Press Releases
CLINTON, NY – Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will present at iNEMI’s upcoming seminar, Humidity Robustness and Isolation Coordination for e-Mobility. The seminar, hosted by ZESTRON Europe, will be held on February 1 in Ingolstadt, Germany.
Andreas’ presentation, No-Clean Flux Residues in Automotive Applications Must Meet Higher Requirements, will examine the influence of no-clean flux chemistries on the reliability of automotive PCB applications. In particular, the study focuses on failure caused by dendritic growth for high-power, low-standoff components for enhanced SIR conditions.
Due to increased automotive electrification (48V, HEV, EV) and the subsequent utilization of high-power components such as DPAKs and Power-QFNs in under-the-hood electronics, the SIR (Surface Insulation Resistance) specifications for evaluating the electrical reliability of no-clean solder paste flux chemistry have also become more stringent. For example, test voltage has increased from 5V to 10–50V, test time has increased from 168 to 500–1,000 hours, pitch has decreased from 0.5mm to 0.2–0.3mm, and minimum SIR threshold has increased from 100MΩ to 500MΩ.
No-clean solder pastes are normally used in automotive PCB assembly to solder low-standoff components such as DPAKs and power-QFNs (gap between the PCB pad and the component underbody is typically under 75µ).
“During reflow, volatiles in the flux chemistry, such as activators and solvents boil off; however, a lower standoff reduces the opportunity for the flux volatiles to vent, resulting in ‘wet’ flux residue post-reflow,” said Andreas. “It is, therefore, critical that the no-clean flux residue does not cause ionic dendritic growth and corrosion under low-standoff power components, throughout the working life of the product.”
Andreas serves as Technologist – Advanced Applications and Technical Manager for Germany, Austria, and Switzerland for Indium Corporation. He has more than 20 years of experience in automotive electronics and power electronics, including the development of advanced customized solutions. In 2014, the Austrian Patent Office awarded him the “Inventum” award for his patent for innovate LED automotive lighting as one of the top ten applicants. He is an ECQA-certified development engineer and has earned the Six Sigma Yellow Belt.
TAIPEI – Test Research, Inc. (TRI) will feature Innovative Inspection Solutions, SPI, AOI, AXI, and ICT solutions at a series of technology seminars and product demos held in Taiwan, Shenzhen, and Suzhou. Each of the one-day events will focus on the latest test and inspection technology innovations for SMT and Advanced Packaging production, including the Smart Factory and AI-powered Solutions.
TRI's 2024 portfolio will showcase High-Speed Line inspection platforms, such as the TR7700QH SII, capable of inspecting at speeds of 80cm²/s. During the seminars, there will be a demonstration of TRI's High-Accuracy and High-Resolution line for Advanced Packaging Inspection. The lineup will also feature X-ray Inspection demonstrations, such as the 3D CT AXI TR7600F3D LL SII with an improved platform for High-Speed Inspection.
Additionally, TRI will showcase Board Testing platforms, such as the TR5001 SII series with LED Analyzer for Automotive applications and the High-Pin Count Tester TR8100HL SII for High-throughput production lines. Lastly, there will be a live demo of TRI's AI-powered Solutions and the improved Yield Management System 4.0 (YMS 4.0).
To register for any of the seminars, please contact your TRI sales representative.
| Location | Date | Venue |
| Taiwan | March 7, 2024 | TRI Linkou Production Center |
| Shenzhen | March 13, 2024 | Shangri-la Hotel, Shenzhen |
| Suzhou | March 15, 2024 | Paradox Kunshan Hotel, Suzhou |
ATLANTA — ECIA is pleased to announce the 2024 Executive Conference Core Committee. Previously announced Chair Ken Bellero, Schaffner, and Co-Chair Maryellen Stack, Sager Electronics have finalized the core committee of returning and new members who already have hit the ground running for the best conference yet.
