BRIDGMAN, MI – Apollo Seiko, a leading innovator in soldering technology, is pleased to announce plans to exhibit at SMTA International 2024, scheduled to take place Oct. 21-24, 2024 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Apollo Seiko will be showcasing the J-CAT 340 LYRA at Booth 2872, located right next to the Murray Percival Group.

With its advanced temperature setting capabilities, the J-CAT LYRA allows for precise control of iron tip temperature, enabling high-quality soldering of components with varying heat capacities. This results in reliable filling of through-holes and flawless back fillets, ensuring optimal performance and reliability.

The J-CAT LYRA features an approach function, which facilitates additional axis movement during soldering. This innovative feature streamlines programming and setup, making point teaching faster and more efficient while also reducing initial setup time.

Additionally, the J-CAT LYRA offers the option for dual iron units and feeders, further enhancing its versatility and productivity. The high-powered controller can operate two feeder units simultaneously, reducing cycle time by up to 50%. Moreover, the ability to utilize two iron units is advantageous for soldering high heat capacity components, providing users with unparalleled flexibility and efficiency.

Apollo Seiko invites all attendees to visit Booth 2872 to experience the capabilities of the J-CAT 340 LYRA and to discuss their specific soldering needs with the company’s team of experts. For more information, visit www.apolloseiko.com 

WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding the first finalized agreement to allocate incentives under the CHIPS and Science Act. The agreement between Polar Semiconductor and the U.S. Department of Commerce will support the expansion of Polar’s chip production capabilities in Minnesota.

The Commerce Department previously announced preliminary incentives agreements for a range of companies and projects that will help strengthen the U.S. semiconductor supply chain.

“We applaud Polar Semiconductor and the U.S. Department of Commerce for working diligently to finalize this agreement, which represents a key milestone in the implementation of the historic CHIPS and Science Act. We are encouraged by the progress being made to get critical CHIPS awards out the door and directed to projects promoting U.S.-based semiconductor production and innovation. And we hope today’s final award is the first of many more to come over the next weeks and months. We look forward to continuing to work with leaders in industry and government to ensure the CHIPS Act delivers maximum benefits for America’s economic and national security.”

As previously announced in May, the incentives related to this agreement will allow Polar to double its U.S. fabrication capacity of sensor and power chips within two years and serve diverse market segments. As part of the announcement, Polar Semiconductor is also transitioning to become a U.S. majority-owned commercial foundry.

The CHIPS Act’s manufacturing incentives have sparked substantial announced investments in the U.S. In fact, companies in the semiconductor ecosystem have announced more than 90 new projects across 28 U.S. states—totaling hundreds of billions of dollars in private investments—since the CHIPS Act was introduced. These announced projects will create more than 58,000 jobs in the semiconductor ecosystem and support hundreds of thousands of additional U.S. jobs throughout the U.S. economy.

An SIA-Boston Consulting Group report released in May projected the United States will triple its domestic semiconductor manufacturing capacity from 2022—when CHIPS was enacted—to 2032. The projected 203% growth is the largest projected percent increase in the world over that time. The report also projected America will capture over one-quarter (28%) of total global capital expenditures (capex) from 2024-2032.

ZION, IL – Stannol, a leader in soldering technology, is pleased to announce its participation in SMTA International 2024, where the company will showcase its latest advancements in soldering technology at Booth 2863. The event is scheduled to take place Oct. 21-24, 2024 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Attendees will have the opportunity to explore Stannol's cutting-edge products designed to enhance performance and sustainability in the soldering industry.

Stannol is proud to introduce its new water-based cleaning line, designed to meet the rigorous demands of modern manufacturing while prioritizing environmental compatibility. The new Flux-Ex series includes broadband and specialty cleaners that are perfectly tailored to their respective areas of application – e.g. for cleaning before the soldering process or for removing residues after soldering. All cleaners are delivered as a ready-to-use-mix.

Stannol's EF180 Bio PV Flux represents a significant advancement in the soldering industry, particularly within the photovoltaic module sector. This bio-flux utilizes renewable raw materials to reduce reliance on fossil fuels, setting a new standard for sustainable manufacturing. Its innovative zero-halogen, resin-free formulation ensures high-quality performance while prioritizing environmental responsibility.

Also on display, Stannol’s Kristall 600-Series and Fairtin and Flowtin solder wires are at the forefront of soldering technology. The innovative use of micro-additives in Flowtin extends the usage of solder tips by up to 30% and enhances the overall quality and durability of solder joints. The Kristall 600-Series, featuring the Fairtin product line, combines synthetic resins and modern activators for fast, safe wetting and minimal, transparent residues, ensuring superior soldering results.

Stannol's solder paste SP6000 is specially developed for use with alloys TSC305 (Sn96.5Ag3Cu0.5) T4 and TSC105 (Sn98.5Ag1Cu0.5) T4. During its development, special focus was placed on environmental compatibility alongside technical properties. The result is an impressive reduction of CO2 emissions by more than 85% compared to common solder pastes. This achievement is made possible through the use of recycled solder, sustainable packaging materials, and climate-neutral transport. With SP6000, Stannol emphasizes both performance and sustainability.

Visitors to Stannol's booth at SMTA International 2024 can experience firsthand the innovative solutions that are shaping the future of the soldering industry. Don't miss the opportunity to learn more about how Stannol's products can elevate your manufacturing processes while promoting environmental sustainability.

For more information, visit www.stannol.com 

MANASSAS, VA – ZESTRON, the global leader in high-precision cleaning products, services, and training solutions for the electronics manufacturing industry, is pleased to announce that its Senior Application Engineer, Ravi Parthasarathy, will present at SMTA International 2024. The presentation, titled “Optimizing Cleaning Strategies for Advanced Packaging Technologies with Low Standoff Components,” will take place on Wednesday, October 23, 2024, from 2:00 PM to 3:30 PM CDT in Room 48 at the Donald E. Stephens Convention Center in Rosemont, IL, USA.

Ravi Parthasarathy will be joined by Patrick Lawrence from ITW EAE and Evan Griffith from Indium Corporation to explore the latest strategies and solutions for optimizing cleaning processes in advanced packaging applications. The presentation will address the unique challenges associated with low standoff components and offer insights into effective cleaning techniques that can improve the reliability and performance of electronic assemblies.

“We are thrilled to share our expertise on advanced packaging cleaning strategies at SMTA International 2024,” said Ravi Parthasarathy, Senior Application Engineer at ZESTRON Americas. “This collaboration with ITW EAE and Indium Corporation allows us to present comprehensive solutions that meet the demands of modern electronics manufacturing, particularly in addressing the complexities of low standoff components.” For more information on the presentation and trials performed, watch this informative video: https://pages.zestron.com/2024-smtai 

This presentation is a must-attend for professionals seeking to enhance their knowledge of advanced cleaning methodologies and looking for actionable insights to improve their manufacturing processes. Attendees can engage with industry experts and explore real-world applications that drive quality and efficiency in electronic manufacturing.

ZESTRON invites all SMTA International 2024 attendees to attend this informative session and visit them at booth #2920 to learn more about their range of high-precision cleaning solutions, including their innovative low-VOC chemistries. For more information on ZESTRON’s presence at SMTA International or to schedule a meeting, please visit https://www.zestron.com/usa/en/home