CLINTON, NY – Indium Corporation is set to present and exhibit at EPP InnovationsFORUM, one of Europe’s premier single-day electronics manufacturing forums, on April 17 in Leinfelden-Echterdingen, Germany. Topic areas for 2024 will include AI, automation, sustainability, and quality.

At 10 a.m. local time, Indium Corporation Junior Application Engineer Siegfried Lorenz will present on a new solder paste technology for high-reliability applications. Based on novel solder paste alloy technology, this material offers special wetting behavior that supports low-voiding and enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C). It also reduces solder joint cracking and increases shear strength.

“Perfectly suited for high-reliability applications, this new solder paste technology is the ideal choice for demanding applications that require longer thermal cycles,” said Lorenz. “The EPP InnovationsFORUM is an ideal platform to share this exciting data with my colleagues.”

Lorenz is responsible for providing application engineering support for Indium Corporation’s customers throughout Germany, Austria, and Switzerland. He provides customers with engineering and specifications assistance. He also helps to accelerate the sales cycle by providing technical recommendations. Prior to joining Indium Corporation, Lorenz held positions as a senior mechanic, SMD operator, and head of SMD with major semiconductor manufacturers and electronic design firms. He holds a bachelor’s degree in electrical technology and management.

TÄBY, SWEDEN – Mycronic, the leading Sweden-based electronics assembly solutions provider, will continue to respond to growing customer demand for high-flexibility, high-productivity solutions for zero-defect PCB assembly at IPC APEX EXPO 2024 in Anaheim, CA on April 9 - 11.

MYPro A40DX – The new icon of agility

Mycronic will exhibit its next-generation MYPro A40 pick-and-place solution, equipped with an all-new MX7 high-speed mounthead technology. The new platform increases top placement speeds by 48% while handling a significantly wider range of component types and sizes.

Manufacturers aiming to boost throughput will welcome the MYPro A40DX’s IPC-rated top speed of 59,000 cph (components per hour). The new MX7 mounthead achieves this by integrating seven independent placement nozzles steered by individual Z and theta motors. To accommodate a wider range of applications and technologies, the new mounthead expands the upper component size limit by six times, enabling placement of components as large as 45×45×15 mm or 150×40×15 mm. A high precision mounthead complements the MX7 to mount chip components as small as 0.3×0.15 mm (009005), and components as large as 99×73×15/22 mm.

Outside the machine, a newly designed graphical user interface has been introduced to simplify both training and pick-and-place operations for even novice operators. By providing straightforward touchscreen guidance, the MYPro A40 moves the pick-and-place process another step forward towards the company’s ambition of fully automated one-click operations.

The latest breakthroughs in advanced AOI

The MYPro I series 3D AOI, the company’s latest flagship in-line inspection system, will display its Iris 3D AOI vision technology, which enables manufacturers to improve test coverage while capturing the industry’s highest-resolution images at speeds up to thirty percent faster than previous technologies.

Escape Tracker, a real-time programming assistant embedded in the MYWizard programming software, will demonstrate entirely new levels of reliability and speed in 3D AOI programming. A live demo will show how the software continuously analyzes and updates the system's inspection library to eliminate escapes, dramatically reduce false calls, and constantly improve inspection models over time.

AI in action

A long list of advances in automatic component detection and recognition, automatic component position detection and more accurate 3D review images have been made by Mycronic in recent years. A pioneer in the use of machine learning in SPI and AOI, the company welcomes IPC APEX visitors to discuss the latest advances in neural networks and their applications for AI-assisted improvements in electronics inspection.

Zero-defect and productive printing

New for Mycronic customers, the MYPro S series is a robust, highly accurate and user-friendly range of stencil printers. True to the MYPro production philosophy, it enables the fastest possible changeovers and features all the functionalities expected from a modern screen printer. IPC APEX visitors will experience the advantages of stencil printing, combined with the MY700 Jet Printer and PI series 3D SPI, which together enable add-on printing and closed-loop solder-paste repair functionality. For high-reliability electronics manufacturers looking for the fastest cycle times, this add-on configuration combines the flexibility and accuracy of jet printing with the throughput of stencil printing in a single, integrated and cost-efficient platform. And thanks to the precise information provided by cutting-edge SPI 3D inspection, the Jet Printer seamlessly fills any paste gaps for zero-defect printing.

