CARLSBAD, CA – Nordson ELECTRONICS SOLUTIONS, a global leader in electronics manufacturing technologies, will showcase exciting, new products for conformal coating, precision fluid dispensing, and selective soldering at Productronica, the world’s leading trade fair for electronics development and production, in Munich, Germany, November 14-17, 2023.

Nordson ELECTRONICS SOLUTIONS joins their longstanding distribution partners in five booths across the trade fair to exhibit the latest tools with technical experts ready to discuss customer needs. Equipment will be on display in stands A2.532, Amtest Group, and A2.540, smartTec Gmbh, and includes the following:

• The NEW ASYMTEK Select Coat® SL-1040 Conformal Coating System: Our most advanced conformal coating system, just introduced. The Select Coat SL-1040 pairs new process control and preventive maintenance features with the new SC-450 PreciseCoat® Jet to deliver next-level conformal coating solutions for high-volume production.
• The revolutionary SELECT Synchro™ 5 Selective Soldering System: Using ground-breaking synchronous motion technology (patent pending), the conveyance time is dramatically reduced and throughput is boosted by 20-40% for most applications. The award-winning SELECT Synchro 5 system processes up to seven printed circuit boards simultaneously using different alloys (leaded and lead-free) and nozzles or one fixed nozzle for all your products. Non-stop selective soldering delivers results.
• The powerful ASYMTEK Forte® Series Automated Fluid Dispensing System: Next-generation and time-tested capabilities are combined in the Forte Series to increase productivity by up to 50%, when dispensing underfills, encapsulants, sealants, and precise coating. The system is ideal to tackle high-volume PCB, EMA, flexible circuit, and MEMs applications, especially when equipped with the contact .

All the partners for Nordson ELECTRONICS SOLUTIONS at Productronica 2023 include:

• Amtest Group, Stand A2.532
• smartTec Gmbh, Stand A2.540
• IEMME SpA, Stand A3.302
• Scanditron Sverige AB, Stand A3.118
• SMT Europe, Stand A2.502.

Contact your local representative to schedule an appointment, or contact Nordson Electronics Solutions to find one near you. Visit the website to learn more: www.nordson.com/electronics 

AUBURN HILLS, MI – The Murray Percival Company, the award-winning leading supplier to the Midwest’s electronics industry, is proud to announce their representation of American Beauty, an esteemed manufacturer of heavy-duty soldering irons and related equipment. This collaboration is a significant step forward in expanding Murray Percival's comprehensive solutions for its valued customers.

Mark Percival, MARCOM Manager at The Murray Percival Company, expressed enthusiasm about this partnership: "We are excited to represent American Beauty products, particularly their small solder pots and resistance soldering systems. American Beauty has a long-standing reputation for quality and performance. We believe that this partnership aligns with our vision of helping our customers improve their processes, maximize their return on investment, and achieve success in an increasingly competitive industry."

American Beauty heavy-duty soldering irons are designed to tackle big soldering jobs and excel in production-line environments. They are known for delivering exceptional heat, ensuring superior solder joints. With a history dating back to 1894, American Beauty has gained a loyal following in the industry, thanks to its commitment to producing tools that offer unparalleled heat and performance.

Murray Percival, a family-owned business now in its third generation, has been serving the PCB industry for more than 60 years. Their comprehensive offering of assembly equipment and production supplies positions them as a leading supplier to the electronics industry in the Midwest. The company provides legendary service, improving processes, maximizing ROIs, and exceeding customer expectations.

This partnership between The Murray Percival Company and American Beauty strengthens their collective ability to offer customers top-quality soldering solutions that meet the demands of modern electronics manufacturing. Both companies share the core value of enhancing customer success through innovative and high-performance products.

For more information about The Murray Percival Company and its commitment to delivering value and solutions to customers, please visit www.murraypercival.com

NEW DELHI – The Union Cabinet chaired by Prime Minister Shri Narendra Modi was apprised of a Memorandum of Cooperation (MoC) signed in July, 2023 between the Ministry of Electronics and Information Technology of the Republic of India and the Ministry of Economy, Trade and Industry of Japan on Japan-India Semiconductor Supply Chain Partnership.

The MoC intends to strengthen cooperation between India and Japan towards enhancement of semiconductor supply chain, recognizing the importance of semiconductor for the advancement of industries and digital technologies.

