WALTHAM, MA – Essemtec is excited to exhibit at the SMTA International Expo, happening October 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois. We invite you to visit us at Booth 2959 for live demonstrations of our latest technologies, including our innovative reballing solutions, the all-new Tarantula Underfill system, and the Fox all-in-one machine featuring the new Integrated Inspection System (I2S).

Fox All-in-One Machine:

Experience the Fox all-in-one machine’s impressive versatility and efficiency. This compact powerhouse integrates the Integrated Inspection System (I2S) 2D AOI and 2D SPI capabilities, offering comprehensive inspection and quality control in a single platform. Designed for high-mix production, the Fox supports up to 200 feeder lanes and fits perfectly in space- constrained production areas.

New Tarantula Underfill System:

Discover the Tarantula Underfill system, engineered to deliver superior underfill solutions for a variety of applications. This system enhances reliability and protection for electronic components, especially in high- stress environments. With its non-contact heating capability and adaptability for double-sided populated boards, the Tarantula handles various PCB sizes (up to 560x610mm) and dispensing needs, including solder paste jetting, SMT glue dispensing, LED encapsulation, epoxy dispensing, and more.

Live Demonstrations:

Reballing Solutions:

Watch our advanced reballing technology in action. Our demonstration will cover:

• Flux Paste Dispensing: Accurate dispensing of soldering flux is crucial for successful reballing.
• Solder Ball Placement: See how our specialized equipment applies solder balls precisely in one go with the flux dispensing, ensuring optimal connections and functionality.

Integrated Inspection System: I2S

See the I2S in action within our Pick-and-Place and Dispensing solutions. This system inspects dispensed and jetted materials, as well as placed SMT components, ensuring only high-quality products enter the reflow ovens. It also features an automated repair function and is already in use at various production sites.

Join us at Booth 2841 during SMTA International to explore these cutting-edge solutions and witness Essemtec’s commitment to advancing SMT technology.

AUSTIN, TX – ROCKA Solutions is excited to announce its first-time participating in SMTA International 2024, taking place at the Donald E. Stephens Convention Center. Visit ROCKA Solutions at Booth 2947, where they will introduce a fresh exhibit style to the USA tradeshows. The booth will feature live interviews hosted by Justin Worden, in collaboration with WNIE, directly from inside the exhibit.

This innovative setup aims to provide attendees with an engaging and interactive experience. Attendees will have the opportunity to explore ROCKA’s latest offerings and gain insights from live interviews with industry experts.

ROCKA Solutions is once again joining forces with "What's New in Electronics" (WNIE) to bring live interviews to SMTA International. These interviews will provide insights and expert commentary on the latest trends and innovations in the electronics manufacturing industry.

Key highlights at ROCKA's booth will include their renowned ROCKA Manufactured SMT production supplies, known for their quality, reliability and performance. Visitors will have the opportunity to explore ROCKA's product portfolio and discover innovative solutions.

Be sure to stop by Booth 2947 at the SMTA International to experience a booth unlike anything in the history of trade shows and discover how ROCKA Solutions is setting new standards in the industry.

For more information about ROCKA Solutions, Visit www.rockasolutions.com 

PLYMOUTH, WI – Kurtz Ersa Inc., a leading supplier of electronics production equipment, is pleased to announce plans to exhibit at SMTA International 2024, taking place Oct. 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois. The company will showcase the advanced capabilities of the HR 600 XL rework system in Booth 3029.

The Ersa HR 600 XL is engineered for professional rework of BTC components on large board assemblies. Its impressive heating area of 24.6 x 24.6 inches and fixturing of PCB’s up to 10 mm thick make it ideal for rework in multiple business segments such as military, aerospace, telecommunication, network, and infrastructure.

Key features of the HR 600 XL include:

• Bottom-Side IR Matrix Heater™: The 15-kW heater consists of 25 individually controllable heating elements, allowing for precise heat distribution tailored to each specific application.
• Hybrid Heating Head: A highly efficient 2,800 W heating head ensures Ersa-quality desoldering or installation of components, from chip resistors to 120 x 150 mm BGAs or sockets.
• Auto Scavenger: Non-contact residual solder removal can automatically occur immediately following the component removal without adding an additional heat cycle to your process.

Visit Kurtz Ersa at Booth 3029 to find out more about the Kurtz Ersa line of reworks systems and discover just how easy rework can be.

For more information about Kurtz Ersa Inc., visit www.ersa.com 

OXFORD, CT – MIRTEC, ‘The Global Leader in Inspection Technology’, is excited to announce its participation in the highly anticipated SMTA International 2024, scheduled to take place Oct. 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois. MIRTEC will proudly showcase its groundbreaking MV-6 OMNI 3D AOI Series featuring the exclusive OMNI- VISION ® 3D Inspection Technology in Booth #2834.

Leading the Way in Innovation

MIRTEC will display its Award-Winning MV-6 OMNI 3D AOI Series at the SMTAI 2024. The MV-6 OMNI series features MIRTEC’s state-of-the-art OMNI-VISION ® 3D Inspection Technology, which combines either a 15MP or 25MP CoaXPress Camera with MIRTEC's revolutionary Digital 12 Projection BLUE Moiré 3D Technology. This innovative combination delivers unparalleled accuracy and performance.

Precision and Performance through Proprietary Technology

The proprietary Ultra-High Resolution CoaXPress Vision System, meticulously designed and manufactured by MIRTEC, stands as the cornerstone of the company's 3D inspection systems. Powered by MIRTEC's Digital 12 Projection Digital BLUE Moiré Technology, the MV-6 OMNI machines offer true 3D inspection, providing precise height measurement data crucial in detecting lifted component and lifted lead defects, as well as post-reflow solder volume. The fully equipped MV-6 OMNI machines are configured with four 10MP or 18MP Side-View Cameras, a 15MP or 25MP CoaXPress Top-Down Camera, a Multi-Focus Programmable Z-Axis System, an Internal PCB Flipper Conveyor, and Multi-Function AOI/SPI Fusion Technology.

Empowering the Future with AI

MIRTEC’s INTELLI-PRO Smart Factory Automation Solution, is an AI based Software Suite specifically designed for the purpose of improving the performance and convenience of MIRTEC’s complete line of AOI machines. INTELLI-PRO consists of a proprietary Deep Learning Based Automatic Part Search and Teaching function, and AI based; Automatic Parameter Optimization, Character Recognition (OCR), Foreign Object Detection (FOD), Placement Inspection Algorithms and an Automatic Defect Type Classification function.

"We look forward to showcasing our Leading-Edge Inspection Solution at this year’s SMTAI Exhibition,” stated Brian D'Amico, President of MIRTEC’s North American Sales and Service Division. “We invite attendees to join us at this upcoming event to experience the future of Inspection Technology first-hand and to explore how MIRTEC can help them to achieve the highest levels of Quality, Efficiency and Profitability."