Press Releases
HARRISBURG, PA – Cumberland Electronics Strategic Supply Solutions (CE3S), a leading provider of quality goods and services, proudly announces the establishment of its newest distribution center in Orlando, Florida. This strategic expansion reflects the company’s dedication to serving the Florida market and enhancing its service offerings to valued customers in the region.
With a strong presence and clientele in Florida for many years, CE3S recognized the need to bolster its support infrastructure with a physical distribution and warehouse location. This decision aligns with CE3S's commitment to delivering exceptional service and convenience to its customers, particularly those under Vendor Managed Inventory (VMI) arrangements.
"This expansion represents a significant milestone for CE3S as we continue to prioritize the needs of our customers in the Florida market," said Jeremy Wagner - President/CEO at CE3S. "Establishing a distribution center in Orlando emphasizes our dedication to providing efficient and personalized service to our clients.”
Leading the operations at the new Orlando distribution center is Dave Fields, who joined CE3S last year. Fields brings extensive industry experience and a deep understanding of the Florida market, making him well- suited to oversee sales, support efforts, and operational management in the region.
"This facility marks our first warehouse location in Florida, complementing our existing offices in Harrisburg, PA, and Maryland," added Wagner. "The central location of our Orlando distribution center enables us to better serve our customers across the state, offering locally-stocked inventory and personalized service tailored to their specific needs."
CE3S's commitment to delivering a superior customer experience extends beyond its product offerings. The new distribution center in Orlando signifies the company's dedication to providing convenient access to high-quality electronics manufacturing solutions and fostering long-term partnerships with its customers.
For more information about CE3S, please visit www.ce3s.com
WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer regarding President Biden’s State of the Union address.
“During tonight’s State of the Union address, President Biden highlighted the initial progress made in implementing the landmark CHIPS and Science Act, which is on track to greatly strengthen America’s economy, national security, and semiconductor supply chains. The Commerce Department has taken important early steps to advance CHIPS manufacturing incentives and research investments, and we look forward to seeing continued headway in the weeks and months ahead.
“Companies in the semiconductor ecosystem have announced 80 new manufacturing projects in the U.S. since CHIPS was first introduced in Congress, totaling more than $250 billion in private investments across 22 states. These projects are projected to create 45,000 direct jobs and support hundreds of thousands of additional jobs throughout the U.S. economy.
“We commend President Biden and bipartisan leaders in Congress for their longstanding efforts in support of the CHIPS Act and urge the administration to continue implementing CHIPS in an effective and expeditious manner. We also call on leaders in Washington to enact policies that will grow the STEM talent pipeline, promote U.S. technology leadership, and maintain access to global markets.
“These policies will help ensure the CHIPS Act delivers maximum benefits for U.S. semiconductor production and innovation while also promoting America’s long-term economic and national security.”
WALTHAM, MA – Essemtec is pleased to announce its participation in the upcoming SMTA Monterrey Expo, scheduled to take place Thursday, March 14, 2024, at the Cintermex Convention Center in Monterrey, Nuevo León, Mexico. The event will serve as an excellent platform for industry professionals to explore the latest advancements in electronics manufacturing.
Essemtec will discuss a range of cutting-edge solutions at the expo, including:
High-Speed Solder Paste Jetting: Essemtec continues to enhance its solder paste jetting capabilities with on-the-fly jetting capabilities. With a jet frequency of up to 720,000 dots per hour (dph) and a system throughput average of >= 180,000 dph depending of the design, Essemtec's solutions ensure high efficiency and precision in the soldering process.
Video: https://vimeo.com/878483377
Integrated Inspection System (I2S): The I2S offers 2D inspection and major defect detection for dispensing and pick-and-place processes. With jetting, inspection, automatic repair, placement, and final inspection integrated into a single run, manufacturers can streamline their production processes and improve overall efficiency.
Video: https://vimeo.com/878646303
Smart Material Management 4.0: Essemtec provides fully integrated end-to-end storage solutions with traceability down to individual components. From simple barcode labeled racks to fully automated storage cabinets, Essemtec's solutions are scalable and tailored to meet the diverse needs of manufacturers.
