Press Releases
VILLINGEN-SCHWENNINGEN, GERMANY – Kübler US Corp. High Tech Solutions is excited to announce the appointment of Todd Foster of Foster Innovative Technology (FIT) as its newest representative. Serving the strategic regions of Washington, Oregon, and Idaho, Foster's expertise will be instrumental in introducing Arcadia's award- winning products to the Pacific Northwest.
FIT, renowned for its commitment to providing world-class solutions, aligns perfectly with Arcadia's mission of delivering top- tier inventory control and component management systems. The ARCHIMEDE Smart Storage System, celebrated for its space efficiency and cutting-edge technology, is set to transform inventory management with its innovative design and comprehensive features.
Boris Kubler, Managing Director of Kubler US, is spearheading the initiative to bring these groundbreaking products to the American market. "We are thrilled to have Todd join our esteemed network of representatives," says Kubler. "With top reps like Don Dennison in the Northeast, The Murray Percival Company in the Midwest, and SmartSol in Mexico, we're building an unparalleled network to offer these industry-leading solutions at prices well below our competitors."
Todd Foster shares the excitement for this new venture. "The Pacific Northwest's tech industry is vibrant and always seeking innovation. Arcadia's ARCHIMEDE system is exactly the kind of breakthrough that our customers have been waiting for. I'm proud to bring this technology to our market," he stated.
Under the guidance of Boris Kubler, Arcadia continues to expand its reach across North America, ensuring that more industries can benefit from its award-winning products and exceptional technological advancements.
For further information on Kubler US, ARCHADIA SRL and its pioneering inventory control solutions, please visit https://www.arcadiasrl.it/?lang=en
PLYMOUTH, WI – Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce a new partnership with Comtree, a renowned provider of capital equipment solutions in the Canadian Electronics Manufacturing Community. This collaboration aims to strengthen the availability of spare parts for Kurtz Ersa's cutting-edge equipment within Canada.
Teaming up with Kurtz Ersa, Comtree will now stock an extensive range of spare parts at its Mississauga warehouse location. The collaboration ensures that Canadian customers can access a comprehensive inventory of soldering consumables with hundreds of common products readily available in stock.
"At Kurtz Ersa, we are delighted to partner with Comtree, a company with a proven track record of excellence in providing capital equipment solutions. This collaboration reflects our commitment to ensuring that our Canadian customers have swift access to high-quality spare parts, further enhancing their experience with our advanced soldering technology," said Ernie Grice at Kurtz Ersa.
Established in 1995, Comtree has distinguished itself by offering exclusive capital equipment solutions coupled with world-class customer support and after-sales service. Over the years, the company has earned a reputation for providing top-notch capital equipment with an exceptional cost-to-performance ratio, positioning itself as the preferred supplier for such equipment in Canada.
This strategic partnership combines the technical prowess of Kurtz Ersa with Comtree's robust distribution network, offering a seamless solution for Canadian customers seeking reliable spare parts. For spare parts inquiries in Canada, email info@comtreeinc.com or visit www.Comtreeinc.com
For more information about Kurtz Ersa Inc., visit www.ersa.com
KREUZWERTHEIM, GERMANY – SEHO, a worldwide leading manufacturer of complete solutions for soldering processes and automated production lines, is thrilled to present a wide range of THT inspection solutions and soldering systems at the IPC APEX Expo 2024 in Anaheim. The machines are designed to increase productivity in electronics production and take users a further step towards zero-defect manufacturing. SEHO looks forward to welcoming visitors to booth #1034.
With the PowerVision, SEHO focusses on two key points in the manufacturing of THT assemblies: Continuous quality assurance and cost-efficient production processes. SEHO PowerVision stands for fast, automated, optical inspection, and it is particularly designed for THT processes. It reliably detects typical soldering defects such as incomplete solder joints, solder bridges or solder balls. Additionally, the system is capable of reading and processing product ID’s.
