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PORTO, PORTUGAL – Critical Manufacturing, a pioneer in future-ready, multi-site manufacturing execution systems (MES) and a subsidiary of ASMPT, has been listed in the Deloitte ‘Technology Fast 50’, reflecting the innovation and success of its MES solutions. The Deloitte Technology Fast 50 Program is an annual prestigious award that recognizes and profiles the fastest-growing public or private technology companies in a specific region. The program operates in various countries and regions, including Central Europe, Belgium, Portugal, and others.

Francisco Almada Lobo, chief executive officer and co-founder of Critical Manufacturing, said, “Being listed as one of the top-growing companies in Portugal is a prestigious honour and reflects the outstanding work carried out by my colleagues over the past years. Between 2019 and 2022, we experienced a CAGR of nearly 30%.”

Critical Manufacturing’s success has come from a series of innovations in MES technology. Its latest solution, Critical Manufacturing V10 MES, offers the most comprehensive and pioneering MES solution for electronics, semiconductor, medical device, and industrial equipment manufacturers. It provides a range of features that go above and beyond the expectations of the manufacturing industry. With real-time views of operations, instant, clear guidance to every operator or technician, and the ability to easily manage varied products, the MES provides complete data and insights for decision-making to improve productivity and reduce errors.

“Our MES is a fully integrated, adaptable and future-proof solution that embraces the latest technological developments and takes modern manufacturing to the next level,” continued Almada Lobo. “It enables manufacturers of sophisticated products to enhance quality, reduce cost and production errors, and increase the agility of their manufacturing plants. We have proven time again of its ability to reduce time to market for new products, optimize production processes, and provide management teams with detailed insights from global production facilities to enhance decision making processes.”

Being listed in the Deloitte Technology Fast 50 Portugal is another string to Critical Manufacturing’s bow. The Portuguese list was launched in 2023 in response to the fast-growing tech-hub in the country. The program recognizes and ranks the 50 fastest-growing technology companies in the country based on their percentage revenue growth over the past four years.

DALLAS, TX – StenTech® Inc., a leading global company specializing in SMT Printing Solutions, is delighted to announce the official launch of its new establishment in Clearwater, Florida. The facility will continue to produce SMT stencils and, starting from February, will also offer customers StenTech's Advanced Nano coating. This revolutionary coating, known for its exceptional quality, transforms SMT stencil technology.

Unlike traditional stencils, the Advanced Nano coating is exclusively applied to the underside and inside of the stencil apertures, leaving the squeegee side uncoated, and provides same day turnaround, which means rapid delivery that is unmatched in the industry. Visit advanced nano web page: (https://www.stentech.com/products/advanced-nano)

Heading the operation is Todd Marshall, facility Manager, an industry veteran with over 30 years of experience in SMT stencil and parts production, who also has an extensive background in electrical engineering. Marshall's journey began in 1992 as a sales manager for PET (Photo Etch Technology), where over the years he was instrumental in opening and managing various facilities throughout the Eastern US region. The acquisition of PET by StenTech in 2023 was a part of the company's commitment to expansion and localization.

Over the years, StenTech has grown to become the largest multi-national SMT printing solutions provider, with a presence in 20 facilities across the United States, Mexico and Canada. These strategically located facilities are interlinked, and ensure regional expertise and localized customer service. The establishment of this new facility aims to specifically serve the Florida market, providing precision laser cut SMT stencils with unparalleled same day turnaround in most cases.

"We take pride in our rapid turnaround time,” said Marshall. “ I first always inquire about the customer's desired timeframe and make it our priority to adhere to that schedule. Ensuring customer satisfaction and a seamless experience have always been my top priorities. We are excited to be able to now bring our top technologies, coatings and stencil solutions to the Florida market all within earshot.”

An open invitation is offered to all interested parties to visit the new facility, meet the team, and see the high-end equipment in production. An open house event will also be staged in February 2024. Now in its 25th year of operations, as StenTech embarks on the next chapter of its journey, the company remains committed to growth and innovation.

AVON, MA – SelecTech, Inc., a leading manufacturer of innovative and sustainable flooring products, is pleased to announce the appointment of Benjamin Smith as its new Sales Director. With a proven track record in enterprise field sales, Benjamin brings a wealth of experience and a strategic mindset to drive growth and enhance customer relationships.

In his most recent role at Khoros, Smith served as an Enterprise Account Executive. Prior to Khoros, he held key roles at Tradeshift, Anaplan, Host Analytics, and Oracle Corporation, consistently demonstrating an ability to exceed sales targets and contribute to the growth of each organization. His expertise spans various industries, including transportation, logistics, media, entertainment, healthcare, and finance.

Smith’s extensive experience in consultative sales, strategic account planning, and relationship building will be invaluable in driving SelecTech’s sales initiatives and expanding its customer base. He holds a Bachelor of Science & Business Administration with a Finance Major from the University of Denver.

