Austin, TX – February 2024 – Austin American Technology (AAT) proudly announces the appointment of Todd Rountree as Chief Executive Officer (CEO). With nearly 8 years of dedicated service as President and COO, Rountree brings a wealth of experience and a proven track record of leadership to his new role.

During his tenure as President and COO, Rountree has been instrumental in driving the growth and success of Austin American Technology, as well as orchestrating the recent merger with Aqua Klean Systems. He has demonstrated exceptional leadership in overseeing all aspects of the business, including profit and loss management, cash flow management, sales, marketing, operations, and manufacturing. Rountree's strategic vision and hands-on approach have been pivotal in expanding AAT's market presence both nationally and internationally.

"I am honored to take on the role of CEO at Austin American Technology," said Todd Rountree. "Over the past eight years, I have had the privilege of working alongside a talented team dedicated to delivering cutting-edge cleaning solutions to our customers. I am excited to continue building on AAT's legacy of innovation as we strive to meet the evolving needs of the electronics manufacturing industry."

Under Rountree's leadership, Austin American Technology has solidified its position as an industry leader in modern cleaning technology. With a history spanning 37 years, AAT has established itself as a trusted provider of high-quality circuit board cleaning tools, including high-production inline cleaners, batch style cleaners, stencil cleaners, and solvent cleaners with ROSE testing capabilities. The company's advanced cleaning and drying technology, coupled with several patented systems, set AAT apart as a preferred choice for customers worldwide.

In his new role as CEO, Rountree will continue to oversee AAT's operations, including its facilities in Austin, TX, and Anaheim, CA. He will work closely with the executive team and the Board of Directors to drive innovation, expand market reach, and further enhance customer satisfaction.

For more information about Austin American Technology, please visit www.aat-corp.com.

About Austin American Technology:

Austin American Technology is on the forefront of engineering and manufacturing high performance cleaning system for over 35 years, delivering solutions worldwide. AAT was founded in 1986, as a provider of SMT rework systems and process engineering testing services. In 1988, their focus shifted toward the high-end electronics cleaning segment with the introduction of the world’s first automated stencil cleaner. In 2000, Austin American Technology became a market leader in inline cleaning systems with the introduction of the award-winning HydroJet® series. Patented cleaning and drying technologies were incorporated into an energy and space-efficient format to set new standards for performance and low cost of ownership. Building on this success, AAT introduced the MicroJet® inline flip chip cleaner to provide high volume cleaning capability in a small footprint. In 2013 AAT introduced the world’s smallest most efficient inline cleaner, the NanoJet®.

Effective Feb 7th, 2024, Olivier Clément is appointed Chairman of éolane Group and takes over the entire responsibilities among French and foreign subsidiaries.

Specialized in designing advanced electronic PCBA produced in small, medium, and large series, and their integration into a final product, éolane operates in 13 sites across 3 continents, closely aligned with the needs and markets of our customers.

Our value proposition is based on an expertise that allows us to meet a wide range of needs of industrial players from eight main markets: Defense, Industry, Telecom, Railway, Automotive, Medical, Energy and Aeronautics.

Olivier Clément has +30 years of industrial experience, particularly in railway, automotive and power generation. He has held various responsibilities in operations at Valeo, Alstom Power, General Electric, and more recently as CEO of several industrial small cap companies. Olivier holds a Master's degree in Electrical and Electronics Engineering from CentraleSupélec and a degree in Finance, Marketing & Management from INSEAD.

COLORADO SPRINGS, Colo., Feb. 14, 2024 /PRNewswire/ -- As the Psyche spacecraft, part of NASA's ambitious deep space exploration, completes its crucial 100-day checkout phase, Spectrum Advanced Manufacturing Technologies, a leader in high-reliability circuit card assembly and contract manufacturing, announces its significant role in this milestone. Launched on October 13, 2023, aboard the SpaceX Falcon Heavy rocket, the Psyche mission has successfully deployed its solar arrays and entered the operational phase, thanks in part to Spectrum's high-precision circuit boards.