The stand-alone variant of SEHO PowerVision can be flexibly integrated into each fully automated production line. Moreover, the AOI system can be directly integrated in many of SEHO’s selective soldering systems, thus providing additional benefits, particularly in terms of floor space and board handling costs.
Generation of test plans is performed easily and conveniently at any PC using an offline teach program. An easy-to-use assistant guides the operator through the programming process. The comprehensive and individually expandable component library, as well as an automatic inspection search simplify programming. Even optimization of a test plan, which usually requires temporary interruption of the production to adjust parameters, can be made offline. Thus, the AOI system is permanently available for production.
The database supported PowerVision software provides analyzing tools that enable fast and efficient optimization of the entire manufacturing process. These tools include a heatmap that visualizes error frequencies based on their geometrical location on the PCB and a trend analysis that effectively supports optimization of the test program.
Detected defects can easily and quickly be classified using the intuitive interface of the SEHOverify software. Based on this classification of the test results, different statistical key figures such as first pass yield, false call rates or defect rates can be calculated and graphically displayed.
Maximum ROI is achieved by combining SEHO PowerVision with SEHO AssemblyCheck, a component placement control system optimized specifically for THT assemblies.
Both systems can be integrated in just one module that is installed in front of the soldering system. At the assembling transport level, AssemblyCheck checks for correct component placement. After the soldering process, SEHO PowerVision carries out the solder joint inspection at the return conveyor level of the module.
The benefits are obvious: Early identification of defects allows a fast increase of the overall manufacturing quality. Simultaneously, production costs can be sustainably reduced.
Take a sneak-peak in further highlights at the SEHO booth:
SEHO AssemblyCheck, the latest addition to SEHO’s range of inspection systems, integrated as component placement control system in a typical workstation. THT components are often assembled manually or semi-automatically, so the risk of errors is correspondingly high. AssemblyCheck provides immediate feedback whether the components are assembled correctly. Only then can the circuit board be released for further processing in a wave or selective soldering system. This eliminates possible errors, which leads to a significant increase in quality and yield.
Typical inspection tasks include the presence of the correct components, correct orientation or polarity, component colours are recognized and compared, text verification (OCV) and code reading. Circuit boards with a bad mark marking are automatically recognized and not checked.
Short cycle times and an assembly size of up to 24” x 20” [610 x 510 mm] guarantee high system efficiency.
SelectLine-C, SEHO’s modular and expandable inline selective soldering system, has been supplemented with additional modules that significantly increase the flexibility of the system and ensure higher productivity. A highlight of this machine is the award-winning SmartSplit function, which turns an already efficient system into a highly flexible and highly productive selective soldering system for high-mix-high-volume production. SmartSplit controls and coordinates the process flow for different assemblies in mixed operation. The soldering process for an assembly is automatically divided among the process stations available in the respective system. Up to 6 soldering units can be integrated in one system. As a result, SmartSplit enables cycle times to be halved in mixed operation, without major investments and without restricting the maximum available working area of the system.
The PowerWave wave soldering system offers a remarkable performance at simultaneously low investment costs. The system has been designed for medium to large production series. Complex mixed boards are just as reliably soldered as conventional through-hole assemblies – due to modern solder nozzle geometries, a flexible preheat area, and an open-ended control unit ensuring easy operation, and many functions for automated process control.
The modular construction of SEHO PowerWave offers the ideal concept for all production requirements and allows the machine to be integrated into any fully automated manufacturing line.
Cranston, Rhode Island USA – AIM Solder, a global leader in solder assembly materials, proudly announces the expansion of its patent for the innovative REL22™ lead-free solder alloy to Mexico. The patent extension represents a pivotal step in AIM Solder's mission to offer the most innovative and reliable product solutions.
The award-winning REL22™ alloy, known for its enhanced durability and superior performance, is specifically designed to meet the rigorous demands of harsh environments such as those found in the automotive, aerospace, and geographical exploration sectors.