Enhanced connectivity and process control

New process control solutions to be introduced at IPC APEX include an updated MYCenter Analysis pick-and-place dashboard, now featuring a component analytics function that enables faster drill-down into specific process settings for each component. This allows users to better understand and resolve the root causes of process detractors to dramatically improve first-pass yield. Regarding connectivity, the MYPro Connect software enables vertical communication with MES and ERP systems at line level, using the IPC CFX standard. It completes the horizontal connectivity brought by the Hermes protocol, allowing machine-to-machine communication down the production line.

Tailored solutions for automated electronics protection

Finally, to meet growing demand for high-precision electronics protection, Mycronic will present its suite of MYSmart coating and dispensing solutions. At IPC APEX, visitors will be able to experience versatile conformal coating and dispensing solutions and the latest valve technologies, many of which are now firmly established as the leading choices among global tier-one manufacturers.

Producers of consumer electronics, in particular, will welcome the high-speed jet dispensing valve technologies available for the MY700 Jet Printer and Jet Dispenser, making it the industry’s fastest all-material jetting system. Wherever large-area, random-dot dispensing patterns are crucial to manufacturing quality and efficiency, the new jetting system brings the speed and accuracy of the MY700 into a far wider range of dispensing fluid applications.

“Wherever we can add new levels of flexibility, accuracy, advanced automation and easy usability, Mycronic continues to deliver value to its customers,” says Clemens Jargon, Sr VP High Flex Division. “At IPC APEX EXPO, we are thrilled to continue to lead the way by providing the most advanced turnkey solutions for every stage of PCB assembly.”

To experience live demos and to learn more about Mycronic’s MYPro Line, software and connectivity solutions, and MYSmart dispensing and coating platforms, visit booth #742 at IPC APEX EXPO in Anaheim, CA on April 9 - 11.

SUWANEE, GA – With its innovative, data-driven Intelligent Factory concept and a comprehensive hardware and software portfolio around SMT production, market and innovation leader ASMPT will be a major presence at the IPC APEX EXPO 2024, the industry’s main event in California.

At its Booth 1436 in the Anaheim Convention Center, global player ASMPT will once again demonstrate that it covers almost the entire SMT production chain with its products and services and functions as a trendsetter for the industry. At this year’s IPC APEX EXPO, ASMPT will present its holistic hardware and software innovations for electronics manufacturers that range from the machine and line level to the factory and enterprise levels. Of particular importance will be the company’s Intelligent Factory concept with its holistic approach to integrative data analysis and usage that covers the entire factory and reaches across production locations. It optimizes processes, minimizes errors, improves material flows and deploys employees based on their qualifications in a highly effective manner – all while never losing sight of maximizing the return on investment.

Greater yields with existing production equipment

“Thanks to interfaces such as IPC-2591 CFX, you can now combine data from ASMPT machines and third-party systems and use it for in-depth analyses and improvements,” explains Mark Ogden, Marketing Manager Americas at ASMPT. “If you consistently implement the Intelligent Factory principle, you will quickly realize that you can get more out of your existing production equipment with this holistic, data-driven strategy: more productivity, more quality and greater yields. Interested visitors can find out from the experts at our booth what this looks like in practice.”

A complete production line

ASMPT will present a complete SMT production line at the IPC APEX EXPO 2024. It starts with a DEK TQ solder paste printer, whose output will be checked and automatically improved, if necessary, by a Process Lens SPI system. They will be followed by the highly flexible SIPLACE SX and the high-speed SIPLACE TX placement platforms. The machines will be complemented by a new, automated paste transfer system and equally new quick-change squeegees for solder paste printing, the high-precision TWIN pick-and-place head for the end-of-line placement of large, heavy components and special designs, as well as measuring devices for placement forces and electrical properties that can be easily added thanks to their standard feeder formats.