"Benjamin’s impressive track record and leadership skills align perfectly with our goals for growth and innovation,” stated Tom Ricciardelli, President of SelecTech. “We are confident that Benjamin will play a pivotal role in driving our sales strategies and fostering long-term relationships with our clients."

SelecTech flooring is available in a variety of colors for commercial use. For information before ordering samples, please call 508-583-3200 or visit www.selectech.com 

SAN DIEGO, CA – Pre-registration is now open for Chiplet Summit's second annual event on February 6-8 at the Santa Clara Convention Center. Hundreds of registrants and many key exhibitors will be at the premier showcase for chiplet technology. All major chip makers have adopted chiplets as their approach to producing devices at leading-edge nodes.

The event will cover the latest architectures, development platforms and methods, and applications. Expert panels will discuss best choices, likely breakthroughs, optimization, and long-term trends. Pre-conference seminars will focus on chiplet basics, packaging methods, interfaces, design methods, working with foundries, AI in chiplet design, and the Open Chiplet Economy. Other features include a high-powered superpanel on “How Can Chiplets Accelerate Generative AI Applications?”, an expert table session (with beer and pizza), and an annual update of technologies and markets.

Industry-leading keynotes offer designers insight into trends and roadmaps. Speakers represent Applied Materials, Synopsys, Micron, Alphawave Semi, Hyperion Technologies (introducing a new packaging technology with larger packages and a 1000W power budget), and Open Compute Project (OCP). Their focus is on methods for designing processors, coprocessors, communications devices, and graphics and AI chips.

“We now see the full impact of chiplets. They allow designs to include off-the-shelf components as well as drop-ins from older process nodes,” said Chuck Sobey, Summit General Chair. “They are ideal for applications such as AI that demand more processing power, faster response time, and the ability to handle more data. Chiplet Summit will help designers make the right decisions for current projects and future needs.”

Chiplet Summit also features innovative products from industry leaders such as Applied Materials, Synopsys, Alphawave Semi, Open Compute Project, Achronix, Arm, Cadence, and Siemens EDA.

Visit Chiplet Summit:
ChipletSummit.com

CHELMSFORD, MA — VJ Electronix, a global leader in rework technologies and advanced X-ray inspection systems, proudly announces the addition of Clint Buldrini to its sales network. Clint Buldrini of Matthew Associates joins VJ Electronix as the New England Sales Representative, leveraging over two decades of expertise in electronic and mechanical manufacturing.

With a career marked by exceptional leadership and a keen understanding of manufacturing solutions, Clint Buldrini's work with VJ Electronix signifies the company's commitment to fostering top-tier talent to better serve its clientele in the New England area.

"Clint Buldrini's appointment marks a significant addition to our sales network," stated David Hamel, Director of Global Sales and Marketing, VJE. "His extensive background in spearheading successful manufacturing operations aligns perfectly with our mission to deliver cutting-edge solutions and superior service to our valued customers."

For more information or to schedule a demo, visit www.vjelectronix.com 

Indium Corporation® is proud to showcase its proven advanced assembly materials for power electronics, including the rapidly evolving electric vehicle (EV) manufacturing and e-Mobility market, at NEPCON Japan, January 24-26, in Tokyo, Japan. Indium Corporation’s products for power electronics have been demonstrated to reduce energy consumption and solve warpage issues for its customers while ensuring high reliability and improving overall efficiency.

Featured products include:

  • InFORMS® – reinforced solder alloy fabrications that improve mechanical and thermal reliability and are specifically designed to produce consistent bondline thickness for power module applications. They also address specific challenges for the power electronics industry by providing an enhanced material for the development of more reliable and higher performance modules.
  • Indalloy®301 LT Alloy for Preforms/InFORMS® – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. Specifically designed for power module applications, this alloy prevents warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. It is available in preforms, ribbon, or InFORMS®.
  • Durafuse® HT – based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys. Durafuse® HT delivers simplified processing, with no special equipment needed, and enhanced thermal cycling reliability equal to or higher than a high-Pb solder.
  • Durafuse® HR – based on a novel alloy technology, delivers enhanced thermal cycling performance (-40/125°C and -40/150°C) and superior voiding performance for high-reliability automotive applications.
  • Heat-Spring® – a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes. Because of its sold metal state, Heat-Spring avoids pump-out and bake-out problems. It also offers a sustainable solution due to our indium reclaim and recycle program.

Many of these innovative products are counted within the company’s Rel-ion™ suite of electrical, mechanical, and thermal solutions to reduce EV manufacturers’ time to market. More than five million EVs are on the road with Indium Corporation’s reliable, scalable, and proven Rel-ion products. Rel-ion materials solutions deliver reliability by:

  • Eliminating non-wet opens and head-in-pillow defects
  • Preventing dendritic growth by meeting stricter surface insulation resistance requirements
  • Preventing solder delamination with precise bondline control and increased creep and fatigue resistance
  • Reducing hot spots-induced voiding through improved thermal efficiency

To learn more about Indium Corporation’s solutions for power electronics, be sure to visit with our experts at NEPCON Japan.

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