CLINTON, NY – Indium Corporation Global Account Manager and Senior Thermal Technologist Tim Jensen and Product Development Specialist for Thermal Interface Materials Miloš Lazić will present on thermal interface material (TIM) technology at SEMI-THERM, taking place March 25–28 in San Jose, California, U.S.

Jensen’s presentation, titled Innovative Metal TIM Technology for TIM1 in BGA Style Semiconductor Packages, will focus on the use of metal TIMs in a broader array of applications for which traditional polymer TIM materials are no longer suitable. Solder TIM (STIM) materials have been used as a TIM1 solution for a limited set of server packages for over 20 years due to their potential to provide extremely high amounts of heat dissipation. Because of increasing power and functionality of HPC packages, many of the traditional polymer TIM materials are reaching their physical limits for heat dissipation.

Lazić’s presentation, Integration of Thermally Conductive Tacky Agents with Compressible TIMs to Improve Thermal Performance, will examine a compressible metal foil designed to be used as a TIM between a heat source and a heat-sink, heat-spreader, or heat-pipe. Metals and alloys have been used in different forms as TIMs for many years. Generally, they have several advantages compared to other commercially available TIMs. Since they have higher thermal conductivity than polymeric TIMs, these materials are less sensitive to bond line thickness and coplanarity issues.

At Indium Corporation, Jensen leads a matrixed team focused on engaging customers and commercializing new technology for our Thermal Interface Material products, including technology for 5G and AI. He is responsible for ensuring the product line is poised for long-term success by developing technologies that best meet the current and future needs of customers. He has authored numerous technical papers on soldering and thermal technology. He has a bachelor’s degree in chemical engineering from Clarkson University and an MBA from Syracuse University.

Lazić is responsible for developing new thermal materials and products, and providing solutions for customer challenges and applications. He also develops new testing methods to evaluate power and thermal products, and gathers data on new and existing products for marketing presentations. He earned his master’s degree in electronics engineering and his bachelor’s degree in electrical engineering from the University of Nis in Serbia. He is an Energy Efficiency Engineer certified by the Serbian Chamber of Engineers in Belgrade; a Certified SMT Process Engineer; and is fluent in English, Serbian, Croatian, and Bosnian.

CARLSBAD, CA – Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will demonstrate their latest equipment for semiconductor manufacturing at SEMICON China 2024, booth 3645.

Plasma removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Fluid dispensing provides adhesion, structural integrity, thermal and electrical conductivity, and more in microelectronics manufacturing applications. Equipment in the booth includes:

• The MARCH FlexTRAK®-CD plasma system delivers high-throughput plasma processing of strip-type components for semiconductor manufacturing applications, such as leadframe or laminate strips presented in magazines. Flexible chamber configurations support contamination removal, etching, and surface activation before die attach, wire bond, molding and encapsulation, and underfill applications.
• The ASYMTEK Vantage® fluid dispensing system is used for applications in wafer-level packaging and panel-level packaging during semiconductor manufacturing. The Vantage system dispenses precise, fine lines to meet requirements for underfill, gap fill, sealing lines for fan-out/fan-in, strips, and module assembly. When configured with dual IntelliJet® valves, using Nordson’s patented jetting technology, Vantage can dispense into gaps less than 200 microns, and up to 90,000 dots per hour.

Experts will be ready to answer questions, discuss industry trends, and help navigate the challenges of electronics manufacturing to enhance efficiency, precision, and reliability across your projects. SEMICON China will be held at the New International Expo Centre, Shanghai, China, March 20 – 23, 2024. Our booth #3645 is shared with the Nordson Test and Inspection division.

WALDENBURG, GERMANY – The Würth Elektronik eiSos Group is taking part of the embedded world exhibition in Nuremberg from 9 through 11 of April 2024. Occupying the 200m² Stand #110 in Hall 2, the company will be presenting components from all its divisions, not only including electronic and electromechanical components, but also the Wireless Connectivity and Sensors division, which are particularly interesting for IoT solutions. The presentation focuses on components, and also on the comprehensive spectrum of dedicated services Würth Elektronik has to offer; including design-in support.

