TOKYO – Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, will highlight its Total Inspection Line Solutions range of world-class SPI, AOI and X-ray inspection machines at Productronica 2023 in Munich, Germany from November 14-17 on booth #259 in hall A2. PCB assembly and semiconductor manufacturing customers are invited to experience unrivaled inspection accuracy and speed, as well as the comprehensive software and hardware interconnectivity solutions that are enabling today’s efficient cost-effective Smart Factories.
With live demonstrations of its innovative high-speed and high-accuracy SPI, AOI, and AXI machines, as well as bottom-side 2D AOI and X-ray inspection capability for back-end PCB assembly, booth visitors will experience first-hand Saki’s innovative range of quality assurance machines with superior M2M communication for streamlined product inspection. Latest soft- and hardware optimization features ensure even lower maintenance, operator efficiency and easy on-site upgrades for flexible and futureproof production planning.
With an emphasis on total inspection line solutions that offer reliability, speed, quality, and value for applications across key sectors including automotive, EMS, and industrial markets, the show line-up on booth #259 will feature:
Inspection Machines
The 3Di-LS2 and 3Di-LS3 are powerful 3D-AOI models equipped with 12μm and 15μm camera heads, perfect for today's SMT line manufacturing process requirements. They are designed to increase productivity, efficiency, and quality. Closed-loop technology, dual servo motor drive, high-resolution linear measurement, and sturdy gantry design ensure pinpoint precision and repeatability. Both AOI machines are equipped with Saki's innovative Z-axis control head and side camera feature to demonstrate the Saki Total Inspection Line Solution concept's versatility and flexibility. The latest award-winning 3D-AOI 3Di-LS3 machine provides high-speed, high-performance inspection. It offers increased height measurement and resolution with its updated camera system and accurately inspects extremely small and tall components. As well as achieving the industry's fastest cycle time, Saki’s latest AOI solution offers highest scalability, quality assurance, and productivity.
3Xi-M110 v3 - Saki's latest 3Xi-M110 v3 X-ray inspection solution features Saki's optimized Planar CT software, which was developed in-house for the industry's fastest cycle times. With highly accurate void measurement and detection for both PCBs and components, this 3D-AXI machine delivers excellent quality assurance.
3Si-LS2 - The 3Si-LS2 SPI machine with 12μm camera head is designed to support large PCB sizes up to 500 mm x 510 mm. With unified hardware and software, machine operators enjoy a seamless transition between platforms, resulting in a superior experience that reduces costs and increases overall satisfaction.
2Di-LU1 - Representing Saki's 2D AOI range, a 2Di-LU1 machine will be on show featuring bottom-side inspection for increased line productivity and Saki's distinctive line scan technology.
Smart Factory
Smart automation with Saki’s products improves quality assurance accuracy, lowers maintenance time, and improves operator performance. Productronica Visitors will be able to experience Saki’s latest Smart Factory innovations:
QD Analyzer v4 - The latest version of Saki’s software is key to a smart factory solution. Operators can intuitively monitor the machine status, record inspection results, and perform statistical analysis on data obtained from each machine within the production line. QD Analyzer plays a crucial role within the Saki inspection range, offering extensive reporting capabilities and providing real-time data.
Full Line Control Software Solutions
Saki's software suite & line control systems demonstrate the company's data-driven approach to continuous productivity improvement. Visitors to the Saki booth will experience the full IPC-CFX certified machine-to-machine connectivity capability, full line control enabled by Saki’s Offline Teaching station (BF2-Editor), Verification station (BF2-Monitor) and Multi Process View (MPV).
Further live demonstrations will highlight the power of Saki’s BFX Software for the 3Xi-M110 and 3Xi-M200 AXI machines by presenting the ability to greatly enhance product quality and production efficiency, improve process troubleshooting and determine root causes.
“Productronica visitors will see first-hand how our advanced AOI, SPI and X-ray inspection platforms help customers quickly identify the right solutions for their application and get to market ahead of the competition,” said Jaroslav Neuhauser, General Manager Saki Europe. “Particularly for our automotive and EMS customers in Europe and the Americas, flexibility is key for the future of inspection. Our latest range allows for rapid on-site equipment upgrade of components, such as the camera, ensuring inspection machines have improved uptime and state-of-the-art performance with minimal maintenance for superior customer value.”
For more information about Saki visit www.sakicorp.com/en/
KREUZWERTHEIM, GERMANY – SEHO Systems GmbH, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, ensures higher productivity in electronics production with flexible and innovative concepts. At productronica 2023, SEHO is taking another step towards zero-defect manufacturing in hall A4, stand 578.
