WASHINGTON – The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer in response to the decision by the World Trade Organization (WTO) to renew the Moratorium on Customs Duties on Electronic Transmissions during the 13th Ministerial Conference (MC13) in Abu Dhabi.

“In terms of high drama, once again, the WTO Ministerial Conference didn’t disappoint. Thankfully, trade negotiators were able to overcome obstacles to deliver an extension of the Moratorium, which has been a cornerstone of the digital economy – enabling semiconductor supply chains, fueling economic growth and innovation across the globe, and helping to bridge the digital divide.

“While we celebrate this outcome, we recognize that more needs to be done to educate businesses and policymakers on the importance of the Moratorium. The semiconductor industry supports making the Moratorium permanent, which will provide the stability and predictability necessary for sustained innovation and growth in the digital age. We stand ready to work with the government and industry stakeholders to achieve this goal.”

CLINTON, NY – With more than five million electric vehicles (EVs) on the road with its materials and nearly a decade of experience in the market, Indium Corporation® is proud to feature its innovative Durafuse® solder technology alongside its Rel-ion™ portfolio of proven electrical, mechanical, and thermal solutions for EV manufacturing, at IPC APEX EXPO 2024, April 9-11, in Anaheim, California, U.S.

Among its featured products, Indium Corporation will showcase its lead-free Durafuse® technology and industry-proven Indium8.9HF solder paste series:

• Durafuse® HR – based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
• Award-winning Durafuse® LT – a novel solder paste alloy system with highly versatile characteristics that enable energy savings, high-reliability, low-temperature, step soldering, assemblies with large temperature gradients, and large BGAs with large complex warpage profiles. It also provides superior drop shock performance as compared to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
• Indium8.9HF Solder Paste Series – an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.

Some of the additional Rel-ion and high-reliability products for power electronics featured at IPC APEX will include:

• Indalloy®301 LT Alloy for Preforms/InFORMS® – a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys.
• Award-winning InFORMS® – reinforced solder alloy fabrications which improve mechanical and thermal reliability, and are specifically designed to produce consistent bondline thickness for power module applications.
• InTACK® – a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
• QuickSinter® – a new approach to sinter technology. This high-metal, low-organic content approach enables fast drying and sintering times for high throughput.
• Durafuse® HT – a novel design based on a novel alloy technology, designed to deliver a tin-rich, high-temperature lead-free (HTLF) paste, presenting the merits of both constituent alloys.
• Heat-Spring® – a compressible, non-reflow metal TIM ideal for TIM2 applications.

To learn why Indium Corporation is trusted by top EV and power electronics manufacturers across the globe, visit our experts at booth 4227 or at www.indium.com 

MILWAUKIE, OR – ECD announced today that it is continuing its engineering department expansion and has hired a software and manufacturing engineer, further bolstering its team as it accelerates current product line enhancements and NPI initiatives.

Nicholas Chase, Senior Software Engineer, comes to ECD with an impressive decade-long career, which includes software engineering experience at EDA companies Mentor Graphics Corporation (now Siemens EDA) and, most recently, Synopsys, Inc. He has a strong focus on sound design principles, continuous improvement, and has broad programming language proficiency. At ECD, Chase’s responsibilities entail driving development process efficiency, ensuring product software provides an intuitive and responsive user experience, and implementing robust testing procedures. He has already completed a significant project for ECD’s Baking Division with the integration of food safety KillStep Calculator functionality into the new touchscreen M.O.L.E.™ EV6 thermal profiling hardware. Chase holds a B.S. in Software Engineering from Oregon Institute of Technology.

Manufacturing Engineer Rahul Bilakanti oversees production and quality for ECD’s in-house manufacturing operation, which produces M.O.L.E. thermal profilers, SmartDRY™ desiccant cabinets, soldering machine verification pallets, and baked goods and oven sensors. Since joining the company, Bilakanti has contributed to manufacturing waste reduction through the use of 3D-printed fixtures, is leading the implementation of digitized manufacturing processes to streamline workflows, and is focused on improving production efficiency through collaborative DFM procedures. Bilakanti’s previous experience includes quality and manufacturing engineering positions at Abbott Labs and Japan Aviation Electronics’ Automotive Group. He graduated magna cum laude from the University of Southern California, where he earned a B.S. in Biomedical Engineering.

Speaking about the engineering staff growth, ECD President Tara Fischer says, “We are launching new products at an unprecedented pace, with three M.O.L.E. EV-series thermal profilers developed and commercialized within the last year,” she explains, underscoring the company’s ambitious five-year R&D roadmap. “So far, our team has executed our strategy perfectly. Nick and Rahul bring fresh eyes and outstanding credentials to our engineering department and have already been instrumental in our success. We are thrilled to have them on board!”

Chase and Bilakanti began their roles at ECD in November 2023. They are based in the company’s Milwaukie, OR headquarters.

NASHVILLE – KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 19, 2024 at Plano Event Center in Plano, TX. The KYZEN Clean Team will provide information about AQUANOX A4618 and the KYZEN Process Control System (PCS) during the event.

Concentrations of AQUANOX A4618, KYZEN’s newest game-changing cleaning solution, can be effectively monitored and controlled by the KYZEN Process Control System (PCS) to provide proven and cost- effective options in electronics cleaning processes.

AQUANOX A4618 is a groundbreaking aqueous cleaning chemistry designed to address the challenges of cleaning contemporary lead-free flux residues, while achieving mirrored solder finishes. A4618 has an extended tank life and excels at lower concentrations and temperatures to clean all flux types including no-clean and Pb-free residues.

The KYZEN Process Control System controls, monitors and automatically reacts to the dynamic changes in wash concentrations. KYZEN PCS remains the only complete concentration monitoring and control system in the world and is backed by 20 years of continuous improvement by KYZEN.

For more than 30 years, KYZEN has developed innovative chemistries that work effectively with a variety of cleaning processes and challenges. The KYZEN PCS and solutions like AQUANOX A4618 combine to create an efficient and worry-free process.

For more information, visit www.kyzen.com