Video: https://vimeo.com/878951505
4 mm EVO Feeder - 008004 Pick-and-Place: This recent development has improved the accuracy of the placement process to ± 40 µm (3σ), enabling the placement of 008004 (improved) 0.25 x 0.125 mm components. This miniaturization of electronics facilitates precision and efficiency in manufacturing processes.
Video: https://vimeo.com/823756474
Barcode Label Feeder: Essemtec's barcode label feeder enables the marking of PCBs with unique identification labels directly during the pick-and-place process. This facilitates traceability through the placement of barcodes, data matrix codes, date stamps, and more.
Visit Essemtec at the SMTA Monterrey Expo at booth 65 to learn more about these innovative solutions and find out how Essemtec is shaping the future of electronics manufacturing. The company's team of local engineers in Mexico will provide expert insights on the latest SMT topics, offering valuable tips to enhance time-to-market, bolster production line flexibility, and optimize manufacturing costs.
For more information, visit www.essemtec.com
MADISON, AL – STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and contract PCB assembly, announces its participation in the upcoming Dallas SMTA (Surface Mount Technology Association) Expo & Tech Forum and Houston Chapter Expo. The first event is scheduled to take place on Tuesday, March 19 th at Plano Event Center, 2000 E. Spring Creek Pkwy., Plano, TX 75074, and then Thursday, March 21 st at The Stafford Centre, 10505 Cash Road, Stafford, TX 77477, showcasing the latest advancements and innovations in surface mount technology.
STI Electronics, Inc. is thrilled to be a part of these premier events, which serve as a hub for professionals, engineers, and industry experts to come together and explore emerging trends and technologies in the field of electronics manufacturing. As an exhibitor, STI Electronics, Inc. will have the opportunity to showcase its cutting-edge solutions and services tailored to meet the evolving needs of the electronics industry.
Attendees can visit STI Electronics, Inc. to learn more about the company's extensive range of offerings, including:
- Advanced electronics manufacturing services
- Engineering support
- Training programs and certification courses
- Product testing and validation services
“We are excited to participate in the Dallas SMTA Expo & Tech Forum and the Houston Chapter Expo, to engage with industry professionals from across the region,” said David Raby, President/CEO at STI Electronics, Inc. “This event provides an excellent platform for us to demonstrate our commitment to innovation and excellence in electronic manufacturing.”
STI Electronics, Inc. invites all attendees to stop by its booths to explore the company’s comprehensive solutions and discuss how it can help address specific challenges and requirements in electronic assembly and manufacturing.
FARNBOROUGH, UK – Gen3, Global leader in SIR, CAF, Solderability, Ionic Contamination & process optimisation equipment, to announce its participation in the 2024 IPC APEX EXPO, scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California. At booth 3934, GEN3 will be exhibiting alongside Horizon Sales, presenting a lineup of advanced technologies aimed at enhancing the efficiency and reliability of circuit assembly processes.
At the show, Gen3 will be launching their new CM Series Process Ionic Contamination Tester - the industry-leading and award-winning combined ROSE and PICT Tester, with 6 Sigma verification.
Developed in accordance with the new IPC J-Std-001 standard (the removal of ROSE), this equipment enables a user to accurately measure Ionic contamination, vital in electronic circuit board manufacturing and is the ultimate process control tool. With five models and tank sizes, choosing the right system is crucial for optimal testing. Each system features solid gold test cells, ballistic amplifiers, and robust pumping systems for precise measurements even at low conductivity levels. Collaborative research with Robert Bosch confirms its 6 Sigma compliance across global production sites, making it a trusted tool for manufacturing optimisation and control.
One of the featured products is the GEN3 AutoSIR2+, a cutting-edge solution for ensuring quality and reliability in electronics. Its shielded precision electronics allow for highly accurate resistance measurements, which, alongside its unique multi-bias testing and high- voltage capabilities, further enhance its versatility and ability to cater to diverse testing needs, surpassing existing SIR test alternatives.
With options for 64, 128, or 256 channels, each current- limited to encourage dendrite growth for failure analysis, the system offers enhanced flexibility and parallel testing capabilities, significantly increasing throughput. Frequent monitoring and early trend analysis capabilities save time and money, while the user-friendly interface and customisable testing intervals make operation intuitive.