At the embedded world 2024 exhibition, Würth Elektronik will be showcasing all divisions to present itself as a service-orientated partner for developers. Its partnership with IC suppliers will also be discussed as two semiconductor manufacturers will be on hand on the booth each day of the exhibition to present reference designs in cooperation with Würth Elektronik.

Exhibition highlights

Brand-new products include the WL-ICLED RGB LEDs with integrated circuits (IC). These pixel-controlled components combine red, green, and blue LED chips and a pre-programmed IC. SMT-capable digital isolators for signal transmission applications up to 150 Mbps will also be displayed to the public for the first time. Other product highlights include the WE-MAPI, WE-HEPC, and WE-XHMI high-temperature power inductors, and the WE-BMS transformer for battery-management systems. Further eye-catching points of the presentation will be the WRIS-RSKS thick-film resistors, whose high degree of sulfur resistance making them ideal for industrial applications. Additionally, in the area of mechanical components, the lead-free SMT spacers make it considerably easier to manufacture stacked circuit boards. Also shown will be four new series of products in the portfolio of durable aluminium hybrid polymer capacitors.

Because the IQD Frequency Products company is a co-exhibitor this year, further attention-drawing products include quartz crystals and oscillators. This Würth Elektronik eiSos Group affiliate will be presenting a series of quartz crystals embedded in 4-pad SMT ceramic cases with an extended operating-temperature range from -40°C to 125°C.

The service area also has a novel feature to present: The REDEXPERT online simulation tool; now expanded with the MagI³C power module designer feature, which enables the swift and simple integration of a power module into an application without the need for specialist DC/DC converter skills.

Conference paper on EMC

The company’s resident EMC expert, Dr. Heinz Zenkner, will also make Würth Elektronik’s special contribution at the embedded world conference. The paper, titled “EMC Compliant Industrial Electronic Design“, will be presented on April 11, 2024 from 9:30am to 1:00pm. This technical article discusses interface electronics and EMC filter concepts that suppress both transient interferences as well as interference emissions at frequencies above 1 GHz.

“We see ourselves as the developer’s partner of choice, and not only do we deliver components ex stock without minimum order volumes, we also provide tools like REDEXPERT and personal support right from the circuit design stage, to help create high-quality and sustainable products hand in hand with our customers. This is why we attach such great importance to service and support,” says Alexander Gerfer, CTO of the Würth Elektronik eiSos Group, describing the thematic orientation of the company’s embedded world presentation.

April 11 2024 is Student Day at the exhibition, and here, Würth Elektronik will be offering a special programme. Information and registration options can be retrieved at the following link: https://www.we-online.com/en/news-center/events/student-day 

Aside from its presence at the exhibition stand, Würth Elektronik will have its Show Truck in attendance. Located in the Exhibition Park, this will be a further popular venue for talks and encounters.

IRVINE, CA – TopLine Corporation will co-exhibit in booth #1231 with Tanaka Precious Metals at the upcoming IPC/APEX 2024 conference and exhibition at the Anaheim Convention Center, Anaheim, California, April 9 – 11. At IPC Apex, At IPC Apex, TopLine will display CCGA, BGA, and daisy chain test components as well as bonding wire by Tanaka Precious Metals.

IPC APEX EXPO 2024 is the electronics manufacturing industry’s largest event in North America, featuring a world-class trade show, cutting-edge technical conference, professional development courses taught by industry experts, non-stop networking and more, in Anaheim, California, April 6-11, 2024, where IPC APEX EXPO hosts the Electronic Circuits World Convention 16 (ECWC16).

TopLine Corporation is a well-known provider of CCGA semiconductor packages for engineering development.