HALFMOON, NY – PVA, a global supplier of automated dispensing and coating equipment, is pleased to announce a strategic partnership with Altus Group Ltd., a renowned distributor with over two decades of experience in supplying premium electronics production equipment and services. As part of this collaboration, Altus Group will serve as the exclusive distributor for PVA's cutting-edge solutions in Ireland.

Altus Group has been a trusted supplier of electronics production equipment and services in the UK and Irish markets for nearly 23 years. Their extensive experience and industry knowledge make them a valuable resource for clients seeking the best solutions for their manufacturing needs.

One of Altus Group's strengths lies in their ability to consult with clients, offering expert guidance based on years of experience in the field. This personalized approach ensures that each client receives tailored recommendations and support to enhance their manufacturing processes.

Altus Group boasts a robust national network of engineers dedicated to providing ongoing assistance and support, making them an ideal partner for addressing day-to-day queries and ensuring the seamless operation of capital equipment. The partnership between PVA and Altus Group brings together two industry leaders, each known for their commitment to excellence and innovation. Together, they will provide Irish manufacturers with access to PVA's state-of-the-art fluid dispensing and conformal coating solutions, enhancing precision, efficiency, and quality in electronics production.

For more information about PVA and Altus Group, please visit www.pva.net and www.altusgroup.co.uk

For more information about PVA, please contact PVA at info@pva.net or (518) 371-2684.

CAMBRIDGE, UK – Ensuring that sensitive electronic components are not adversely affected by radiated electromagnetic interference (EMI) is an essential part of circuit design. Where compactness and close component proximity are a priority, such as in smartphones and smartwatches, conventional board-level shielding with metallic enclosures is increasingly being replaced with conformal package-level shielding. This approach utilizes conductive coatings applied directly to semiconductor packages and, together with emerging deposition methods such as spraying and printing, creates new opportunities for functional materials.

When selecting a material for conformal package EMI shielding, a variety of factors need to be considered. Most important is the attenuation of incident electromagnetic radiation, which is a function of electrical conductivity and magnetic permeability. Often parametrized as shielding effectiveness (SE), higher values enable a thinner coating to be used, reducing weight and material consumption. Other material considerations include adhesion to the underlying epoxy molding compound of the package, thermal conductivity, density, chemical stability, and compatibility with the deposition method if solution processing.

Sputtered metal

Sputtering metal is a well-established incumbent technology for conformal shielding, in which high-purity blocks of solid metal are ablated and deposited with a beam of charged ions. Many conformal shielding coatings use multiple metal layers, easily achieved by switching sputtering targets. Cap and/or adhesion layers are typically made from titanium, chromium, or stainless steel, with the primary shielding layer typically being cheaper metals such as copper, aluminum, or nickel.

While sputtering is well established, there is still scope for innovation. One proposed strategy, inspired by optical anti-reflective coatings, utilizes destructive interference from a multilayer stack to increase the shielding effectiveness. However, this improvement is highly frequency-dependent, given the fixed material spacing.

Conductive inks

Depositing conductive materials from solution provides an alternative to sputtering, with much-reduced equipment costs since the process occurs under ambient conditions rather than a vacuum. A range of solution processing methods, including spraying and inkjet printing, have been developed for EMI shielding, with all requiring conductive ink. Despite the high metal price, silver inks currently dominate due to their high conductivity and chemical stability.

Although the underlying metal is the same, there is extensive scope for differentiation amongst conductive ink suppliers. Particle shape and size are key factors, with nanoparticles generally offering higher conductivity but requiring higher curing temperatures than flake-based inks. Particle-free ink, also known as molecular ink, is a compelling emerging alternative. Rather than a suspension of metal particles, the ink is instead a solution of organometallic species that are reduced in situ, producing a smooth metal layer. A key advantage of particle-free conductive ink is eliminating the risk of nozzle clogging, a significant factor for digital printing methods such as aerosol and inkjet that enable selective deposition. Another benefit is that they produce very smooth coatings, which can improve shielding efficiencies at high frequencies.

