SHINGLE SPRINGS, CA – PDR Americas is set to showcase its latest innovations at the 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024, at the Anaheim Convention Center in California. Visit PDR at Booth 3829 to experience firsthand the IR-E3 System for rework and the GenX90 w/ Vector Nav 3D CT Tomography for X-ray.

The PDR IR-E3 is an advanced rework station designed to cater to BGA/SMT components with precision and efficiency. This cutting-edge system boasts key features such as advanced focused IR component heating, quartz IR PCB preheating with up to 3 zones, and a Split Beam prism system enabling simultaneous PCB/component viewing.

The station ensures precision in component placement up to 10um, precise PCB handling, and includes a Component Nest/Flux Application Facility. With closed- loop non-contact temperature sensing, advanced automatic thermal process control, a reflow process observation camera, and PCB forced air cooling, the IR-E3 streamlines the rework process, setting a new standard for accuracy and control across a diverse range of components.

Additionally, PDR will showcase the GenX-90P, an ultra-high- performance X-ray system designed for precision inspection.

Key features include:

• Compact system, accommodating PCB sizes up to 21” (533mm) X 17.5” (445mm)
• Customizable Flat Panel Detectors or Image Intensifier options
• 90kV, 8 Watt, 4um X-Ray tube, 0.18mA with Magnification up to 1100X

Primarily designed for BGA inspection and analysis, counterfeit inspection, porosity/voiding detection, medical device inspection, wire bond inspection, and LED inspection, this system ensures precise and reliable results. With radiation levels less than 1 uSv/hr (0.1 mR/hr) and compliance with USFDA 21 CFR-1, J-1000, 1020.40 standards, it prioritizes safety in all operations. The GenX-90P is equipped with programmable 4-axis (X, Y, Z1/Z2) fully motorized motion control, facilitating comprehensive inspection capabilities. Its BGA/QFN/Flip Chip software includes Pass/Fail criteria, Sphere Size, Void analysis, and a 3D Gray Scale Option.

Visit PDR at Booth 3829 during the IPC APEX EXPO to explore these groundbreaking solutions and learn more about how PDR is shaping the future of electronic rework and inspection.

For more information about PDR Rework and its innovative solutions, please visit www.pdr-rework.com  

CLINTON, NY – Indium Corporation’s leading technical experts are set to deliver and participate in a number of presentations and panel discussions throughout IPC APEX Expo, April 9-11, in Anaheim, Calif., U.S. Topics will include sustainability, assembly processes, and EV electronics.

Tuesday, Apr. 9

• Innovative Low-Temperature Solder Alloy & Optimized Convection Reflow Oven Combination to Achieve up to 25% Energy Savings presented by Regional Technical Manager and Technologist – Advanced Applications Andreas Karch, in partnership with Daniel Hamann, SMT Thermal Discoveries

Wednesday, Apr. 10

• Advancements in Solder Paste Printing: Cleaning Compatibility Assessment of Jettable and Screen-Printable Pastes for Complex Electronics Assemblies presented by Product Specialist Evan Griffith, in partnership with Kalyan Nukala, Zestron Americas
• Liquid Metal Paste High-Speed Dispensing for High-Volume Manufacturing presented by Product Development Specialist for Thermal Interface Materials Miloš Lazić, in partnership with Sunny Agarwal, ITWEAE
• The Attempt of Lower Temperature Soldering Process for Large Plastic Ball Grid Array Board-Level Assembly presented by R&D Manager, Alloy Group, Principal Metallurgist Dr. HongWen Zhang
• Optimization of Photonic Soldering Processes for SIR Performance co-authored by Technical Support Engineer Thuy Nguyen, presented by Ara Parsekian, PulseForge, Inc.
• Liquid Metal Patterning for Electronic Circuits and Thermal Management co-authored by Miloš Lazić, Associate Director ESM Product Management Jon Major, and Material Research Scientist Dr. Ricky McDonough; presented by Michael Dickey, North Carolina State University

Thursday, Apr. 11

• Panel Discussion: PCBA Reliability and Test for EV Applications featuring Principal Engineer, Global Accounts Technical Manager, Dave Sbiroli

Click here for an interactive schedule of all presentations taking place at IPC APEX 2024 and be sure to visit with Indium Corporation’s experts at booth 4227.

Andreas has more than 20 years of experience in automotive electronics and power electronics, including the development of advanced customized solutions. In 2014, the Austrian Patent Office awarded him the “Inventum” award for his patent for innovative LED automotive lighting as one of the top ten applicants. He is an ECQA-certified development engineer and has earned the Six Sigma Yellow Belt.

Griffith is a Product Specialist for Indium Corporation’s Semiconductor and Advanced Assembly Materials product line, which includes Indium Corporation’s fine-powder solder pastes (SiPastes) and semiconductor assembly fluxes. He is responsible for researching and analyzing customer and market data and facilitating current and prospective customers’ needs. Additionally, he supports customers’ inquiries, internal product trainings, and works closely with Indium Corporation’s R&D team on new applications. He earned a Master of Engineering Management, Bachelor of Engineering in Materials Science and Engineering, and a Bachelor of Arts in Engineering Sciences and French, graduating with honors, all from the Thayer School of Engineering at Dartmouth College. He has also earned his Lean Six Sigma Green Belt from Dartmouth College and has received certifications in Product Management from Columbia University and Product Marketing from Cornell University.