The MoC shall come into effect from the date of signature of the Parties and shall be remain in force for a period of five years.

Both G2G and B2B bilateral Cooperation on opportunities to advance resilient semiconductor supply chain and leverage complementary strengths.

MoC envisages improved collaboration leading to employment opportunities in the field of IT.

Background:

MeitY has been actively working to create a conducive environment for electronics manufacturing. Programme for Development of Semiconductor and Display Manufacturing Ecosystem in India was introduced with a view to ensure the development of a robust and sustainable semiconductor and display ecosystem in India. The said program aims to extend fiscal support for establishment the Semiconductor Fabs, Display Fabs, Fabs for Compound Semiconductors/Silicon Photonics/Sensors/Discrete Semiconductors and Semiconductor Assembly, Testing, Marking, and Packaging (ATMP)/Outsourced Semiconductor Assembly and Test (OSAT) facilities. Further, India Semiconductor Mission (ISM) has been established under Digital India Corporation (DIC) to drive India's strategies for development of semiconductor and display manufacturing ecosystem in the country.

MeitY has also been mandated to promote international cooperation in the emerging and frontier areas of Information Technology under bilateral and regional frameworks. With this objective, MeitY has entered into MoUs/MoCs/Agreements with counterpart organizations/agencies of various countries to promote bilateral cooperation and exchange of information and also to ensure supply chain resilience enabling India emerge as trusted partner. Enhancing mutual collaboration between Japan and Indian companies through this MoU is a another such step towards mutually beneficial semiconductor related business opportunities and partnerships between India & Japan.

In view of synergies and complementarities between the two nations, "India-Japan Digital Partnership" (IJDP) was launched during the visit of PM Modi to Japan in October 2018 furthering existing areas of cooperation as well as new initiatives within the scope of cooperation in S&T/ICT, focusing more on "Digital ICT Technologies". Based on the ongoing IJDP and India-Japan Industrial Competitiveness Partnership (IJICP), this MoC on Japan-India Semiconductor Supply Chain Partnership would further broaden and deepen the cooperation in the field of electronics ecosystem. Recognizing the importance of semiconductor for the advancement of industries and digital technologies, this MoC would provide for the enhancement of semiconductor supply chain resilience.

REDDITCH, UK – Altus Group, a leading distributor of electronics assembly equipment in the UK and Ireland, is enabling manufacturers to adopt advanced semiconductor packaging techniques with Koh Young's Meister D automated optical inspection (AOI) systems.

As electronics devices demand increasingly sophisticated functionality, they rely on advanced packaging methods such as System-in-Package (SiP), Fan-out wafer-level packaging (FOWLP), and 3D stacking to integrate components in less space while increasing density. However, these innovative configurations also create new inspection challenges. Traditional 2D AOI systems struggle to reliably detect microscopic defects on miniaturised parts.

The Meister D series from Koh Young delivers unprecedented production-speed 3D inspection capabilities tailored for these challenges. This advanced AOI system combines high-resolution 3D measurement with AI-powered defect analysis for precision results. With 25-megapixel camera and 3.5m-micron resolution, it can accurately inspect tiny components down to 0201 metrics, highly reflective and shiny die surfaces, and gaps down to 50 μm to identify micro cracks, chipping and foreign material.

Anthony Oh, Technical Applications Manager at Altus Group, said: "In an era where electronics devices demand increasingly sophisticated functionality and miniaturisation is the norm, the Meister D exceptional true 3D inspection capabilities provide our customers with the precision they need for advanced semiconductor packages. By adopting this cutting-edge AOI, manufacturers gain the process control to confidently implement new techniques that not only enhance their products but also help make devices smarter and more compact."

The Meister D eight-projector inspection probe provides images from different angles to build a complete 3D profile, overcoming issues like shadowing and compensating for reflective surfaces. The 3D data also enables height and tilt measurement for components, critical for inspection. All these capabilities deliver repeatable, autonomous defect identification, providing significant advantages over traditional 2D AOI.

In addition to the Meister D, Altus also offers the Meister D+ with extra optics innovations designed for highly reflective components. By providing the full Meister series, Altus Group ensures that manufacturers in the UK and Ireland have access to world-class inspection tools tailored for the latest assembly advances.

For more information about the Meister D series and its pioneering capabilities in semiconductor packaging inspection, please visit www.altusgroup.co.uk