MXenes

The ideal EMI shielding material would have high electrical conductivity, low density, flexibility to accommodate thermal expansion, tunable surface chemistry for adhesion, and solution processability. The emerging material class of MXenes, a family of two-dimensional inorganic materials composed of a few layers of transition metallic carbides, nitrides, or carbonitrides, fit this description. MXenes are thus the subject of both academic and commercial research for applications across electronics, including EMI shielding, with efforts currently being made to scale up production.

Comprehensive coverage

IDTechEx’s report “EMI Shielding for Electronics 2024-2034: Forecasts, Technologies, Applications” provides a detailed overview of the ‘EMI shielding for electronics’ market, with a more detailed assessment of the outlined materials classes along with nanocarbon-containing composites, metamaterials and combined thermal interface/EMI shielding materials. Innovations that will support the increasing adoption of heterogeneous integration and advanced semiconductor packaging, along with the activities of key players, are evaluated. 10-year forecasts for both deposition method and conductive ink consumption are provided, drawing on consumer electronic device analysis to assess the semiconductor package area requiring conformal shielding. Forecasts are segmented across multiple application categories, including smartphones, laptops, tablets, smartwatches, AR/VR devices, vehicles, and telecoms infrastructure. For more information on this report, please visit www.IDTechEx.com/EMI, or for the full portfolio of related research available from IDTechEx please visit www.IDTechEx.com/Research/AM.

CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation in the upcoming Productronica 2023 Trade Fair taking place November 14-17 at Trade Fair Center Messe München, Germany.

AIM will highlight many of its innovative products, including halogen-free no clean solder paste H10. H10 offers exceptional fine feature printing, improved electrochemical reliability, transfer efficiency >90% on area ratios of 0.50, and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 also reduces voiding on BGA, BTC, and LGA. Fit for automotive, LED and aerospace assemblies, H10 no clean solder paste is robust, stable, and easy to implement.

In addition, expect some surprises, including a new, soon-to-be-announced product designed for ultra fine pitch printing.

To discover all of AIM’s products and services, visit the company at the Productronica Trade Fair, booth A3.339 November 14-17, or visit www.aimsolder.com 

CONKLIN, NY – Universal Instruments has bolstered its European customer coverage by expanding the territory of Channel Partner smartTec Nordic. Previously responsible for managing Denmark and Sweden for Universal Instruments, smartTec Nordic will now also cover Finland and Norway, as well as the Baltic regions (Lithuania, Estonia and Latvia).

smartTec is a globally respected system integrator with a large number of line installations around the world. With more than 70 employees, the company is one of the largest electronics assembly solutions providers in Europe. smartTec provides its customers with fully integrated, intelligent line solutions from reputable partners – all designed to deliver the best ROI.

Based in Copenhagen, Denmark, smartTec Nordic provides sales, engineering, applications development, parts, and service for Universal Instruments products. As part of smartTec GmbH headquartered in Germany, smartTec Nordic leverages a 3000 square-meter demonstration and manufacturing facility near Frankfurt to test and develop customers’ manufacturing processes.

Lars Bøndergaard, managing director for the smartTec Nordic regions, noted “Universal is a pioneer in the electronics assembly arena with a robust and extensive solutions portfolio. It’s been a pleasure to represent these solutions and our customers have been the biggest beneficiaries.”

“We’ve had a great partnership with smartTec and were eager to open new doors,” said Universal Instruments President, Brad Bennett. “We know that smartTec Nordic provides a first-class customer experience and that’s the level of expectation we have from our Channel Partners. We’re looking forward to continued success.”

To learn more about Universal’s solutions for any electronics manufacturing challenge, contact Universal Instruments at +1-800-432-2607 or +1-607-779-7522 or visit www.uic.com