Lazić is responsible for developing new thermal materials and products, and providing solutions for customer challenges and applications. He also develops new testing methods to evaluate power and thermal products, and gathers data on new and existing products for marketing presentations. He earned his master’s degree in electronics engineering and his bachelor’s degree in electrical engineering from the University of Nis in Serbia. He is an Energy Efficiency Engineer certified by the Serbian Chamber of Engineers in Belgrade; a Certified SMT Process Engineer; and is fluent in English, Serbian, Croatian, and Bosnian.

As manager of the alloy group in Indium Corporation’s R&D department, Dr. Zhang’s focus is on the development of the varieties of Pb-free solder materials and the associated technologies for low-temperature, high-temperature, and/or high-reliability applications. He was instrumental in inventing the Durafuse® technology to combine the merits of constituents to improve wetting, reduce processing temperatures, modify the bonding surface, and control the joint’s morphology, thus improving reliability. As principal metallurgist, he is also responsible for expanding metallurgical innovation. He and his team are responsible for using metallurgical insight to develop new products, implement improvements to existing processes and products, and measure results. Dr. Zhang has a bachelor’s degree in metallurgical physical chemistry, a master’s degree in mechanical engineering, and a Ph.D. in materials science and engineering. He has a Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College, and is a certified IPC Specialist for IPC-A-600 and IPC-A-610, as well as a certified SMT Process Engineer. Dr. Zhang has published two book chapters and more than 50 conference and journal papers, and he has been granted more than ten patents in the U.S. and globally. Dr. Zhang was awarded the Surface Mount Technology Association’s (SMTA) Technical Distinction Award in 2023.

Nguyen joined Indium Corporation in 2015 and has held roles in Quality, R&D, and Manufacturing during her time with the company. She has contributed to multiple large-scale projects and assisted in the implementation of new processes and training materials. She holds a bachelor’s degree in chemistry from Utica College and is a Certified SMT Process Engineer (CSMTPE).

As Principal Engineer, Sbiroli utilizes his experience to characterize soldering materials’ critical performance attributes and assist in the development of new materials and accelerated test methods to augment their critical performance. As the Technical Manager of Global Accounts, he is also responsible for the coordination, business maintenance, and resource deployment of technical services and onsite support to Indium Corporation’s global customer base with a focus on key automotive customers. Sbiroli has more than 25 years of hands-on experience in the selection and applications of printed circuit board assembly materials and SMT process optimization, defect reduction, and troubleshooting on hundreds of Indium Corporation customers’ SMT and electronic assembly production lines. He has a bachelor’s degree in Mechanical Engineering Technology from the State University of New York Institute of Technology. He achieved one of the highest scores on the SMTA Process Engineer certification exam and is certified as an IPC Specialist for IPC-A-600 and IPC-A-610D. He actively participates in the development of industry standards with the IPC and received the IPC’s Distinguished Committee Service award for his work on the J-STD-004B (Requirements for Soldering Fluxes) standards.

SAN JOSE, CA ― SHENMAO Technology will exhibit its cutting-edge solutions for automotive electronics at Booth 2639 during the upcoming IPC APEX EXPO 2024. Taking place April 9-11, 2024 at the Anaheim Convention Center in California, the expo will provide an opportunity for industry professionals to explore SHENMAO's latest advancements in solder paste technology.

In response to the escalating demands for heightened product reliability and safety in automotive electronic components, SHENMAO proudly presents comprehensive solutions tailored to meet the specific needs of the automotive electronics industry.

SHENMAO will introduce the PF918-P250A Thermal Fatigue Resistance No-Clean Lead-free Solder Paste, meticulously formulated with the groundbreaking SHENMAO Sn/4Ag/3Bi Alloy. This innovative alloy is engineered for high thermal impact reliability, ensuring the longevity of electronic products with stringent reliability requirements. Notably, it excels in voiding performance and printability, mirroring the melting point of SAC305 for seamless integration into existing SAC305 reflow profiles. With its cutting-edge flux design, voiding is effortlessly controlled to less than 10 percent.

Furthermore, extensive Board level thermal cycling tests, utilizing an actual automotive IC product, reveal that the thermal cycling life of PF918 surpasses that of the SAC305 alloy, doubling its longevity. PF918-P250A enhances thermal reliability performance by a minimum of 30 percent, demonstrating superior mechanical shock resistance compared to typical solder alloys like SAC305 and SAC405. This solder paste is ideal for various applications, including consumer electronics, high-power components, servers, and automotive electronics.

Supplementing this advanced offering is the PF606-P250 No-Clean Lead-free Solder Paste, featuring the widely used Sn/3Ag/0.5Cu Alloy. PF606-P250 stands out with its impressive solderability, printability, and voiding performances, while remaining compliant with RoHS, RoHS 2.0, and REACH standards.