"Spectrum's circuit boards are at the heart of the Psyche spacecraft's communication systems," says Jeff Gilbert, Chief Operating Officer of Spectrum Advanced Manufacturing Technologies. "Our involvement in this project demonstrates our commitment to advancing space technology. Our products' performance during the critical initial 100 days is a testament to our team's expertise and the reliability of our technology in extreme conditions."

According to NASA, the Psyche mission, managed by Arizona State University and NASA's Jet Propulsion Laboratory (JPL), represents a significant leap in deep space exploration. The spacecraft's journey to the asteroid Psyche will be propelled by an innovative solar electric propulsion system, enhanced by Spectrum's cutting-edge technology. This advancement is critical for the Deep Space Optical Communications (DSOC) experiment, designed to drastically improve long-distance space communication. By employing a near-infrared laser system, the DSOC aims to facilitate swifter transmission rates and substantially greater bandwidth, setting a new standard for sending and receiving data across the vast expanse of space.

Now, with the checkout phase behind, the Psyche spacecraft sets its sights on a Mars gravity assist in 2.5 years, a crucial step in its 5.5-year journey to the asteroid belt. Spectrum's contributions are integral to the success of this mission, highlighting the company's leading role in developing technologies critical for the future of space exploration.

Spectrum has a rich history in aerospace, including projects like the James Webb Space Telescope and the Roman Space Telescope. To learn more about Spectrum and its cutting-edge circuit board technology, visit spectrumamt.com.

About Spectrum Advanced Manufacturing Technologies

Spectrum Advanced Manufacturing Technologies, Inc. (Spectrum AMT) stands as a prominent leader in high-reliability circuit card assembly and contract manufacturing, with over 25 years in the industry. Serving sectors such as Aerospace, Spaceflight, DoD, Medical Devices, and Enterprise and industrial, Spectrum consistently meets high standards and client expectations. Key collaborations include systems for the MK-48 Torpedo, MH-60 SeaHawk Helicopters, and NASA's Dragonfly project. Adhering to principles of precision and "never fail" reliability, Spectrum AMT exemplifies commitment and excellence. Learn more at spectrumamt.com.

NASHVILLE — February 2024 — KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Capital Expo and Tech Forum, scheduled to take place Thursday, March 7, 2024, at Sweeney Barn in Manassas, Virginia. The KYZEN Clean Team will provide expert insight on improving stencil cleaning processes and information about the KYZEN E5631 and E5631J solutions.

KYZEN's stencil cleaning product line, specifically KYZEN E5631 and E5631J, provides cost-effective solutions for offline and understencil cleaning. These products were formulated to address the challenges that a dirty stencil can create as it pertains to productivity, misprints, and yields.

KYZEN E5631 quickly and efficiently cleans all types of raw solder paste flux from stencils and A-side misprints. It is a non-hazardous, biodegradable aqueous solution designed for use at low concentrations and ambient temperature in spray-in-air, understencil, and ultrasonic cleaning systems. KYZEN E5631 is proven compatible with stencil foil, epoxy adhesives, frames, mesh, and the materials comprising stencil cleaning equipment.

KYZEN E5631J is a cost-effective, ready-to-use solution that quickly and efficiently cleans all types of raw solder pastes and cleans uncured adhesives in both online and offline stencil cleaning processes, ensuring every print counts. E5631J has been proven compatible with common stencils, cleaning equipment, and a wide range of printer manufacturers.

Choosing an appropriate stencil cleaning method can be key to improving PCB print quality and process yields. KYZEN is dedicated to assisting in the improvement of these cleaning processes and providing the versatile chemistries to work within them.

For more information, visit www.kyzen.com.

About KYZEN

KYZEN is a global leader in providing environmentally responsible, RoHS compliant precision cleaning chemistries for industries ranging from electronics and advanced packaging to metal finishing and aerospace applications. Since its founding in 1990, KYZEN’s innovative cleaning technologies, scientific expertise and customer support have been repeatedly recognized with the industry’s most prestigious awards. For more information, visit www.kyzen.com.