Avoid defects before they disrupt the process flow and cause costs. With this in mind, SEHO has expanded the AOI product division. At productronica in Munich, SEHO will present the new AssemblyCheck for the first time, a component placement control system that is specifically optimized for THT assemblies.
THT components are often assembled manually or semi-automatically, so the risk of errors is correspondingly high. SEHO AssemblyCheck is integrated directly into the assembly workstation and provides immediate feedback whether the components are assembled correctly. Only then can the circuit board be released for further processing in a wave or selective soldering system. This eliminates possible errors, which leads to a significant increase in quality and yield.
SEHO AssemblyCheck generally checks for the presence of the correct components, the correct orientation or polarity, component colours are recognized and compared. Further inspection tasks include text verification (OCV), orientation and code reading. Circuit boards with a bad mark marking are automatically recognized and not checked.
Short cycle times and an assembly size of up to 610 x 510 mm [24” x 20”] guarantee high system efficiency. To reduce investment costs when there are several workstations, the SEHO AssemblyCheck can also be used inline. The combination with the THT-AOI system SEHO PowerVision offers maximum ROI: both systems are integrated in just one module that is installed in front of the soldering system.
At the assembly transport level, AssemblyCheck checks for correct component placement. Incorrectly assembled circuit boards can be automatically removed from the line, while defect-free assemblies are released for the further process. After the soldering process, SEHO PowerVision carries out the solder joint inspection at the return conveyor level of the module.
The SEHO Selectline-C also ensures productivity increases. The modular and expandable inline selective soldering system from SEHO has been supplemented with additional modules that significantly increase the flexibility of the system. A highlight of this machine is the SmartSplit software, which turns an already efficient system into a highly flexible and highly productive selective soldering system for high-mix-high-volume production. SmartSplit controls and coordinates the process flow for different assemblies in mixed operation. The soldering process for an assembly is automatically divided among the process stations available in the respective system. Up to 6 soldering units can be integrated in one system. As a result, SmartSplit enables cycle times to be halved in mixed operation, without major investments and without restricting the maximum available working area of the system.
In the high-end wave soldering area, innovative features increase process reliability. This includes the automatic nozzle height adjustment. In up to 16 different areas of an assembly, the height of the soldering nozzles can be programmed and adjusted individually in order to always have the optimal distance between the circuit board and the soldering nozzle, depending on the product. In addition to a greater process reliability, this innovative function offers independence from the workpiece carrier or assembly design, a significantly larger process window and maximum flexibility.
Of course, the stability of the wave height also plays a crucial role. Automated and directly integrated into the soldering area, the automatic wave height control ensures a reliable process and perfect soldering results without interrupting production.
For further information, the SEHO team looks forward to meeting you at productronica in hall A4, stand 578.
NASHVILLE – KYZEN is proud to announce the addition of Beth Bivins as Global Key Accounts Manager for Solvents.
“Beth comes to KYZEN with many tools in the toolbox and years of cleaning experience,” said Erik Miller, KYZEN Vice President of Sales regarding the hire of Bivins.
Bivins joins the KYZEN Clean Team, bringing with her more than 35 years of cleaning experience in the aerospace, medical device, and electronics manufacturing industries. She holds a bachelor’s degree in chemistry from Purdue University.
Bivins’ wealth of knowledge adds to KYZEN’s team of experts working to boost the company’s growing solvent business. She recently worked with 3M in the company’s fluorochemicals business, Univar, where she sold ingredients and chemicals to customers in the food industry. She also previously worked at Petroferm where she developed patented cleaning products and processes in addition to providing technical support to customers.
“KYZEN gained much respect for Beth while at Petroferm before going to Univar to sell chemicals to the food industry. We are excited and honored to have Beth join the KYZEN team and family,” added Miller.
PHOENIX, AZ, — Entrepix, Inc., a globally recognized expert in CMP and wafer cleaning, and a subsidiary of Amtech Systems, Inc., is pleased to announce the addition of Yann Visintainer to the organization as Business Development Manager, EMEA (Europe, Middle East and Africa).
Yann comes to the role with strong experience in sales leadership for semiconductor capital equipment where he has a proven track record of revenue growth. His expertise covers semiconductor front-end processes including CVD and Etch. In addition to his industry experience Yann holds a masters degree in applied physics from University of Marseille, and a degree in business administration from KEDGE Business School Marseille.
"Yann is a great addition to the Entrepix team," said Jim Mello, General Manager at Entrepix. "His responsibilities include the growth and rollout of our capital equipment offerings to the EMEA regions. In addition, with Yann’s technical background, we will have more chances for direct collaboration with customers the territory – creating even more opportunity," added Mello.
