WALDENBURG, GERMANY – On January 29 to 30, 2025, the Pan-European Electronics Design Conference (PEDC) will convene leading experts from industry and research in Vienna. This newly launched event is dedicated to the entire development cycle of electronic systems. Würth Elektronik will contribute to the extensive program and host a panel on artificial intelligence.

“The experts agree that artificial intelligence will fundamentally change our lives,” explains Alexander Gerfer, CTO of the Würth Elektronik eiSos Group, a key supporter of the conference. “For Würth Elektronik, innovation, and therefore artificial intelligence, is by no means an end in itself, but a highly effective method of achieving our goal. Electronics for positive impact. Electronics should make our everyday lives easier, more pleasant, safer and more efficient. We need to use them to preserve our living space. And that is exactly what we want to discuss here at PEDC.”

The role of AI in electronics - panel with international experts

Alexander Gerfer, a member of the Technical Program Committee, will moderate the discussion “The Role of AI in Electronics” on January 29 at 2:15 PM. Following the discussion, an expert panel featuring renowned international participants will explore the topic further. These experts include the following:

• Prof. Dr. Thomas Ebel (University of Southern Denmark)
• Francis D’Souza (Banyan.eco, France)
• Savita Ganjigatti (Sienna ECAD Technologies, India)
• Dr. Reinhardt Seidel (DEEPTRONICS, Germany)

The PEDC is jointly organized by the FED and IPC associations, which together represent more than 3700 companies from the electronics industry. The conference aims to bridge the gap between industry and research in order to promote the exchange of information on the latest developments in electronics design.

The event will focus on forward-looking topics such as artificial intelligence, sustainability, advanced packaging, and digital twin technology. With a diverse program, PEDC offers participants a platform to discuss innovative approaches and actively shape the electronics industry.

WASHINGTON – The Semiconductor Industry Association (SIA) today released a policy agenda setting forth the U.S. semiconductor industry’s policy priorities and suggested areas for collaboration with the Trump-Vance administration and the 119th Congress.

The policy agenda, titled “Winning the Chip Race,” provides government leaders with actionable policy goals to position the U.S. semiconductor industry for success and ensure America’s economic strength, national security, technology leadership, and global competitiveness.

“To be the world’s economic, technology, and security leader, America must lead the world in semiconductors,” said SIA President and CEO John Neuffer. “It is essential to get in place more government policies that help us run faster at home and abroad, and compete and win in the game-changing technologies of the future. We welcome the opportunity to partner with the new administration and Congress to achieve our shared goals, reinforce America’s semiconductor resurgence, and rise to the great challenges of our time.”

“Winning the Chip Race” sets forward several key policy priorities:

• Semiconductor Manufacturing Incentives and R&D Investments: Advancing incentives for U.S. chipmaking and investments in American innovation.
• Tax: Ensuring the U.S. remains a competitive tax destination to invest in semiconductor research, design, and manufacturing.
• Research: Supporting existing R&D initiatives and growing federal investment in semiconductor research and basic research across the physical sciences to enable U.S. technology leadership and win technologies of the future.
• Workforce and Immigration: Growing the talent pipeline by developing, attracting, and retaining a high-skilled workforce.
• Economic Security – Trade & Supply Chain Resilience: Restoring U.S. trade leadership, building strong global chip supply chains, and facilitating access to new and growing markets.
• National Security – Export Controls & Technology Restrictions: Ensuring policies are carefully calibrated and targeted, effective, and do not undermine the interests they are designed to protect.
• China: Out-competing, out-innovating, and out-flanking to win the future for U.S. semiconductors.
• Environmental & Energy Regulation: Streamlining regulatory and permitting requirements to promote innovation and industry growth, protecting workers and the environment, and supporting American energy strength domestically and around the world.

Semiconductors are the brains of modern electronics, enabling advances in medical devices and health care, communications, computing, defense and aerospace, transportation and infrastructure, energy, and technologies of the future such as artificial intelligence, quantum computing, and advanced wireless networks. A globally competitive U.S. semiconductor industry will allow us to tackle global challenges, boost our economy, enhance national security, and lead the technology race of the 21st century.

SIA stands ready to work with policymakers to adopt a robust policy agenda to advance U.S. semiconductor leadership.

SEOUL, KOREA – PEMTRON, an inspection equipment developer and supplier, is excited to announce its participation in NEPCON Japan 2025, scheduled to take place January 22-24, 2025 at the Tokyo Big Sight in Japan. At this premier industry event, PEMTRON will feature the POSEIDON System, a groundbreaking solution for wafer warpage measurement and FC-BGA bump inspection, in addition to highlighting the SATURN, ATHENA, MERCURY, JUPITER and APOLLON.

The POSEIDON System offers a cutting-edge solution for wafer warpage measurement and FC-BGA bump inspection. Leveraging 3D data, POSEIDON precisely measures warpage, flatness, and coplanarity, while its high-resolution imaging identifies fine defects like missing bumps, bridging, and more. Designed to support advanced processes such as wire bonding and Micro LED applications, POSEIDON delivers swift, accurate mapping and profiling data essential for high- precision manufacturing.

The JUPITER 3D X-ray Inspection System offers both 3D and 2D capabilities through advanced PCT reconstruction-based processing. Equipped with a high-resolution optical camera and integrated with PEMTRON’s proven AOI defect detection algorithms, JUPITER provides manufacturers with an exceptional tool for comprehensive in-line inspection and process quality analysis. Its seamless integration with SPI and AOI systems enables data sharing, delivering valuable insights into the production process and enhancing overall efficiency.

Visitors to PEMTRON’s booth at NEPCON Japan will experience an immersive display featuring wall graphics of its entire product lineup, including:

• SATURN: Renowned for its high-speed 3D solder paste inspection.
• ATHENA: Offering precise 3D automated optical inspection (AOI) solutions.
• MERCURY: Advanced X-ray Automatic Counter.
• APOLLON: Cutting-edge Package Inspection System for comprehensive quality control.

Attendees are invited to visit PEMTRON’s booth at NEPCON Japan to experience firsthand the transformative capabilities of the POSEIDON System and learn more about PEMTRON’s comprehensive portfolio of inspection solutions.

For more information about PEMTRON, please visit www.pemtron.com 

As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.

Indium Corporation will showcase the following among its featured products:

• Award-winning InFORMS® are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
• Indium8.9HF Solder Paste Series, an industry-proven solder paste series, delivers no- clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
• Indalloy®301LT for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
• SiPaste® series is specifically designed for fine-feature printing, with fine powders ranging from Type 5 to Type 8. The series of products helps Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance.
• Heat-Spring®, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes.
• InTACK® is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.

To learn more about Indium Corporation’s power electronics solutions, visit www.indium.com or visit our experts at NEPCON Japan at booth E66-22.