- Pam Berigan, Sager Electronics
- Lori Bruno, LuscomBridge
- Tobi Cornell, Kruvand Associates
- Robert Derringer, Crouzet
- Juliet Fajardo, TDK-Lambda
- Heather Fulara, DigiKey
- Bob Garcia, Ferrari Technical Sales
- Nicolle Ladouceur, ROHM Semiconductor
“I am really looking forward to working with this talented group of people,” commented Stephanie Tierney, ECIA’s Director of Member Communications and Member Engagement. “2023 was a record-breaking conference on many levels: sponsorships, attendance, survey responses and more were all ahead of the year before. This group has already vowed to surpass those records, and it will be fun working with them to meet the ambitious goals they have set for the 2024 Conference,” she continued. “All I can say is, ‘Watch out for another great event planned by this fantastic committee!’”
Subcommittees will be announced soon. For more information, go to https://www.eciaexecconference.org/. Sponsorship opportunities have been released and are filling up fast!
BANGKOK, THAILAND – Fabrinet (NYSE: FN), a leading provider of advanced optical packaging and precision optical, electro-mechanical and electronic manufacturing services to original equipment manufacturers of complex products, today published its Sustainability Report for fiscal year 2023. The report highlights Fabrinet’s continued commitment to operating in an ethical, environmentally responsible, and socially supportive manner.
Seamus Grady, Chief Executive Officer of Fabrinet, said “Fabrinet’s commitment to community, sustainability and accountability is integral to our ability to drive value for our customers, employees and shareholders. Over the past year, we advanced our sustainability initiatives across multiple fronts, and are proud to share our progress with our stakeholders and the broader community.”
The report covers Fabrinet’s progress toward sustainability initiatives in fiscal year 2023, including:
- Improving quality of life for our local communities
- Expanding our talent pipeline through internship opportunities
- Upholding our dedication to labor and human rights
- Identifying sustainability opportunities through lean manufacturing
- Reducing our carbon footprint
- Advancing our approach to ESG oversight
The full report can be accessed on Fabrinet’s website at www.fabrinet.com/about/esg-initiatives
WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from vice president of government affairs David Isaacs in response to the introduction in Congress of the Tax Relief for American Families and Workers Act. The legislation includes two provisions critical to the semiconductor industry: the restoration of domestic R&D expensing and the United States-Taiwan Expedited Double-Tax Relief Act.
“SIA applauds Senate Finance Committee Chair Ron Wyden (D-Ore.) and House Ways and Means Chair Jason Smith (R-Mo.) for spearheading the Tax Relief for American Families and Workers Act. The legislation restores domestic R&D expensing and seeks to resolve tax matters between the U.S. and Taiwan—two provisions essential to ensuring the competitiveness of the U.S. semiconductor industry and fully realizing the benefits of the CHIPS and Science Act.
“The CHIPS Act was passed, in part, to help unlock investments in the semiconductor R&D ecosystem here in the U.S. The requirement of amortizating research expenditures undermines those efforts and runs counter to the longstanding immediate deduction of R&D costs that helps to sustain U.S. leadership in this vital technology.
“We must resolve double taxation between the United States and Taiwan and reduce barriers to trade between the two jurisdictions. At a time the semiconductor industry is making significant investments in the U.S. following the passage of the CHIPS Act, reconciling tax matters between the U.S. and one of its top trading partners has become a pressing matter.
“We further commend the House Ways and Means Committee for approving the tax package that would implement tax policies central to the success of the U.S. semiconductor industry. We urge the House and the Senate to take up and pass this critical legislation.”
SAN DIEGO – KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop. The workshop is scheduled to take place on Wednesday, Feb. 21, 2024, from 8:30 a.m. to 3 p.m. CST at Delta Hotel Menomonee Falls.
The workshop will feature speakers from profile equipment suppliers, SMT Oven (reflow), Selective Solder, Wave Solder equipment suppliers, and Solder suppliers. Workshop topics will cover Best Practices, Tips and Tricks, How to Profile, Machine Health, and Solder Defects.
Miles Moreau, with decades of experience in the electronics and semiconductor manufacturing industry, will delve into profiling basics and best practices contributing to the knowledge exchange at the Wisconsin Chapter workshop.
As General Manager at KIC, Moreau has been instrumental in defining the company's product roadmap and bringing innovative solutions to the market. He holds numerous US and international patents through his work at KIC.
For more information about KIC and its revolutionary solutions, please visit www.kicthermal.com
Press Releases
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