Key Features of REL22™:
- Enhanced durability for use in extremely harsh environments
- Reliability equal to Sn/Ag/Bi/Sb/Ni/Cu alloys, but with a wider assembly process window
- High reliability and strength with improved thermal cycling performance
- Superior wetting capabilities versus all low/no-silver alloys
"With the patent expansion of REL22™ to Mexico, AIM Solder solidifies its position as a market leader in providing robust and reliable soldering solutions on a global scale," said Tim O’Neill, Director of Product Management at AIM Solder. "This milestone not only reflects our unwavering commitment to quality and innovation but also reinforces our dedication to meeting the evolving needs of the electronics industry."
AIM Solder's REL22™ is available in various forms, including bar, wire, and paste, to accommodate diverse manufacturing requirements. For more information about REL22™ and other innovative solutions from AIM Solder, please visit www.aimsolder.com.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service, and training. For more information about AIM’s complete line of advanced solder products and global technical services, please visit www.aimsolder.com.
WASHINGTON – February 7, 2024 – In a letter signed by 54 microelectronics executives, IPC and the Printed Circuit Board Association of America (PCBAA) are calling on Congress to fully fund the Defense Production Act Purchases Account at the House-passed level of $618 million and $1.08 billion for the Industrial Base Analysis and Sustainment program.
These funding sources are crucial to restore American leadership in the strategically vital printed circuit board (PCB) industry. The United States currently produces only four percent of the world’s supply compared to 30 percent at the turn of the century. PCBs are central to all electronics across all industries including defense, healthcare, telecommunications, aviation, and automotive.
The semiconductors funded by the CHIPS and Science Act gain functionality through their placement on PCBs. As chips have increased in sophistication, so too have the PCBs upon which they are placed. U.S. armed forces depend on PCBs found in everything from night vision goggles and drones to avionics and satellites.
“Semiconductor chips are powerful examples of modern innovation, but they require an electronic system to operate,” said John W. Mitchell, IPC president and CEO. “Chips have no functionality until they are packaged and placed on PCBs by electronics manufacturers who assemble systems. IPC and our member companies urge Congress to reinvigorate a domestic PCB industry that is critical to U.S. industrial resiliency, economic competitiveness, and national security.”
“America’s leadership in microelectronics has implications for our national and economic security,” said PCBAA Chairman Travis Kelly, “As they did with the CHIPS Act, Congress must invest in American printed circuit boards.”
For years, experts inside and outside of government have warned that the Department of Defense’s (DOD’s) reliance on a long and vulnerable supply chain creates unacceptable risk.
- 2017: The Department of Commerce Bureau of Industry and Security issued a warning to DOD regarding the health of the PCB industry
- 2018: The White House recommended that the DOD expand direct investment in the lower tier of the industrial base.
- 2022: The Departments of Commerce and Homeland Security warned of serious risks because of the lack of PCB manufacturing and recommended investment incentives and funding of Title III of the Defense Production Act.
- 2023: The House Select Committee on the United States Competition with the Chinese Communist Party recommended financial assistance programs for American PCB manufacturing and research. This was the first of 150 recommendations in their report.
- 2024: The Department of Defense named microelectronics as a key area of risk for the defense industrial base.
For the full text of the letter, please visit https://emails.ipc.org/links/IPC-IndustryLetter_FY24Appropriations.pdf
PCB East, the electronics industry’s East Coast conference and trade show. Coming June 4-7 to the Boston suburbs. pcbeast.com
CLINTON, NY – As one of the leading materials providers to the power electronics assembly industry, three Indium Corporation team members will share their insights and knowledge on a variety of industry-related topics throughout APEC 2024, February 25-29, in Long Beach, CA.
- Tuesday, February 27
- 1:30 p.m. – 2:00 p.m. PST
- Power Module Package-Attach Materials Technology by Product Manager – ESM/Power Electronics Joe Hertline
- Hertline will explore new innovations and trends in power module package-attach materials technology, including a novel Pb-free alloy that enables lower processing temperatures in preform soldering compared to SAC alloys. This alloy prevents warpage in package-cooler attach scenarios without sacrificing reliability like traditional bismuth-containing low-temperature alloys. Sintering applications and thermal interface materials trends will also be discussed.
