REDDITCH, UK – Altus Group, a leading capital equipment distributor for the electronics industry in the UK and Ireland, is pleased to announce the addition of a Senior Sales Manager to its growing team. With this appointment, Altus strengthens its sales force, now comprising of a six-person strong Sales Team.

Matthew Fitzpatrick, who will cover the north of the UK, brings a wealth of experience in account management and new business development, having successfully managed large-scale, technical projects in adjacent sectors. His expertise will be instrumental in enhancing Altus’ account management capabilities and expanding partnerships across the Northern region, where the electronics manufacturing sector is thriving.

“I am very pleased that we can bring someone of Matt's calibre into our organisation,” said Joe Booth, CEO of Altus Group. “Matt has a proven track record of adding value to customer experiences and exceeding performance targets makes him a valuable addition to the team.

“With the North of the UK being a critical hub for electronics manufacturing, Matt’s expertise will be instrumental in supporting our suppliers and customers in the region. As he transitions into his role, I am confident that Matt will continue our momentum in driving growth, while also ensuring that our existing partners receive the exceptional service they have come to expect from Altus.”

The addition of Matthew reflects Altus’ commitment to providing the highest quality pre-sales and after-sales care. The company's partner list has grown exponentially over the past five years, and with increased capacity in pre-sales and account management, Altus ensures that customers receive exceptional project support, which is a significant reason for the growth they have witnessed.

Matthew added: “I’m excited to join Altus and eager to get started. The company’s clear mission to set new benchmarks in customer service is both inspiring and contagious. Altus already supports an impressive range of customers and works with industry-leading suppliers, which makes this role all the more appealing. I’m eager to dive into the technology and see how I can contribute to Altus' continued success.” Matthew will undergo an extensive on-boarding process over the coming months, preparing him to support key accounts. Customers and suppliers will have the opportunity to meet him in person at Altus’ upcoming Factory of The Future taking place in September.

MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is excited to announce its participation in the upcoming SMTA Guadalajara Expo & Tech Forum. The event will occur on September 11th and 12th, 2024, at the Expo Guadalajara, Salón Jalisco Hall D & E, in Guadalajara, Jalisco, Mexico.

ZESTRON will be exhibiting at Booth #922, where our team of experts will be available to discuss our wide range of cleaning solutions and answer any questions regarding our popular decoating product, ATRON® DC. This product is known for its exceptional and efficient performance when removing conformal coating residues from pallets, fixtures, and tools. Specifically designed as a safe alternative to the harsh cleaners used in the past, this water-based product reliably removes acrylic, urethane, epoxy, and some silicone conformal coatings and can be used in all types of maintenance cleaning equipment, such as dip tanks and ultrasonic processes.

Why Visit ZESTRON at Booth #922?

• Expert Guidance: Meet our team of specialists ready to provide insights into our full suite of cleaning solutions, including the ATRON® DC.
• Customized Support: Discover how ZESTRON’s Technical Center can be used as an extension of your team.

From process optimization to qualifications and compatibility testing, ZESTRON can enhance the reliability and performance of your electronics manufacturing processes. ZESTRON is committed to delivering innovative cleaning solutions that meet the highest quality and performance standards. We invite all attendees to visit us at Booth #922 to learn more about how ZESTRON can help optimize your manufacturing processes.

MINNEAPOLIS, MN – Nordson TEST & INSPECTION today announced its participation in SEMICON Taiwan, one of the most anticipated events in the semiconductor industry. The event will take place from September 4-6, 2024 at TaiNEX Hall 1 and 2, Taipei, Taiwan. In booth #L0516, the company will be showcasing its state-of-the-art inspection and metrology solutions, including the Quadra 7 Pro Manual X-ray Inspection (MXI) System, the new SpinSAM Acoustic Micro Imaging (AMI) system and the Gen 7 AMI system. The company will also demonstrate the WaferSense® Auto Teaching System™ (ATS2) for semiconductor tool set-up and maintenance.

The new Quadra 7 Pro MXI system sets a new standard for 3D/2D manual inspection in back-end semiconductor applications. Powered by the revolutionary Onyx® detector technology, it delivers exceptional image clarity and reduced noise levels, elevating the inspection experience to new levels of precision and efficiency.

Equipped with the latest Dual Mode Quadra NT4® tube, the Quadra 7 Pro provides users with maximum flexibility. This innovative feature offers brightness and resolution modes, allowing operators to dynamically switch between them based on specific application requirements.

Enhancing the Quadra 7 Pro's capabilities is the newly developed Revalution™ software, tailored specifically for high-end semiconductor applications. With an intuitive interface, optimized workflow, and expanded functionality, Revalution™ software empowers operators to efficiently analyze and interpret inspection data, contributing to faster decision-making and improved overall productivity.

The new SpinSAM AMI system delivers industry-leading throughput with unparalleled sensitivity for accurately locating defects in wafer based assemblies. The SpinSAM’s innovative spin scanning method scans up to 4 (300mm) wafers simultaneously at 41 wafers per hour, with the best-in-class defect capture and image quality.

With 4 matched waterfall transducers in a compact footprint, the system was meticulously engineered to attain full wafer scans in less than 6 minutes. Ideal semiconductor mid-end applications include bonded wafers, Chip-on-Wafer, stacked wafers, MEMS, over-molded wafers and more.

The Gen7 AMI system powered by C-SAM technology, provides fast and highly accurate inspection for detecting delamination and voiding with the most sophisticated microscope. Ideal for lab analysis and specialized high-resolution applications.

The WaferSense® Auto Teaching System™ (ATS2) is a multi-camera sensor that, when used in conjunction with CyberSpectrum™ software, enables accurate wafer hand-off calibration for semiconductor tool alignment and setup for front-end semiconductor fab environments. With the ability to capture three-dimensional offset data (x, y, and z) in real-time, ATS2 simplifies wafer position teaching without the need to open the tools. This results in repeatable and reproducible setups, streamlined maintenance checks, accelerated troubleshooting, and reduced technician-to-technician variation, leading to significant yield improvements and enhanced productivity for semiconductor fabs worldwide.

Nordson is a platinum sponsor of Semicon Taiwan and will be delivering a presentation titled ‘Revolutionary Acoustic Technology for Wafer-Level Applications’ at the Heterogeneous Integration Global Summit on Thursday, September 5th at 11:50am local time at 701GH, 7F, Taipei Nangang Exhibition Center Hall 2.

For more information, visit www.nordson.com 

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Empire Expo & Tech Forum taking place on September 26 at the DoubleTree by Hilton Syracuse in East Syracuse, New York. Among other great products, AIM will be highlighting its recently released NC259FPA Ultrafine No Clean Solder Paste.

NC259FPA is a zero-halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150 µm in diameter. Ideal for miniLED, microLED, die attach, micro BGA, and HDI boards, this innovative new product features excellent wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

To learn more about NC259FPA and to discover all of AIM’s products and services, visit the company at the SMTA Empire Expo & Tech Forum on September 26th, or visit www.aimsolder.com