For those prioritizing water-soluble options, the PF918-PW216 Thermal Fatigue Resistance Water-Soluble Lead-free Solder Paste is specially designed for water cleanability. Formulated with the newly designed high-reliability lead-free alloy (Sn/4Ag/3Bi), it achieves tensile strength performance 1.4 times higher than typical SAC305 alloys. Its innovative flux design ensures outstanding voiding performance, allowing it to seamlessly follow the regular SAC305 reflow profile. This solder paste caters to the needs of consumer electronics, servers, automotive electronics, and electronic products with extended service life and high reliability requirements. Also available is the PF606-PW216 Water-Soluble Lead-free Solder Paste, which adheres to the commonly used Sn/3Ag/0.5Cu Alloy, offering excellent cleanability, solderability, printability, and voiding performance.

In order to enhance the solder joint protection, SHENMAO has launched two specialized products with built-in epoxy. The Joint Enhanced Solder Paste (JEP) PF606-EP305 seamlessly combines the advantages of conventional solder paste and anisotropic conductive paste, delivering self-alignment and planar insulation. JEP facilitates soldering and joint encapsulation in one-step reflow, featuring a new epoxy-based solder material designed for very fine pad size (70 μm) soldering. It is compatible with various surface finishes, leaving a transparent residue, and requires no cleaning. SHENMAO’s JEP is eco-friendly, boasting both lead-free and halogen-free attributes, meeting J-STD and IEC standards.

Finally, the SMEF-Z52 Active Epoxy Flux is designed for SMT assembly (SAC paste) and BGA ball mount (SAC ball) processes. The activator eliminates solder balls, ensuring smooth solder joints. Post-reflow, the epoxy flux residue cures to provide mechanical support to the joint. Epoxy clad in solder joints after curing shields and strengthens joints by 30 percent compared to conventional rosin flux. This newly designed flux requires no cleaning and exhibits exceptional compatibility with molded underfill (MUF) and capillary underfill (CUF). SMEF-Z52 is well-suited for various IC packages, including system-in-package (SIP), wafer-level-package (WLP), and flip-chip technologies.

SHENMAO’s advanced pastes and fluxes are compliant with RoHS, RoHS 2.0, and REACH standards.

Visit SHENMAO at the 2024 IPC APEX EXPO to experience firsthand the innovative solder technology driving the future of automotive electronics manufacturing.

For more information, please visit www.shenmao.com 

CHICAGO – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will be exhibiting at IPC APEX Expo 2024 in Anaheim, CA USA from April 9-11. On booth #1642, Saki will be showcasing its unique range of automated inspection solutions including AOI and the award-winning X-ray Automated Inspection System (AXI).

Increasing demand for Saki's advanced total solutions for in-line automated inspection for SMT processes in the US-market have further strengthened Saki’s strategic focus and commitment to the Americas region. Significant expansion of the sales representatives’ network and technical sales support infrastructures will be introduced at the electronics manufacturing industry’s largest North American trade show. Furthermore, visitors to booth #1642 will discover the high-speed, high-precision automated inspection capability of Saki's latest hardware and software.

The Saki technology team will present the company’s latest equipment lineup for high-speed, high-precision AOI and AXI in-line inspection:

AXI
3Xi-M110 - the industry's fastest automated X-ray inspection solution and winner of a Global Technology Award 2023.

AOI
3Di-LS3 - advanced AOI with powerful dome lighting feature and on-site camera module upgrade capability.

SPI / AOI
3Di-ZS2 - perfect for AOI inspection of extra-large PCBs featuring Saki’s rigid gantry and innovative Z-axis optical head control for improved accuracy. Saki's 3D-SPI and AOI systems share a single hardware and software architecture, allowing for complete compatibility. Interactive 3Di-ZS2 demonstrations at the booth with demonstrate the power of a streamlined operation.

In addition to its machine solutions, Saki will also present its versatile software suite which works with the equipment to form a total solution for quality inspection:

• QD Analyzer, Saki’s powerful SPC system, a BF2-Monitor for offline reviews and a Multi Process View (MPV) demo station will present Saki’s software strength that greatly improves process troubleshooting and determines root causes. These innovations will help clients increase automation to solve labor & resourcing issues, tackle skills shortages, improve productivity and achieve greater manufacturing quality and efficiency.
• One Programming function (reference exhibit) – Software system for batch operation and centralized management of SPI, AOI, and AXI on a line-by-line basis.
• AI Solutions (reference exhibit) – an introduction to Saki’s unique integration of AI functionality.

“The Americas’ manufacturing industry is of prime importance to Saki. We are expanding our specialist and dedicated team focused on delivering our world-class inspection solutions with world-class expertise and support,” said Craig Brown, General Manager, North America of Saki America. “We look forward to welcoming visitors to our booth in Anaheim to discuss all the latest developments in our equipment and software range.”

For more information about Saki visit www.sakicorp.com/en/