AUSTIN, TX – Austin American Technology (AAT) is excited to announce the newest addition to its service team, Dustan Carr. With extensive experience as a field service technician, Carr will play a key role in supporting AAT's ongoing growth and further enhancing the company’s exceptional customer service.

Carr is a veteran of the United States Marine Corps, bringing with him a dedication, mindset and work ethic honed through military service. His expertise in customer service, service automation, quality assurance and maintenance planning will strengthen AAT's ability to provide top-tier service to its customers. Carr is currently undergoing comprehensive training and will soon be independently handling service, maintenance and equipment startups for both the AAT and Aqua Klean Systems (AKS) brands.

“We are pleased to add Dustan to our superior service team to assist us in our unprecedented growth," said Todd Rountree, CEO of Austin American Technology. "Dustan’s experience and work ethic are invaluable to our organization, and we look forward to the positive impact he will bring to both our team and our customers."

As AAT continues to expand, the addition of highly skilled professionals like Carr ensures the company can maintain and exceed its high standards of service and customer support.

For more information about Austin American Technology, please visit www.aat-corp.com 

NEUSS, GERMANY – Yamaha Motor Robotics FA Section showcased new collaborations with system integrators at Motek 2024 in Stuttgart, automating industrial processes across the production lifecycle including assembly, sorting, and testing.

“We continue to grow our portfolio of projects that embed Yamaha robots to provide fast and repeatable picking and placing or lifting and moving, with highly accurate positioning,” said Tatsuro Katakura, FA Sales Manager, Yamaha Motor Europe Robotics Business, Factory Automation Section. “These examples show how we can help companies serving sectors such as consumer electronics, automotive components, textiles, pharmaceuticals, and food production to boost production quality and raise productivity.”Yamaha’s booth demonstrations at Motek showed how SCARA and cartesian robots add value to custom automation designed for repetitive processes like punching, sorting, and testing.

The robotic punching machine configures electrical connectors at high speed, leveraging the compact YK-XE SCARA’s ability to quickly change tooling, position each connector quickly and accurately, and inspect after punching using the integrated vision system.

The sorting machine contains Yamaha’s YK-XG series SCARA with ultra-precise and reliable beltless motion to quickly palletise small components by accurately picking from detected positions.

In addition, the team presented a versatile automatic PCB tester that integrates Yamaha’s XY-X cartesian robot to provide flexible positioning for in-circuit tests, functional tests, and programming.

The demonstration showing end-of-line handling for EV batteries, featuring the larger YK1200X SCARA, showing how the combination of high payload capacity and optimised internal balance to manage inertia enables lifting and moving heavy items at speed, and final positioning with sub-millimetre accuracy.

A further showcase featuring Yamaha’s LCMR200 flexible transport system gave insights into how enterprises can reimagine conventional production lines to raise output, enhance uptime, ease scalability, and utilise factory floorspace efficiently.

The LCMR200’s horizontal and vertical circulation units, and the traversing unit that adds further flexibility, are ultra-reliable, simplify product traceability, and permit production-line maintenance with non-stop productivity.

“Motek attracted visitors from a wide range of industries and many came with intriguing automation challenges, making for a high-quality audience,” added Tatsuro Katakura. “As always, there were many opportunities to explain how our robots can help enterprises to become more competitive, agile, and futureproof. We look forward to strengthening the connections we made with potential new customers.”

CLINTON, NY – Indium Corporation is proud to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), taking place October 16-18 in Penang, Malaysia. Five experts from Indium Corporation will present their cutting-edge research on Pb-free soldering solutions that address critical challenges in modern power electronics and advanced packaging applications.

Indium Corporation Strategic Advisor Dr. Dongkai Shangguan will deliver a keynote presentation, titled Materials and Reliability for Advanced Packaging and Heterogeneous Integration. The keynote will explore the increasing complexity of interconnect reliability in advanced packaging, driven by the demand for high-density, high-performance applications and the rise of heterogeneous integration.

Product Manager (Semiconductor) Dean Payne will deliver a presentation, titled Making the Move from High-Pb Solder to Pb-Free for Die-Attach in Discrete Power Devices. It will highlight the shift from traditional high-lead (Pb) solder to Pb-free alternatives for die attach applications in discrete power devices. This session will provide insights into the future of die attach solutions and how Indium Corporation is innovating to address these challenges and find a sustainable Pb-free solution for power discrete die attach.

The following presentation will be given by R&D Sintering Project Manager Demi Yao, and is titled Pressure and Pressure-less Cu Sintering Paste Developed for Next-Generation Interconnection Material. This session will offer insights into high-reliability copper (Cu) sintering pastes developed for high-power applications, offering key advantages such as low cost, high thermal and electrical conductivity, and elimination of the need for precious metal plating like gold or silver.

Additionally, Assistant Product Manager for Power Electronics Sunny Neoh will offer a poster presentation, titled Low- and Mid-Temperature Pb-Free Solder Preform Technology in Substrate Attach Application for Improved Thermomechanical Performance. The presentation will explore advancements in low- and mid-temperature Pb-free solder preform technologies for substrate attach in high-power density electronics. It will also highlight the development of high-reliability alloys, such as SAC-In, Sn-Sb, and SAC-Sb, which are designed to withstand thermal cycling and improve the performance of large-area solder joints.

Research Chemist Mary Li Ma will also deliver a poster presentation, titled Voiding Control of Lead-Free Soldering at Quad-Flat No-Lead Package Components. This presentation addresses the challenge of controlling thermal pad voiding in quad-flat no-leads (QFN) packages, which is critical for applications where size, weight, and thermal properties matter. Through this study, a low-voiding paste was developed, offering a reliable solution for improved QFN performance.

For more information on Indium Corporation’s Pb-free soldering solutions, visit our experts at IEMT, at Booth #1.

NORTH MACEDONIA ― Bransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility. The addition of the REHM VisionXP+ ovens will enable Bransys to meet increasing demand, enhance product quality, and maintain its position as a leader in the industry.

The REHM VisionXP+ Nitro 3850 reflow ovens are recognized as "best in class" reflow convection soldering systems, known for their energy efficiency, superior performance, and sustainable operation. Each oven is equipped with 8 preheat zones, 3 peak zones, and 4 cooling zones, ensuring precise thermal management and high- quality soldering results.

The VisionXP+ series is designed with a particular focus on sustainable resource management. By integrating EC motors, these ovens significantly reduce energy consumption and operating costs, aligning with Bransys Group’s goal of promoting eco-friendly manufacturing processes. The REHM VisionXP+ Nitro Reflow Oven offers significant environmental benefits by reducing energy consumption and lowering emissions through its innovative heat transfer and nitrogen technology, contributing to more sustainable electronics manufacturing processes.

Advanced Features for Optimal Performance

The REHM VisionXP+ reflow ovens offer several advanced features that enhance the soldering process:

• Vacuum Soldering Option: This feature allows for time-efficient and stable production, reducing voids and ensuring low-maintenance manufacturing.
• Gentle Cooling Options: Various cooling options, including underside cooling, enable easy cooling of high-mass boards, ensuring product integrity and performance.
• Energy Efficiency: Proven energy savings through the use of EC motors contribute to both environmental sustainability and reduced operational costs.

Bransys Group specializes in delivering top-tier PCB design and assembly services, leveraging cutting-edge technology and industry expertise to provide innovative solutions to its clients. With a focus on quality, efficiency, and sustainability, the company strives to exceed expectations and drive success for its customers.

For more information about Bransys, please visit www.bransys.com