HANAU, GERMANY – Heraeus Electronics is excited to announce its participation in the upcoming 2024 IPC APEX EXPO. The event is scheduled to take place from April 9-11, 2024 at the Anaheim Convention Center in California. Heraeus Electronics will be exhibiting in Booth 3912, showcasing its cutting-edge products, including the award-winning Microbond® SMT660 Innolot® 2.0 solder paste.

Microbond® SMT660 Innolot® 2.0 - A Game-Changing Solution

Since its introduction, Heraeus Electronics' Microbond® SMT660 Series has received prestigious awards such as the Mexico Technology and Global Technology Awards. The solder paste is revolutionizing the automotive industry's approach to highly reliable and cost-effective solder alloys. The Microbond® SMT660 flux, in combination with different alloys, delivers exceptional performance and reliability.

The SMT660 Series offers exceptional reflow performance, standing out for its excellence in the reflow process without the need for additional nitrogen (N2). This feature minimizes defect rates and contributes to a reduced Total Cost of Ownership (TCO) for manufacturers. Heraeus Electronics' innovation aligns with the industry's need for reliability and cost-efficiency, making the Microbond® SMT660 an indispensable asset for the automotive sector.

Microbond® SMT650 High-Reliability Solder Paste

Additionally, Heraeus Electronics will highlight its full sinter paste and solder paste portfolio of products, including the Microbond® SMT650. The high-reliability solder paste achieves consistently high surface insulation resistance to prevent electrochemical migration. The combination of the new F650 flux system with the Innolot® alloy delivers superior reliability, particularly in miniaturized systems within the automotive industry.

mAgic® DA320 - High Shear Strength Sinter Paste for Power Applications

mAgic® DA320, an innovative sinter paste, will be a focal point of Heraeus Electronics' exhibit. This high shear strength, non-pressure dispensing sinter paste is designed for die attach of power applications. With features like fast sintering, high shear strength, and high thermal conductivity, mAgic® DA320 is ideal for Silicon Carbide (SiC), Gallium Nitride (GaN), and other cutting-edge power devices.

Visit Heraeus Electronics at Booth 3912 during the 2024 IPC APEX EXPO to explore these groundbreaking solutions firsthand. The Heraeus team will be available for in-depth discussions and to address any inquiries. Heraeus Electronics remains at the forefront of innovation, continually pushing boundaries and introducing solutions that empower manufacturers to thrive in a dynamic and evolving market.

To learn more about Heraeus Electronics, visit www.heraeus-electronics.com

MORRISVILLE, NC – Juki Automation Systems (JAS), Inc., a world-leading provider of automated assembly products and systems and subsidiary of Juki Corporation, is excited to announce its participation in the upcoming 2024 IPC APEX EXPO. The event is scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Visit Juki Automation Systems at Booth 714 to experience a showcase of their latest innovations, featuring the LX-8 Advanced Flexible Mounter and the new ISM 3600 Front AMR (FAMR) System. In addition, Juki will exhibit the RS-1R, iCube, G-Titan, IMS and the JM-20.

Highlighted Exhibits:

LX-8 Advanced Flexible Mounter:
Juki's LX-8 stands as the ultimate solution for any production line. Equipped with cutting-edge technology and versatility, it offers users the choice between the P20 rotary planet head and the Takumi Head with adjustable head height for precise component placement. The LX-8's advanced features make it ideal for tackling complex projects with ease, while its efficiency shines in quick production runs. Juki's LX-8 is the perfect companion for manufacturing setups seeking streamlined processes and enhanced productivity.

ISM 3600 Front AMR (FAMR) System:
The Essegi Automation/Juki Front AMR (FAMR) system represents a second-generation automated material handling system, an evolution of the industry-leading design from Essegi. At its core is the enhanced ISM 3600 storage tower, featuring an automatic door and material conveyor. The FAMR system seamlessly integrates with existing Essegi/Juki storage towers. Utilizing the same server, software, and interfaces as the existing towers, the FAMR system ensures a smooth transition for users. Its strong ERP/MES interfacing capabilities prioritize efficiency by reducing duplicate data entry, minimizing errors, and optimizing material handling processes.

Juki Automation Systems invites all attendees to Booth 714 to experience the future of SMT technology and discover how these innovations can elevate their manufacturing processes.

