GAINESVILLE, GA ― Count On Tools, Inc. (COT), a leading provider of precision components and SMT spare parts, will exhibit in Booth #1332 at the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in Calif. The COT team will focus on its core product lines at the show:

• Standard Nozzles: COT’s catalog of products includes standard nozzles and tooling replacement parts for the top OEMs, including Fuji, Panasonic, Mycronic, Yamaha, Hanwha/Samsung, Juki, Hitachi, and more. The team at COT understands that customers often have more than just one OEM’s range of machines. Therefore, the company tries to offer as wide a range of SMT nozzles and consumables as possible so that you can keep your supplier bases to a minimum. Recent price restructuring also means more cost savings for customers. COT plans to showcase new SMT nozzle lines for the Yamaha YS and YRM machines with the HM / FM heads. Additionally, nozzles for Hanwha/Samsung HM and Decan series machines as well as the new Juki RS1 machines will be available.
• Custom Nozzles: COT has the experience and manufacturing flexibility to develop custom engineered solutions to satisfy your individual process requirements. With more than 31 years of experience on multiple machine platforms, COT’s team has the professional expertise to solve your pick-and-place issues! This includes special nozzles for LEDs, connectors, switches, push buttons, pins, clips, heavy, over-sized, and more. There is no limit to COT’s capabilities when it comes to automating your custom component processes.
• Component Handling Products: COT offers several styles of component handling trays based on industry proven specifications and the unique requirements of each product. These include the Stripfeeder Platform and the QWIKTRAY systems. Application requirements such as temperature and chemical exposure, manufacturing processes, mechanical and electrical constraints are factors that are combined with operation considerations including production volumes, build costs, total estimated usage and process control. From off -the-shelf kits to custom built tray products, rest assured that COT has the right fit for your next job.
• Automation Tooling Products: As a design and manufacturing company, COT specializes in developing solutions. The focus of the company’s development projects has been on improving the methods of assembly of printed circuit boards. Every aspect of this process can benefit from automation tooling. Customers come to COT with problems that they experience, such as having to hand place odd-form components, repairing worn/damaged feeders, or developing universal board supports, like the ezLOAD series. COT’s team sees every opportunity as a challenge to prove that they are capable of producing solutions at every level of the SMT assembly process, especially nozzles and tooling. The company will showcase its PCB custom Carrier system for AOI, Electrical Test, Cleaning, and other PCB assembly processing. The technology that COT has developed over the years has allowed the company to design and manufacture custom engineered tooling for any process in the SMT industry.
• Selective Soldering Nozzles: As selective soldering continues to become more popular in the electronics manufacturing industry, Count On Tools has realized the need for higher quality selective solder nozzles that can consistently apply flux and solder to component leads without disturbing nearby SMT components. Count On Tools custom selective solder nozzles assist to replace labor-intensive hand soldering while eliminating defects caused by wave soldering machines in the market’s most popular selective soldering equipment. Additionally, Count On Tools offers custom selective solder nozzles based on specific application requirements. This includes special wave form sizes and extended or shortened lengths. COT offers ACE, ESRA, Pillarhouse, and RPS selective solder nozzles.

Count On Tools holds and maintains current ITAR registration, 07FFL, 02SOT, and a first-class Quality Management System. For more information about Count On Tools’ products and services, visit www.cotinc.com 

NORTHBROOK, IL – Impossible Objects proudly announces plans to exhibit at Apex 2024, scheduled to take place April, 9-11, 2024 at Anaheim Convention Center. The focus of this exhibition is the game-changing CBAM-25 industrial 3D printer, a true paradigm shift in high-speed, high-performance additive manufacturing.

CBAM 25: Step into the in the Future of 3D Printing Impossible Objects’ CBAM-25 3D printer marks a monumental leap forward in additive manufacturing capabilities. Setting new industry standards, this cutting-edge machine stands out as a true game-changer for electronics tooling (and more), boasting a remarkable fifteen-fold increase in speed compared to the fastest competition.

With the CBAM-25, a new era dawns for electronics tooling, one characterized by unprecedented speed and efficiency, in addition to all of the benefits of 3D printing that shatters traditional limitations. The first CBAM-25 will ship in Q2 2024, heralding a seismic shift in manufacturing processes. This groundbreaking innovation brings 3D printing to the forefront of volume tooling manufacturing, tearing down barriers and expanding the horizons of what can be achieved with advanced materials, exceptional mechanical properties, and superior tolerances.

Design and Manufacturing Renaissance

The CBAM-25 opens doors for engineers to design parts that are not only stronger but also lighter and more durable. Its high-performance composite materials, notably Carbon Fiber/PEEK, offer remarkable chemical and temperature resistance, along with mechanical properties that surpass those of many engineering plastics.