“I chose to work with Entrepix because their model of filling unmet customer needs is a great formula for success,” said Yann Visintainer, Business Development Manager, Europe for Entrepix, Inc. “Entrepix’s products save customers money, increase productivity and process yield. I know our CMP customer base will be open to these solutions,” added Visintainer.
In his new role Yann will focus on selling the OnTrak DSS-200 wafer cleaner, and the Entegrity head tester among other offerings from Entrepix. In addition, he will also be supporting the sales of lapping and polishing consumables from Amtech Group company PR Hoffman as well as process chemicals and slurries from Amtech Group company Intersuface Dynamics.
For more information about Entrepix and its products, please visit www.entrepix.com
PORTO, PORTUGAL – Critical Manufacturing is thrilled to announce its participation in productronica 2023, the premier event for electronics production. The event will take place from November 14 to 17, 2023, at the Trade Fair Centre, Messe München. Critical Manufacturing will once again join forces with ASMPT SMT, leveraging this dynamic platform to showcase its modern manufacturing execution systems (MES). The theme "Expect More from Your MES" is meticulously designed to cater to the intricate demands of the electronics and surface mount technology (SMT) industry, paving the way for Industry 4.0 innovations.
MES Excellence Takes Centre Stage
As electronics continue to permeate every aspect of our lives, the demand for electronic components, SMT processing, and PCBs have surged. This flourishing industry presents its own set of unique challenges – dynamic supply chains, fluctuating demands, slimming margins, and the rapid pace of change to product lifecycles. In such a dynamic landscape, a top-tier MES that goes beyond automation is crucial – one that provides comprehensive control and real-time adaptability to steer production under any circumstances.
Going beyond SMT lines
Critical Manufacturing MES is an integral part of the SMT and electronics manufacturing operation management (MOM) system, driving efficiency. It manages the entire factory, improving efficiency and material traceability through adaptable workflows. It customizes quality checks for each product, reducing costs and boosting quality, and also provides advanced analytics for spotting and preventing issues, reducing unplanned downtime, and improving overall equipment efficiency (OEE).
In addition, the Critical Manufacturing MES provides a data platform for simple collection of all machine data and critical data from other systems, while automatically, providing context from the MES system itself. This unique combination provides the capabilities manufacturers need to pursue more advanced Industry 4.0 use cases such as predictive maintenance.
Maximum Flexibility
The essence of Critical Manufacturing MES lies in its adaptability. The modules offered are carefully attuned to the unique demands of the electronics and SMT industry, ensuring a smooth integration into existing workflows. Its architecture accommodates diverse deployment options – on-premises, cloud, or hybrid – allowing manufacturers to tailor the MES to their specific needs.
In addition to the immersive physical booth experience, a virtual tour is being offered. This virtual tour will offer a dynamic and engaging glimpse into the MES features, ensuring that the transformative journey is accessible to everyone, regardless of their ability to be physically present.
As anticipation builds for productronica 2023, Critical Manufacturing invites attendees to experience the next level of electronics manufacturing. Join us at the ASMPT booth A3.377 witness the future of MES and embark on a journey that redefines what's possible. For more information and to book a demo or a meeting, please click here.
Critical Manufacturing is also exhibiting at SEMICON Europa, booth B1351, that is collocated with productronica.
CRANSTON, RI – AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming Advanced Electronics Assembly Conference taking place on November 9, 2023, at the Radisson Blu Beke Hotel in Budapest, Hungary. AIM Technical Application Engineer, Norbert Labai, will present on the topic: Addressing Concerns of Ultra-Miniature Component Assembly: M0201, 008005, and Micro/MiniLEDs.
Norbert Labai has been in the electronics industry for over 20 years. Mr. Labai supports AIM customers throughout Eastern Europe in solving the most challenging technical issues and adopting the latest application technologies. The abstract for his presentation is as follows:
The use of ultra-miniature components is driven by the demand for increased functionality in electronic devices. SMT components such as 008004/M0201 are being used in consumer and automotive applications today. Similarly, MiniLED components are finding their way into displays available in the market. Manufacturers are creating new PCB designs, using novel assembly techniques, and introducing innovative materials to overcome the unique challenges faced when implementing these components. This presentation will discuss how to overcome the challenges faced in ultra-miniature component assembly and address the needs of emerging markets.
Mr. Labai will deliver his presentation at the Advanced Electronics Assembly Conference at 11:15 am on November 9. To learn more about AIM’s products and services, visit www.aimsolder.com