of Prey’s Universal Product Inspector (UPI) in these strategic markets.
Established in 2017 by electronics experts and industry leaders, Panatek CO. has rapidly become a market leader in manufacturing technologies, serving clients in Egypt, Africa, and Arab countries. Specializing in automatic production lines, Surface Mount Technology (SMT), Through Hole Assembly (THT), PCB Fabrication, and more, Panatek is known for providing turnkey solutions and unparalleled technical service and support.
Prey's Universal Product Inspector (UPI) marks a significant advancement in automated inspection technology. Addressing the need for final inspection in various industries, where human inspection is traditionally implemented, the UPI ensures repeatability, flexibility, and accuracy.
Key Features and Upgrades of Prey's UPI:
1. Dual Camera Capture System: Simultaneously captures both top and bottom sides of any object, offering instantaneous inspection within sub-4 seconds.
2. Prey Inspector Software: Intuitive software designed in-house for a user-friendly experience, facilitating ease of navigation for operators and programmers.
3. Universal Carrier Mounting and Design: Customizable base tray allows customers to create their own carriers for mounting products, ensuring the UPI’s universal applicability.
“We are thrilled to have Panatek CO. as our exclusive sales representative in Egypt, Saudi Arabia, and the UAE. Panatek’s dedication to excellence and their vast experience in delivering top-notch manufacturing solutions make them an ideal partner for us,” commented David Erskine, Managing Director, Prey by Detech. “Together, we look forward to introducing the Universal Product Inspector to these key markets, revolutionizing automated inspection processes.”
To find out more about Panatek CO, visit the company at www.panatek-me.com. For further information about Prey UPI, visit www.bentec-int.com/prey-upi/ or contact the company at Detech Europe Limited, The Farm Office, Model Farm, Atwick Road, Bewholme, East Riding of Yorkshire, YO25 8DT, United Kingdom; +44 (0)1262 409944; E-mail: sales@detech-europe.com.
AUSTIN, TX – Tecate Group, a prominent distributor and manufacturer in the electronics industry, has successfully implemented Cetec ERP, transforming their manufacturing operations.
Tecate Group transitioned to Cetec ERP approximately 8 months ago. Since its implementation, the company has seen significant advantages with Cetec ERP over the legacy system, citing the software's user-friendly interface and quick error resolution capabilities. Unlike their previous system, which posed challenges in undoing errors, Cetec ERP provides a seamless "undo" option, significantly reducing the time spent on error correction.
Tecate Group, a distributor and manufacturer of supercapacitors, capacitors and surface mount products, found Cetec ERP to be a game-changer in their day-to-day operations. The software's MySQL database integration allows Tecate to access critical data, facilitating the creation of custom reports tailored to their specific needs. Doug Hubbell, Systems Manager at Tecate Group highlighted the outstanding support received from the Cetec ERP team. The personalized attention and technical support provided by Cetec ERP's team played a crucial role in ensuring a smooth transition and addressing Tecate's unique requirements.
Cetec ERP is committed to delivering robust solutions and exceptional support, empowering manufacturing companies like Tecate Group to streamline their operations and enhance overall productivity.
To learn more about Cetec ERP and their advanced manufacturing software solutions, visit www.cetecerp.com
CLINTON, NY – Indium Corporation® will feature selections from its portfolio of proven products for automotive and power electronics applications, including electric vehicle manufacturing, at APEC 2024, February 25‒29 in Long Beach, California.
Specifically developed for power module package-attach applications, Indalloy®301 LT is a new bismuth-free alloy that prevents thermal defects in the module without sacrificing reliability like traditional bismuth-containing, low-temperature alloys.
Available in InFORMS® configurations, Indalloy®301 LT offers a solution for consistent bondline thickness and improved strength to enhance thermal and mechanical reliability of the solder joint while reducing processing temperature and energy input during manufacturing. This enables complementary Pb-free high-reliability alloy technologies such as Indalloy®276 to be used in power module die-attach, component-attach, or interconnects without the risk of re-melt and degraded performance. Indalloy®301 LT is also available in preforms and ribbon configurations and can be offered flux-free or with Indium Corporation’s flux coating technology.
