SAN JOSE, CA – The Semiconductor Industry Association (SIA) today announced Texas Instruments Chairman of the Board Rich Templeton has been elected Chair of the SIA Board of Directors and Western Digital CEO David Goeckeler has been elected SIA Vice Chair. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.

“It is a great pleasure to welcome our new leadership team for the year ahead, Rich Templeton of Texas Instruments and David Goeckeler of Western Digital,” said John Neuffer, SIA President and CEO. “Rich is extremely knowledgeable about the challenges we face as an industry and how we can overcome them, and David is a seasoned industry veteran and a highly effective champion for SIA’s priorities. Together, they will make an outstanding team as leaders of the SIA Board of Directors in 2024.”

Templeton became Chairman of Texas Instruments in April 2008 and was President and CEO from May 2004 through March 2023. From April 2000 through April 2004, Templeton was Chief Operating Officer of TI. He was Executive Vice President of the company and President of TI's semiconductor business from June 1996 through April 2004. As CEO, Templeton maintained the company's strategic investments in R&D and manufacturing, while expanding the size of the sales and applications engineering team to better serve TI customers. Under his leadership, TI emerged stronger, with better technological and product positions in both its core businesses. Templeton joined the company in 1980 after earning a B.S. in electrical engineering from Union College in New York.

“Semiconductor technology is making the world smarter, greener, more efficient, and better connected, and effective government policies are needed to help the industry continue to grow and innovate,” said Templeton. “I look forward to working alongside my colleagues on the SIA Board to advocate for industry priorities in Washington and capitals around the world.”

Since joining Western Digital in March 2020, Goeckeler has focused on the company’s transformation as the leading data storage producer in the industry. Before becoming CEO, he was Executive Vice President and General Manager of Cisco’s Networking and Security Business, with responsibility for more than $34 billion of the company’s global technology franchise. He led a worldwide team of more than 25,000 engineers and oversaw Cisco’s networking and security strategy and market acceleration, including development operations for the company’s expansive technology portfolio and strategic acquisitions.

SAN JOSE, CA – SHENMAO Technology is proud to commemorate its 50th anniversary. Founded in 1973, SHENMAO has witnessed the evolution of Taiwan’s electronics industry, playing a pivotal role in shaping the landscape of solder materials and setting new industry standards.

During the early days in Taiwan, the electronics industry predominantly relied on processing supplied materials. Raw materials, such as tin, were acquired and melted using molds at high temperatures, resulting in the production of primarily industrial solder bars. The shift towards soldering materials only transpired as electronic components progressively reduced in size.

In 2004, SHENMAO seized a remarkable opportunity for internationalization and growth. With the European Union's mandate to transition to non- toxic, lead-free manufacturing processes for consumer electronics, driven by environmental concerns, SHENMAO took proactive measures. The company secured non-toxic, lead-free manufacturing technology from the Japanese company THERESA, paving the way for lead solder paste technology and earning HP certification under its own brand.

Following the success with HP, SHENMAO established collaborative partnerships with prominent electronics manufacturers such as Dell, Lenovo, Acer, and Asus. Gradually, SHENMAO captured approximately 18% of the global tin material market, ranking as the world's third-largest solder materials supplier, trailing only behind Japanese and American manufacturers.

In 2016, Intel invited SHENMAO to develop low-temperature solder paste products, addressing the challenge of circuit board warpage when exposed to high temperatures. This marked a significant milestone in the company's pursuit of sustainable growth.

To further support its commitment to innovation, SHENMAO inaugurated an advanced materials research and development center in 2016. This move allowed the company to expand its scope into diverse applications, including advanced semiconductor packaging, low-orbit satellites, and electric vehicles. Notably, SHENMAO entered the low-temperature tin product sector in collaboration with Intel, aligning with energy conservation and carbon reduction initiatives.

Looking ahead, the demand for low-temperature solder paste is expected to extend beyond processors to encompass memory on motherboards, NB displays, and power supplies, all driven by green manufacturing processes.

