CHATSWORTH, CA – NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is proud to announce the expansion of its microelectronics clean room and assembly line. This strategic move relocates these operations adjacent to the PCBA SMT assembly area, enabling NEOTech to more efficiently automate production and better meet the growing demand for mixed PCBA and microelectronics assembly.

NEOTech, already recognized as an industry leader in SMT electronics manufacturing, stands at the forefront of high-tech microelectronics assembly. This expansion represents a significant investment of time, effort, and innovation, allowing NEOTech to stand apart from its competition. Few competitors have the high-speed automated assembly equipment required to achieve true mixed electronics assembly manufacturing. This key manufacturing differentiator means that NEOTech can seamlessly place chip-and-wire electronics side-by-side with SMT components on traditional PCBA assemblies — a capability that few in the industry can match.

“We are pleased to have made this investment, enabling NEOTech to meet the industry’s demand for low-cost microelectronics through our automated, mixed electronics manufacturing,” said Jim Doyle, Chief Executive Officer of NEOTech’s Aerospace & Defense Business. “At NEOTech, we are always actively engaged with our customers to fully understand their manufacturing needs and are committed to continuous internal improvements that ultimately enhance quality, boost efficiency, and reduce costs. I am incredibly proud of both our Microelectronics and SMT teams for their dedication in identifying this improvement and successfully implementing it. This advancement allows us to continue providing creative solutions to meet our customers’ unique product requirements.”

NEOTech stands out for its extensive capabilities and exceptional service offerings, catering to diverse industries including aerospace/defense, medical devices, industrial, and high-tech sectors. With a focus on delivering high-quality products and solutions, NEOTech has established itself as a trusted partner for complex and mission-critical electronic manufacturing needs.

The company’s state-of-the-art facilities and advanced manufacturing technologies ensure precision and reliability in every product delivered. NEOTech’s robust quality management systems, including ISO 9001:2015, ISO 13485:2016, and AS9100 certifications, reflect its commitment to delivering the highest quality.

NEOTech’s customer-centric approach is a cornerstone of its success. The company’s comprehensive range of services, from design and prototyping to production and after-market support, is tailored to meet the unique requirements of each customer. NEOTech’s ability to provide customized solutions, coupled with its focus on reducing time-to-market and optimizing costs, has earned it a reputation for delivering exceptional value.

With more than 40 years of heritage in electronics manufacturing, NEOTech specializes in high- reliability programs in the aerospace/defense industry, medical products, and high-tech industrial markets. NEOTech is well recognized as a premier EMS provider with in-depth experience manufacturing high-tech products and managing stringent US government requirements. For more information about NEOTech’s Microelectronics manufacturing capabilities, please visit www.NEOTech.com/microelectronics 

CLINTON, NY – As a proven leader in innovative materials solutions for future-forward technologies, Indium Corporation will proudly showcase its heterogeneous integration and assembly (HIA) products and thermal interface materials (TIMs), that are driving AI advancements, at SEMICON Taiwan, September 4-6, in Taipei, Taiwan.

Indium Corporation’s SiPaste® series is specifically designed for fine-feature printing, with fine powders ranging from Type 5 to Type 8. They help Avoid the Void®, reduce slumping, and demonstrate consistent superior printing performance. Indium Corporation’s SiPaste® C312HF is a new formulation offering the same excellent printing performance and material stability over time, with the benefit of having an easily cleanable chemistry with semi-aqueous or saponifier technology.

Indium Corporation’s Heat-Spring® solutions, ideal for TIM2 applications, is a compressible, non-reflow metal TIM. These indium-containing TIMs offer superior thermal conductivity over non-metals—with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to Indium Corporation’s reclaim and recycle program.

The GalliTHERM® portfolio of gallium-based liquid metal solutions draws on Indium Corporation’s more than 60 years of experience manufacturing gallium-based liquid metals. These liquid metal TIMs are designed for both TIM1 and TIM2 applications. Liquid metal TIMs offer:

• High thermal conductivity for end-product longevity and reliability
• Low interfacial resistance against most surfaces, ensuring rapid heat dissipation
• Extraordinary wetting ability on both metallic and non-metallic surfaces

To learn more about how Indium Corporation’s HIA and TIM products are helping to drive the AI revolution, visit our experts at booth #L0330 at SEMICON Taiwan.

MILWAUKIE, OR – ECD and its partner Maxim SMT Technologies today announced plans to showcase the latest soldering process control technology from stand H15.E15 at Productronica India 2024 to be held at the India Expo Mart ( IEML ), Greater Noida, India from September 11-23, 2024.

The electronics manufacturing sector in India has seen rapid growth in recent years as significant investment accelerates and numerous multinationals continue shifting production capacity to the region. Ensuring operators are adequately trained and production processes refined will be challenging given the pace of growth. As new sites scale up to meet demand, tools like ECD’s soldering control portfolio can play a key role in improving productivity, reducing operator training requirements, and ensuring high-quality yields.

ECD’s latest innovation, the M.O.L.E.® EV touchscreen thermal profiler platform, allows reflow soldering profile viewing on the production line. This capability saves time, simplifies profiling routines, and helps operators at all skill levels perform vital product profiling tasks with confidence and ease. Available in 6-, 12-, and 20-channel models, M.O.L.E. EV delivers handheld, lineside access to calculation templates, KPI tables, thermal profiles, and pass/fail results. Eliminating the requirement for offline PC viewing allows corrective actions to be managed immediately, improving productivity and ensuring timely quality outputs. The six-channel M.O.L.E. EV6 also integrates with ECD’s machine quality management pallets – OvenRIDER®, WaveRIDER®, and SelectiveRIDER® -- to verify soldering equipment performance. These technologies, along with ECD’s V-M.O.L.E. 2 four-channel thermal profiler, will be demonstrated at Maxim SMT stand H15.E15 during Productronica India 2024.

“India’s expanding electronics manufacturing sector is a promising and exciting development,” says Mark Waterman, ECD Electronics Division Manager. “The soldering process is where defects often surface, so ensuring tight process control and leveraging operator-friendly tools can dramatically improve quality and yield. We look forward to sharing the latest profiling technology with electronics manufacturers serving the Indian market.”

To learn more about ECD’s complete range of M.O.L.E., SmartDRY, continuous monitoring, and machine quality management technologies, visit www.ecd.com 

MANASSAS, VA – ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions in the electronics manufacturing and semiconductor industries, is pleased to announce an upcoming webinar titled “Surface Reliability: Overcoming Challenges in SMT PCB Manufacturing and Determining Root Causes for Improved Performance.” The webinar will occur on September 5, 2024, at 2:00 PM EDT. It will provide attendees with the tools and insights needed to optimize their manufacturing processes, enhance product quality, and maintain a competitive edge in the market.

Dr. Denis Barbini, Technical Solutions Manager at ZESTRON, is a distinguished expert in the electronics manufacturing industry and will lead this informative session. As the electronics industry continues to evolve, ensuring the reliability and performance of SMT PCBs is paramount. Join Dr. Barbini as he investigates the critical factors affecting surface reliability in SMT manufacturing and gain valuable insights into overcoming these factors and optimizing processes to ensure optimal performance.

To register for this free webinar, please visit our registration page.