Additionally, drawing on its significant automotive industry expertise and an award-winning portfolio of proven products, Indium Corporation will feature:
- Award-winning InFORMS® – reinforced solder alloy fabrications which improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
- InTACK™ – a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes. Designed for use in no-flux reflow applications with formic acid, InTACK™ is specially formulated with high tack to hold a die, chip, or solder preform in place without movement, reducing the dependency on tooling without compromising soldering or sintering quality.
- QuickSinter® – a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput. Both silver and copper sinter pastes are available. The portfolio includes the InFORCE™ range of pressure sinter pastes and the InBAKE range of pressure-less sinter pastes. Applications include die-attach and substrate-attach in power electronics.
- Durafuse® HT – a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse® HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.
- Indium8.9HF Solder Paste Series – an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
- Heat-Spring® – a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes. Because of its sold metal state, Heat-Spring avoids pump-out and bake-out problems. It also offers a sustainable solution due to our indium reclaim and recycle program.
To learn more about Indium Corporation’s innovative products for EV and power electronics, visit us at booth #752 at APEC or online at indium.com
TOKYO – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be once again exhibiting at Smart SMT & PCB Assembly 2024, an annual trade exhibition focused on semiconductor surface mount/printed circuit board manufacturing to be held in Suwon, Korea from February 21 to 23, 2024. Show visitors are invited to visit booth I 102 to discover Saki’s latest automated inspection solutions including SPI, AOI and the award-winning X-ray Automated Inspection System (AXI).
As a total solution for in-line automated inspection for SMT processes, Saki's latest hardware and software will demonstrate the high-speed, high-precision automated inspection capability realized by Saki's latest hardware and software.
Alongside its co-exhibitors JS TECH and H&J Corporation, the Saki technology team will present the company’s latest equipment lineup for high-speed, high-precision SPI-AOI-AXI in-line inspection:
- 3Xi-M110 (AXI) - the industry's fastest automated X-ray inspection solution and winner of a Global Technology Award 2023;
- 3Di-LS3 (AOI) - advanced AOI with on-site camera module upgrade capability;
- 3Di-LS2 (AOI) - with 18µm resolution camera module;
- 3Si-LS2 (SPI) - same rigid gantry structure and drive unit as AOI providing high-speed, high-precision solder inspection;
- BF-Sirius (2D-AOI) - benchtop 2D-AOI with UV illumination for conformal coating inspection.
In addition to its machine solutions, Saki will also present its versatile software suite which works with the equipment to form a total solution for quality inspection:
- One Programming / Saki Link function (reference exhibit) - Software system for batch operation and centralized management of SPI, AOI, and AXI on a line-by-line basis;
- QD Analyzer – Saki’s powerful SPC system that contributes to improved product quality and productivity by accumulating and statistically analyzing the operating status and inspection results of all equipment on the production line;
- AI Solutions (reference exhibit) - an introduction to Saki’s unique integration of AI functionality.
“We are very pleased to introduce Saki's latest solutions for SMT processes to our customers in Korea, Asia, and all over the world at Smart SMT & PCB Assembly again this year,” said Mr. Kim Kyu Seob, General Manager of Saki Corporation Korea Representative Office. “Our solutions help our customers solve their challenges by promoting more automation, reducing labor, and eliminating the need for specialized skills in the manufacturing process. We invite you to visit our booth for a complete overview of Saki's latest solutions.”
For more information about Saki visit www.sakicorp.com/en/
Press Releases
- KIC to Showcase Innovative Reflow, Wave, and Cure Profiling Solutions at Elektronikmessen E-24 in Denmark
- Bittele Electronics Achieves ERAI Certification to Eliminate the Threat of Counterfeit PCB Components
- Libra Industries Welcomes Visionary Leader GayeLyn Bates as Senior Vice President of Business Development
- Spectrum Advanced Manufacturing Technologies, Inc (an Ocutrx Company) Announces Retirement of CEO and Appointment of Incoming CEO of Manufacturing Subsidiary