Carbon Fiber/PEEK components have proven to be an exceptional alternative for electronics tooling, as well as a wide range of additional applications, including, aerospace, defense, transportation industries, and beyond. “Our innovative 3D printer represents a quantum leap in additive manufacturing technology, enabling engineers and manufacturers to achieve feats previously considered impossible,” says Robert Swartz, Founder and Chairman of the Board at Impossible Objects.

“We are also committed to serving the global electronics manufacturing community as a premier tooling supplier, providing cutting-edge solutions for their evolving needs.”

Experience the future of 3D printing and discover how Impossible Objects redefines the boundaries of design and manufacturing.

Visit Impossible Objects at APEX 2024, booth #2715 or fill out a contact us form to get in touch with us directly and schedule a dedicated time slot to discuss your specific tooling needs.

ISLE OF WIGHT, UK – EVS International, the leader in solder recovery, today announced plans to exhibit in Booth 730 at the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. The company is set to showcase its EVS 18KLFHS Solder Recovery Systems, a revolutionary innovation that is transforming the solder recycling process.

The key to the EVS 18KLFHS's exceptional performance is its innovative design, featuring a sealed cabinet that cleverly integrates the dross bucket and fume extraction. This groundbreaking concept ensures both security and efficiency in the solder recovery process.

At its core, the system features the Tilting Pot Mechanism, an industry-first innovation that eliminates the need for traditional twin opposed air rams and doors, resulting in a substantial boost in efficiency and productivity.

What truly sets the EVS 18KLFHS apart is its ability to invert and rotate the dross/solder pot, combined with an ingenious hot air-activated auto drain tap. This remarkable combination results in the creation of clean ingot bars, enabling the recovery of up to 80 percent of solder from the dross. This remarkable efficiency is made possible through EVS's patented technology.

With an expanded 18-kilo/40lbs pot, the system empowers users to recover more dross, promising a faster return on investment (ROI). It simplifies components, extends running times, and boasts an extraordinary availability rate of 90% and above, reinforcing its reputation for unmatched reliability in the industry.

Additionally, the EVS 18KLFHS Solder Recovery System is now available in a lead-free version, providing a compelling price-performance ratio. This inclusive offering opens doors for businesses of all sizes, from small job shops to those using both lead and lead-free units, to invest in this game- changing technology. With the promise of delivering pure solder and a swift ROI within months, the system propels production efficiency and sustainability to new heights.

Visit the EVS booth at the 2024 IPC APEX EXPO, where the 18KLFHS Solder Recovery System will be on display, showcasing the most advanced solder recovery solution in the industry.

For more information about EVS International’s industry-leading systems, visit www.solderrecovery.com

OSAKA, JAPAN – Nihon Superior Co. Ltd., an advanced joining material supplier, will exhibit in Booth 1325 during the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Renowned for its commitment to innovation, Nihon Superior will present a range of groundbreaking products, including the SN100CV® P608 solder paste and the TempSave™ series of low-temperature soldering materials.

SN100CV® P608 sets a new standard as a completely halogen-free, lead-free, and no- clean solder paste by Nihon Superior. In contrast to silver-containing alloys relying on a dispersion of fine particles of eutectic Ag3Sn for strength, SN100CV achieves its robustness from solute atoms within the tin matrix of the joint. Remarkably, in tensile tests, SN100CV matches the strength of SAC305 while retaining a high resistance to impact loading, offering exceptional performance in various applications.

For high-reliability applications demanding strength surpassing SAC305, Nihon Superior introduces the LF-C2 lead-free alloy. Leveraging both dispersion and solid solution strengthening, LF-C2 delivers superior strength. With a liquidus temperature of 213°C, it facilitates reflow at a lower temperature than SAC305.

The P608 flux medium ensures wetting comparable to halogen-containing pastes, despite being completely halogen-free. SN100CV P608 and LF-C2 exhibit outstanding performance across diverse component types and process parameters.

Additionally, Nihon Superior presents the TempSave™ series of low-temperature soldering materials, addressing industry goals such as reducing peak reflow temperature, minimizing package warpage, lowering energy consumption during reflow, and protecting temperature- sensitive devices.

• TempSave B58: A eutectic SnBi alloy with a low melting point of 139°C.
• TempSave B37: A ductile hypoeutectic SnBi alloy without Ag, offering exceptional drop performance, surpassing SAC305. The P610 flux medium, specifically designed for Bi alloys, ensures halogen-free compatibility. The TempSave B37 P610 solder paste can be reflowed with a peak temperature of 190°C. Additionally, a high-speed jetting paste version, TempSave B37 P611, provides consistent dot sizes.

Visit Booth 1325 at the 2024 IPC APEX EXPO to explore Nihon Superior's latest alloys, solder pastes, and lead-free products. For more information, please visit www.nihonsuperior.co.jp/english