In addition to low-temperature solder paste, SHENMAO has ventured into producing recycled solder paste through a specialized recycling process. This sustainable approach is used in Apple iPhone chargers, aligning with the growing trend of energy conservation and carbon reduction.

SHENMAO's efforts in the recycled solder paste sector have captured Apple's attention. Both companies are now collaborating on mobile phone chargers, successfully completing the UAL product certification through Delta. Additionally, SHENMAO has forged a long-term partnership with Microsoft, with the aspiration of using recycled solder paste in the mainboards of the XBOX game console.

In a significant strategic move, SHENMAO followed in the footsteps of Wistron by acquiring a factory in Mexico. Construction is set to commence in October of this year, with plans to provide automotive solder paste to Tesla and make a strategic entry into the electric vehicle market.

SHENMAO is resolute in embracing the ESG (Environmental, Social, and Governance) trend, driving sustainable growth, and identifying new opportunities to shape the next 50 years.

For more information, please visit www.shenmao.com 

PHARR, TX – ROCKA Solutions is pleased to announce its official status as a USA-based company, headquartered in Texas, to better serve its valued customers in the United States and Canada.

As part of this expansion initiative, ROCKA Solutions has significantly increased its warehouse capacity in its Pharr, TX location, growing from 6,000 square feet to an expansive 15,000 square feet. Additionally, the company has established a new warehouse in El Paso, TX, spanning 5,000 square feet.

The decision to establish a USA-based company reflects ROCKA Solutions' commitment to providing top-notch service and support to its growing customer base in North America. The facilities in Texas allow for efficient distribution and quick response to the needs of clients across the region.

Looking ahead, ROCKA Solutions has ambitious plans for further expansion and is actively exploring opportunities to add more warehouse capabilities in key locations. This expansion strategy aligns with ROCKA Solutions' customer-centric approach, aiming to follow the footprint of its clients and enhance accessibility to its cutting-edge products.

"As part of our ongoing commitment to providing top-notch service to our customers in North America, we are excited to announce ROCKA Solutions' official presence as a USA-based company. Our expanded warehouse facilities in Pharr and El Paso demonstrate our dedication to meeting the growing needs of our clients with increased efficiency and faster delivery times," said Rodrigo Cacho, ROCKA President & CEO.

The expansion and localization of operations in the USA will empower ROCKA Solutions to provide even more agile and responsive services to its growing customer base in North America.

iNEMI Packaging Tech Topic Series Webinar
LSI/PKG/PCB Co-Design to Support 3D-IC/Chiplet Design
Guest Speaker: Kazunari Koga, Zuken Inc.
November 28, 2023

Chips and packages have different manufacturing methods and data sizes, so the design tools are also different. This webinar will introduce new software technology that can handle — in one tool —two types of design data. This technology connects design data for different technologies in a hierarchical structure and allows all data to be edited simultaneously. It also addresses the issues of designing a package that implements chiplets. This includes the challenges of large-scale design data (due to increasing nets between chips), device implementation of heterogeneous technologies with a mixture of substrate and silicon, and I/O design complexity.

About the Speaker
Kazunari Koga
Zuken Inc.

Mr. Koga has been working with development of an LSI/package/board (LPB) co-design environment since 2007. He joined the JEITA LPB working group in 2010, and participated in the development of LPB formats, which became an IEEE standard in 2015. He was also involved in the Semiconductor Technology Academic Research Center’s (STARC’s) development of a design methodology for 3D ICs, and the New Energy and Industrial Technology Development Organization’s (NEDO’s) development project for a 3D integrated design and verification platform.

Registration

This event is open to industry; advance registration is required (see link below). If you have any questions or need additional information, please contact Masahiro Tsuriya (m.tsuriya@inemi.org).

November 28, 2023
8:00-9:00 a.m. EST (US)
2:00-3:00 p.m. CET (Europe)
10:00-11:00 p.m. JST (Japan)
Register for this webinar