For more information about Juki Automation Systems, visit www.jukiamericas.com 

GREAT NECK, NY – Thermaltronics USA, Inc., a manufacturer of award-winning solder robots, is pleased to announce its participation in the 2024 IPC APEX EXPO, taking place April 9-11, 2024 at the Anaheim Convention Center in California. In Booth 1003, the company will unveil its latest innovation, the TMT-R9000S Solder Robot. As the solder robot market experiences rapid growth, fueled by skilled labor shortages and heightened automation demands, Thermaltronics is at the forefront, addressing industry needs with cutting-edge solutions.

Designed as a compact and versatile benchtop unit, the TMT- R9000S is well-suited for a diverse array of applications. The incorporation of SMEMA Communication Ports enables seamless integration with Robotic Arm Systems, expanding its automation capabilities. With a soldering area measuring 12” (308mm) x 12” (308mm), the TMT-R9000S delivers precision and flexibility in soldering applications. Accommodating a maximum PCB area of 17” (450mm) x 17” (450mm), this solder robot is adept at handling versatile soldering tasks.

Noteworthy features include XYZ 3D soldering and 3D dispensing capabilities, ensuring accuracy and consistency in complex soldering tasks. The availability of two input line voltage options, TMT-R9000PS-1 (100-110 VAC) and TMT- R9000PS-2 (220-240 VAC), adds to its versatility. With a 6-axis servo motor axis, the solder robot provides control and precision in soldering operations.

Thermaltronics has a successful history with previous solder robot models, including the TMT- R8000S, TMT-R9800S, and TMT-R9900S. Building on this legacy, the TMT-R9000S introduces advanced features and capabilities to meet the evolving needs of the electronics manufacturing industry. Notably, this machine holds a significant advantage, boasting a larger soldering area than the TMT-R9900S. With the ability to accomplish 600mm circular soldering, the TMT-R9000S expands the possibilities for precision and efficiency in soldering operations, making it the ideal choice for applications requiring a larger soldering footprint.

Visit Booth 1003 at the 2024 IPC APEX EXPO to explore the TMT-R9000S Solder Robot and witness the latest advancements in automated soldering technology from Thermaltronics.

In addition to its award-winning hand soldering product line, Thermaltronics also provides an extended range of accessories to support both production and rework applications. For more information or to request a sample, please contact info@thermaltronics.com or visit www.thermaltronics.com

SAN DIEGO – KIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is excited to announce its participation in the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. Visit KIC at Booth 1626 to witness the latest advancements in reflow process inspection (RPI) technology.

In response to the dynamic demands of today's manufacturing environment, where maintaining the highest level of quality and process control is paramount, KIC proudly introduces NEW SENSOR TECHNOLOGY. This groundbreaking technology, Contact-less Thermal Analysis TM , directly measures board temperatures during production, marking a revolutionary advancement in electronics manufacturing.

Contact-less Thermal Analysis^TM: KIC’s revolutionary Contact-less Thermal Analysis TM directly measures board temperature at the end of the heated section of the reflow oven during production. This capability enables real-time monitoring of temperature and convection changes, representing a monumental leap in reflow process inspection technology.

Benefits of the New Sensing Technology:

1. Precision Redefined: Directly measuring board temperature and heat transfer changes ensures unparalleled precision and quality in reflow profiles, monitoring all aspects of the oven's influence on production boards.

2. Combined Board-Level Temperatures: KIC RPI employs advanced algorithms, considering board temperature and ambient temperature at the board level, to determine temperature, time, and convection changes impacting the reflow profile.

3. Seamless Integration: The RPI system actively tracks process Cpk, providing critical temperature profile data that seamlessly integrates with other MES factory automation systems, SPI, and AOI data.

Experience the Future of Electronics Manufacturing: Discover the future of electronics manufacturing with KIC's advanced RPI systems equipped with Contact-less Thermal Analysis TM . Stay ahead of the competition, enhance process efficiency, and ensure uncompromised quality in every PCB.

Ready to Elevate Your Manufacturing Quality and Process Control?

Visit KIC at the 2024 IPC APEX EXPO to engage with thermal process experts, learn more about this groundbreaking technology, and explore solutions for soldering and curing processes in electronics manufacturing and semiconductor advanced packaging.

Learn more about KIC's Contact-less Thermal Analysis TM and Convection Detection at www.kicthermal.com/reflowheattransfer 

For more information about KIC and its revolutionary solutions, please visit www.kicthermal.com