CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials, is pleased to announce its participation in the SMTA International 2024 conference, taking place October 20-24 at the Donald E. Stephens Convention Center in Rosemont, IL.

AIM Solder will be exhibiting at Booth #2725, where attendees can explore the company’s latest innovations, including the award- winning NC259FPA Ultrafine No Clean Solder Paste, and engage with AIM’s team of experts.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

AIM Solder Content Specialist, Gayle Towell will also be sharing expertise across several key sessions during the conference:

• Women’s Leadership Program: Round Table Discussion Host; Past, Present, Future of Soldering Technologies, Monday, October 21, 4:00 PM | This discussion will focus on the evolution of soldering technologies, providing insights and fostering dialogue among industry leaders.
• Technical Presentation: Comparative Analysis of Automated Optical Inspection (AOI) Performance with Different Solder Alloys, Tuesday, October 22, 3:30 PM, Session INS4, Room 44 | This presentation will delve into a comparative study of AOI systems' performance on printed circuit boards soldered with SAC305 and REL61™ alloys. The research explores how REL61™'s uniform matte finish potentially enhances AOI performance by producing more uniform fillets, wetting, and distribution.
• UltraHDI Pavilion: Ultrafine Solder Paste, Wednesday, October 23 | Gayle Towell will be presenting on the latest advancements in ultrafine solder paste technology.
• Special Session with SMTA: Innovating Education, Thursday, October 24 | A panel of SMTA members unveil a new video course format for workforce education within the electronics manufacturing industry.

With master’s degrees in mathematics and physics from the University of Oregon, Gayle Towell brings nearly two decades of experience in higher education, technical writing, and creative writing to her work at AIM Solder. Gayle is instrumental in producing technical and research-based materials, while also collaborating with industry partners on various projects.

AIM Solder invites all SMTAI attendees to visit Booth #2725 to learn more about our superior soldering products and how our technical expertise can support your manufacturing processes. We look forward to engaging with industry professionals and exploring collaborative opportunities.

CLINTON, NY – Indium Corporation Senior Sales and Business Development Manager, Chris Nash, will present at the e-Mobility Conference at Productronica India, on September 12 in Delhi, India.

The presentation, titled Sustainable and Reliable Solder Materials for an Industry Centered Around Sustainability – How to Reduce e-Mobility Circuit Board Assembly Carbon Emissions While Improving Solder Joint Reliability, will focus on innovative, sustainable solutions for the e-Mobility sector.

Nash's presentation will address the growing demand for environmentally friendly manufacturing processes in the automotive industry. He will discuss how advanced solder materials can simultaneously reduce carbon emissions and enhance the reliability of circuit board assemblies in electric vehicles.

“As the e-Mobility sector continues to grow, it's crucial that we develop solutions that not only meet performance requirements but also contribute to sustainability goals,” said Nash. “Our latest innovations in solder materials demonstrate that improved reliability and reduced environmental impact can go hand in hand.”

Indium Corporation Associate Director for Global Technical Services & Application Engineering, Jonas Sjoberg, will also join a panel discussion on September 12. The panel, titled PCB Value Chain, The Missing Links, is part of the India PCB Tech Conference. The conference is organized by ELCINA and Messe Muenchen India, with support from IPCA (Indian Printed Circuit Association). This event brings together companies from across the PCB industry and its supply chain.

WALDENBURG, GERMANY – Thomas Garz has been appointed Executive Vice President for the Würth Elektronik eiSos Group with effect from 1 August 2024. The 37-year-old has been with the Würth Group since 2006. Most recently, he was Senior Vice President of the Würth Line Craft, the core business of the Würth Group, for Scandinavia and additionally responsible for International Systems of the Würth Line.

The organizational structure of the Würth Elektronik eiSos Group will remain unchanged as a result of this appointment.

In Thomas Garz, we are delighted to have found a long-standing employee who has successfully held various management positions in the Würth Group before assuming his new role as the Executive Vice President for the Würth Elektronik eiSos Group,” said Robert Friedmann, Chairman of the Central Management Board of the Würth Group.

Before taking up his position as the Senior Vice President of the Würth Line Craft for Scandinavia, Thomas Garz held various positions, including sales and shop manager, assistant to the management and auditor for Würth.

“I am delighted to be joining the extremely successful electronics company of the Würth Group. Würth Elektronik eiSos is a company that has established itself in highly competitive global markets through innovation, top quality and an unparalleled service orientation. Together with our committed and motivated employees, we will shape the future of and further develop the company.”

AUSTIN, TX – Cetec ERP is will be showcasing its comprehensive suite of solutions tailored specifically for the medical device industry at MEDevice Boston, scheduled to take place September 25-26, 2024, at Booth #945.

Cetec ERP's platform is designed to address the unique challenges of medical device manufacturing, providing an integrated system that ensures compliance with regulatory standards such as ISO 13485 while streamlining operations. From Quality Management System (QMS) functionality to inventory traceability, document management, barcode scanning, and production control, Cetec ERP equips manufacturers with the tools they need to enhance efficiency and maintain rigorous quality standards.

Medical device manufacturers operate in a highly regulated environment, requiring ERP solutions that cater to their specific needs. Cetec ERP’s software empowers these manufacturers with cutting-edge technology that simplifies critical processes throughout the entire product lifecycle, ensuring they remain compliant and efficient.

Key features include a robust QMS module, designed to ensure compliance with ISO 13485 and other industry regulations, while providing tools for effective audits and corrective actions. Cetec ERP's inventory traceability feature provides real-time tracking of inventory movements, ensuring manufacturers meet stringent traceability requirements. The platform's barcode scanning capabilities enhance data accuracy and expedite warehouse processes.

Document management is another cornerstone of Cetec ERP’s solution, offering seamless collaboration and version control for essential documentation. Integrated with advanced production control features, the software enables manufacturers to optimize production schedules, manage resources, and improve shop floor productivity, driving operational efficiency and cost savings.

For more information, visit Cetec ERP at in Booth 945 at MEDevice Boston, or explore their offerings at www.cetecerp.com