Software that adds real value

In the software area, ASMPT’s WORKS Software Suite plays an important role for all workflows on the SMT shop floor with applications such as WORKS Logistics for material flow optimization, WORKS Operations for effective personnel deployment across multiple lines, WORKS Monitoring for keeping track of important production parameters, and WORKS Optimization for quality optimization along the entire SMT line, which integrates SPI and AOI systems regardless of manufacturer. Other interesting components in ASMPT’s software portfolio include SMT Analytics for process analysis and optimization, Factory Equipment Center for production-wide asset and maintenance management, and the AI and NLP-based Virtual Assist, the personal assistant that engineers and technicians can access via their smartphones.

Visitors will also be able to learn about the training offerings of the ASMPT Academy as well as the modern MES from ASMPT’s software subsidiary Critical Manufacturing that was designed especially for the needs of the electronics manufacturing industry. “A visit to the ASMPT booth is always worthwhile,” says Ogden. “Here, visitors can experience live and in person how ASMPT hardware and software work together, how the Intelligent Factory combines standalone operations into an integrative whole, how SMT manufacturers can meet the ever-growing requirements of the global market, and how they can implement the Intelligent Factory step-by-step in their companies.”

CLINTON, NY – Indium Corporation®, in cooperation with its industry partners, will feature its proven solder solutions live on the show floor throughout IPC APEX Expo from Apr. 9‒11 in Anaheim, Calif., U.S.

Live@APEX is a unique collaboration between Indium Corporation and its industry partners. The program benefits all participants, including Indium Corporation, partners, and, most importantly, the customers, who get to experience the equipment and materials in a live-action environment.

“By demonstrating Indium Corporation products on live equipment at IPC APEX, attendees get an accurate and honest depiction of the material’s performance,” said Product Development Specialist Miloš Lazić. “The program is a great embodiment of Indium Corporation’s motto, ‘From One Engineer to Another®’, and we are tremendously proud of it.”

This year’s program will highlight Indium Corporation materials, including:

• CW-807 – electronics soldering cored wire
• CW-818 – no-clean, high-reliability flux-cored wire
• FP-500 – no-clean flux pen
• Indium8.9HF – no-clean solder paste formulated for the higher processing temperatures of the electronics industry
• Indium9.88HF – no-clean solder paste for use in package-on-package (PoP) applications
• Indium12.8HF – jetting and microdispensing solder paste
• PicoShot® – jetting paste series with exceptional jetting performance
• Sn995 – low-maintenance, low-cost, Pb-free soldering alloy
• TACFlux® 089HF – no-clean flux formulated for SnAgCu and SnAg solders (also compatible with Sn/Pb solder)

You can see these products at the following partner booths:

• AIR-VAC Engineering (booth #2120)
• Apollo Seiko (booth #1408)
• Essemtec (booth #2409)
• Finetech (booth #4209)
• GPD Global (booth #1504)
• Hakko USA (booth #2600)
• ITW EAE (booth #2327)
• JBC Tools (booth #3642)
• Juki Automation Systems (booth #714)
• Koh Young Technology (booth #2112)
• KYZEN (booth #4237)
• MicroCare (booth #1812)
• Mycronic (booth #742)
• Nano Dimension (booth #2409)
• NSW Automation (booth #3523)
• Panasonic Connect (booth #2332)
• PARMI USA (booth #4036)
• Pillarhouse USA (booth #733)
• PVA (booth #2042)
• Smart Sonic (booth #3906)
• Thermaltronics USA (booth #1003)
• Trans-Tec America (booth #2825)
• Universal Instruments Corporation (booth #2405)
• VERMES Microdispensing - (booth #2814)
• Yamaha Motor Corporation (booth #2820)
• ZESTRON Corporation (booth #3620)

If you see an Indium Corporation product running in a booth, be sure to use the hashtag #LiveatAPEX.

To learn more about the Live@APEX program, contact Lazić at mlazic@indium.com