BARCELONA – Bentec is pleased to announce that Estanflux, a trusted team of industry professionals with a strong commitment to client relationships since 1983, is the exclusive representative of Prey By Detech, covering the regions of Spain and Portugal. With a philosophy deeply rooted in people and trusting relationships, Estanflux is poised to bring Prey’s cutting-edge automated inspection technology to clients, elevating the standard of final inspection processes in the region.

Founded in 1983, Estanflux has built a solid foundation based on a philosophy that prioritizes people and the trusting relationships established with clients. The company’s dedication to earning trust project by project, day by day, and call by call reflects in the strong partnerships and satisfied clients they have nurtured over the years.

Prey’s Universal Product Inspector (UPI) represents a breakthrough in automated inspection technology, providing a universal and efficient solution for inspecting a comprehensive range of products. With Estanflux’s representation, clients in Spain and Portugal will have access to this innovative technology, ensuring repeatability and accuracy in their final inspection processes.

Key Features of Prey’s UPI:

1. Dual Camera Capture System: Simultaneously captures both top and bottom sides of any object for instantaneous inspection.
2. Prey Inspector Software: Intuitive software designed for ease of navigation, facilitating a user-friendly experience for operators and programmers.
3. Universal Carrier Mounting and Design: Customizable base tray allows clients to create their own carriers, ensuring the UPI's universal applicability.

“We are excited about our partnership with Prey By Detech and the opportunity to bring their Universal Product Inspector to our clients in Spain and Portugal," commented Estanflux CEO Roger Mas. “Our commitment to trusting relationships aligns perfectly with Prey’s mission to transform automated inspection processes. Together, we aim to provide our clients with innovative solutions that enhance their manufacturing efficiency and product quality.”

To find out more about Estanflux, visit the company at www.estanflux.com. For further information about Prey UPI, visit www.bentec-int.com/prey-upi/ or contact the company at Detech Europe Limited, The Farm Office, Model Farm, Atwick Road, Bewholme, East Riding of Yorkshire, YO25 8DT, United Kingdom; +44 (0)1262 409944; E-mail: sales@detech-europe.com 

LYON, FRANCE – Yole Group is part of Chiplet Summit 2024. The Summit occurs on February 6-8 at the Santa Clara Convention Center.

The Chiplet Summit program is now available HERE.

Chiplets improve chip yields and costs but still provide the performance of a large monolithic chip. Designers can mix and match chiplets, use the process technologies best suited to specific functions, take advantage of chiplet IP, and simplify moves to new process nodes, avoiding wafer waste and manufacturing defects. Chiplets are the key to producing the extremely high-density, high-performance chips required for today’s networking, storage, AI/ML, analytics, media processing, HPC, and virtual reality applications.

Chiplet Summit covers the latest architectures, development platforms, and applications. It includes pre-conference seminars, keynotes, annual updates, and paper and panel sessions. It covers all aspects of chiplet development, including design, interconnect, packaging, integration, and testing.

At Chiplet Summit 2024, Principal Analyst, Computing Tom Hackenberg and Technology & Cost Analyst, Computing Ying-Wu Liu from Yole Group present a “Market Research Update” in the leadoff plenary on “Chiplet Markets Are Rising: Where and When?”

In addition, Tom Hackenberg heads an expert panel on market research in the closing session which will discuss market trends in “Chiplets in 2028 and How We Got There” and provide a keynote for the Open Compute Platform Track. This panel discussion will be moderated by Bill Wong, Technology Editor for Electronic Design. In addition to Tom, panelists include John Shalf from Lawrence Berkeley Laboratory, Bapi Vinnakota from the Open Compute Project, and Jawad Nasrullah from Palo Alto Electron. More info.

Be sure to meet Yole Group’s computing analysts at Chiplet Summit 2024; book a meeting with them now: HERE.

CLINTON, NY – Indium Corporation Regional Technical Manager and Technologist – Advanced Applications Andreas Karch will present at iNEMI’s upcoming seminar, Humidity Robustness and Isolation Coordination for e-Mobility. The seminar, hosted by ZESTRON Europe, will be held on February 1 in Ingolstadt, Germany.

Andreas’ presentation, No-Clean Flux Residues in Automotive Applications Must Meet Higher Requirements, will examine the influence of no-clean flux chemistries on the reliability of automotive PCB applications. In particular, the study focuses on failure caused by dendritic growth for high-power, low-standoff components for enhanced SIR conditions.

Due to increased automotive electrification (48V, HEV, EV) and the subsequent utilization of high-power components such as DPAKs and Power-QFNs in under-the-hood electronics, the SIR (Surface Insulation Resistance) specifications for evaluating the electrical reliability of no-clean solder paste flux chemistry have also become more stringent. For example, test voltage has increased from 5V to 10–50V, test time has increased from 168 to 500–1,000 hours, pitch has decreased from 0.5mm to 0.2–0.3mm, and minimum SIR threshold has increased from 100MΩ to 500MΩ.

No-clean solder pastes are normally used in automotive PCB assembly to solder low-standoff components such as DPAKs and power-QFNs (gap between the PCB pad and the component underbody is typically under 75µ).

“During reflow, volatiles in the flux chemistry, such as activators and solvents boil off; however, a lower standoff reduces the opportunity for the flux volatiles to vent, resulting in ‘wet’ flux residue post-reflow,” said Andreas. “It is, therefore, critical that the no-clean flux residue does not cause ionic dendritic growth and corrosion under low-standoff power components, throughout the working life of the product.”

Andreas serves as Technologist – Advanced Applications and Technical Manager for Germany, Austria, and Switzerland for Indium Corporation. He has more than 20 years of experience in automotive electronics and power electronics, including the development of advanced customized solutions. In 2014, the Austrian Patent Office awarded him the “Inventum” award for his patent for innovate LED automotive lighting as one of the top ten applicants. He is an ECQA-certified development engineer and has earned the Six Sigma Yellow Belt.

TAIPEI – Test Research, Inc. (TRI) will feature Innovative Inspection Solutions, SPI, AOI, AXI, and ICT solutions at a series of technology seminars and product demos held in Taiwan, Shenzhen, and Suzhou. Each of the one-day events will focus on the latest test and inspection technology innovations for SMT and Advanced Packaging production, including the Smart Factory and AI-powered Solutions.

TRI's 2024 portfolio will showcase High-Speed Line inspection platforms, such as the TR7700QH SII, capable of inspecting at speeds of 80cm²/s. During the seminars, there will be a demonstration of TRI's High-Accuracy and High-Resolution line for Advanced Packaging Inspection. The lineup will also feature X-ray Inspection demonstrations, such as the 3D CT AXI TR7600F3D LL SII with an improved platform for High-Speed Inspection.

Additionally, TRI will showcase Board Testing platforms, such as the TR5001 SII series with LED Analyzer for Automotive applications and the High-Pin Count Tester TR8100HL SII for High-throughput production lines. Lastly, there will be a live demo of TRI's AI-powered Solutions and the improved Yield Management System 4.0 (YMS 4.0).

To register for any of the seminars, please contact your TRI sales representative.