The award-winning Gensonic Stencil Cleaning system also will be on display. The system uses a 40kHz on-contact ultrasonic transducer for high efficiency cleaning of stencil apertures. Additionally, the Mobile Sonic was developed in response to the demand for fast, low- cost, portable stencil cleaning solutions. This innovative system combines the powerful Gensonic ultrasonic transducer system with a custom-designed stencil cart featuring an onboard power supply. With its self-contained design and battery power source, the Mobile Sonic eliminates the need to transport dirty stencils across the factory floor.
Another highlight is the MUST3 Solderability Tester by GEN3, setting the benchmark for solderability testing with unparalleled accuracy and extensive testing capabilities. Developed in collaboration with top industry partners, the MUST3 conducts solderability testing in compliance with major international standards, delivering instant pass/fail results and accommodating various solderability test formats.
Visit GEN3 at booth 3934 at the 2024 IPC APEX EXPO to learn more about these groundbreaking technologies and their potential to revolutionize circuit assembly processes. For more information about Gen3 and its innovative testing solutions, visit www.gen3systems.com
WATERTOWN, SD – Würth Elektronik eiSos made its return to the prestigious Applied Power and Electronics Conference (APEC) held in Long Beach, California, USA, in February 2024. With a history spanning over 35 years, APEC has solidified its position as the premier showcase for electronic components in North America. Prior to the exhibition, technical minds met at the PSMA/PELS Power Magnetics workshop, where Würth Elektronik displayed a strong presence.
Seminars/Presentations
At APEC, George Slama, Senior Application and Content Engineer at Würth Elektronik, assumed the role of Session Chair for Industry Sessions such as "Modeling and Simulation of Magnetics - Closing the Loop" and "EMI & Magnetics." Slama also reprised his role as Technical Dialog Session Chair for "High Frequency Magnetics" and "Magnetic Design & Optimization" sessions. Slama displayed his technical knowledge during an Exhibitor Presentation as he hosted “Advancements in EMC Filter and Component Selection Tool” during the exhibition.
Also representing the company, Matt Wilkowski, Design Consultant for Würth Elektronik, served as Technical Dialogue Session Chair for Tuesday's "High Frequency Magnetics" and "Magnetics Applications II" sessions, along with being the Technical Lecture Session Chair for "Magnetics & Modeling Simulation" and "Magnetics Applications I" on Thursday.
During the conference, Würth Elektronik's Global Business Consultant, Lorandt Foelkel, delivered an Industry Session titled "See the Power of IoT in Action! Live, Functional Demo of Solutions." Additionally, seasoned Application Engineer Jared Quenzer hosted a Professional Education Seminar, "EMC Workshop for Power Supply Designers," which kicked off the week on Sunday, February 25.
The Booth
During the show, Würth Elektronik released the newest edition of their guidebook; “The Trilogy of Wireless Power Transfer 2nd edition.” Cem Som, author of the guidebook, was available on the booth to answer technical questions and offer support. Also released in Long Beach is Würth Elektronik’s comprehensive manual, “DC/DC Handbook.”
"Our more-than-you-expect service was and is the foundation of Würth Elektronik's corporate success," confirms Alexander Gerfer, CTO of the Würth Elektronik eiSos Group, a well-known component manufacturer. "Our DC/DC Converter Handbook, which we presented for the first time at the conference, proves that we are serious about promoting innovation and knowledge transfer. True to our mission "creating together", we will continue to ensure that great ideas get the right power - through functional power supplies as well as targeted development support, especially for start-ups."
Throughout the duration of the exhibition, Würth Elektronik showcased a variety of partner demonstrations on their distinctive booth. Highlighted activities included an interactive 50W WPC Shuffleboard table in collaboration with Infineon Technology, a miniature Ferris Wheel powered by a 24V Brushless DC Motor featuring customizable LED lighting in partnership with Renesas, and an engaging bean bag demonstration game showcasing Texas Instruments Power and Motor Control Solutions.
Attendees who actively participated in the booth's interactive activities received a complimentary pair of Würth Elektronik branded socks and were entered for a chance to win a pair of Apple Air Pods.
In addition to exploring the interactive exhibits, APEC attendees had the opportunity to engage in technical discussions with Würth Elektronik experts, receive the iconic Würth Elektronik APEC hat, and secure an exclusive invitation to one of the exhibition's premier events: the highly anticipated Tuesday Night Party hosted by Würth Elektronik.
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