- 1:30 p.m. – 2:00 p.m. PST
- Thursday, February 29
- 2:45 p.m. – 3:10 p.m. PST
- Material Considerations for Next Generation EV Inverter Architectures by Strategic Advisor Dongkai Shangguan
- Dr. Shangguan will focus on the unique challenges posed by 800V inverter architecture, a field growing in complexity with the increasing size of power electronics. Key issues will include design considerations, thermal management, and the selection of suitable materials. Particular emphasis is placed on the problems of warpage and delamination, which present notable manufacturing challenges and have critical implications for the reliability and safety of end-products.
- 2:50 p.m. – 3:10 p.m. PST
- Low-Temperature Pb-Free Solder Preform Technology for Molded Power Module Package Attach Designed for Improved Thermomechanical Performance by Senior Applications Development Engineer Ryan Mayberry
- Mayberry will examine a low-temperature Pb-free soldering solution for high-power density power electronics, addressing the trade-off between cost, complexity, and performance in thermal management/mechanical attach solutions for power modules. The proposed SAC-In alloy solution, in a solder preform configuration, has reflow temperatures below industry standard lead-free and high-temperature solders. It serves as a drop-in replacement, offering improved thermal performance compared to organic-based thermal management solutions, while mitigating risks of component damage, material stress, and reducing energy consumption with a peak reflow temperature below ~215°C. The Bi-free alloy also demonstrates robust lifecycle performance comparable to standard Pb-free alloys in thermal shock testing at -40°C/+125°C.
- 2:45 p.m. – 3:10 p.m. PST
Hertline is responsible for driving the growth of the power electronics product line through development and implementation of marketing strategies supported by customer experience, emerging technologies, and industry feedback. Hertline also collaborates with Indium Corporation's sales, technical support, R&D, production, and quality teams to serve existing customers and grow new business in his designated market. He earned a bachelor’s degree in mechanical engineering and an MBA from Clarkson University and is a Certified SMT Process Engineer (CSMTPE).
Dr. Shangguan is a Strategic Advisor to Indium Corporation. In this role, he works on specific trends related to the advanced semiconductor packaging and SMT industries, and applies his significant industry experience to supporting customers. Dr. Shangguan is an IEEE Fellow and IMAPS Fellow, and has served on the boards of directors for several professional organizations and industry associations, including IPC, IEEE EPS, and iNEMI. He also serves as a Distinguished Lecturer for IEEE EPS. He has been honored with some of the industry’s most prestigious awards, including IPC’s President’s Award, the Society of Manufacturing Engineers’ (SME) Total Excellence in Electronics Manufacturing Award, the Electronics Manufacturing Technology Award and the Outstanding Sustained Technical Contribution Award from IEEE EPS, and the William D. Ashman Achievement Award from IMAPS, among others. Dr. Shangguan received a bachelor’s degree in mechanical engineering from Tsinghua University, China, an MBA from San Jose State University, Calif., and a Ph.D. in materials from the University of Oxford, U.K. He has held postdoctoral positions at the University of Cambridge, U.K., and the University of Alabama, and has served as a guest professor at several universities. Dr. Shangguan has published three books, more than 200 scientific papers and technical articles, and has given numerous presentations to share knowledge and expertise with the industry. He is the inventor/co-inventor of 33 U.S. patents and several foreign patents.
Mayberry is responsible for generating test strategies, data sets, and application guidelines for Indium Corporation’s Engineered Solder Materials (ESM) product line. He collaborates with sales, R&D, operations, and quality departments as a subject matter expert to enable key pursuits in the power electronics and thermal market segments by developing process recommendations and supporting new product qualifications for a successful customer experience. Mayberry holds a bachelor’s degree in materials science and engineering from Rutgers University, N.J. He is a Certified SMT Process Engineer (CSMTPE) and is certified as a Lean Six Sigma Green Belt.
To learn more about Indium Corporation’s innovative products for EV and power electronics, visit us at booth #752 at APEC or online at indium.com.
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