LAKEVILLE, MN – ITW EAE will be showcasing its latest developments at Productronica, November 14-17 in Munich, Germany. The ITW EAE booth will have MPM, Camalot, Electrovert and Vitronics Soltec Applications Experts on hand as well as Sales and Management to answer questions and offer solutions.

MPM will be presenting live demonstrations of the Edison II ACT (Automated Changeover Technology). This patented innovation technology provides a simple, cost-effective solution for factory automation. It is designed to be easy to use and simple to adopt and requires no additional skills to operate. The solution utilizes an Edison printer with an automated changeover of the solder paste cartridges, support tooling, squeegees, and stencils.

Camalot will be demonstrating their Advanced Tilt and Rotate option on the Prodigy dispensing system. This innovative and patented feature reduces wet out areas and improves capillary flow for underfill by accurately dispensing on the side walls of packages. State-of-the-art rotary actuators provide a fast, high precision, zero backlash mechanism that allows proprietary motion and controls allow articulation of the dispense pump in sub-degree increments for both axes as many times as you need, in other words total flexibility.

Electrovert will feature the new Heavy-Duty Conveyor. The Heavy-Duty Finger Conveyor option being introduced by Electrovert is designed to address the increasing demands of PCB production in terms of throughput capability and process flexibility. Electrovert will also feature the patented Auto Exit Wing which provides automatic adjustment of the laminar wave flow to match the board velocity. To fully optimize the flow dynamics of the laminar wave, the velocity of the PCB needs to equal the flow of the solder over the weir of the exit wing.

Vitronics Soltec will feature ZEVA Selective Soldering solutions with the patented Bridge Prevention Technology acts as a hot nitrogen knife to prevent bridging for small pitch up to 1mm (40mil) pin to pin distance even with longer leads and increased drag speed. This design is only feasible with the design freedom of 3D metal printing technology. Vitronics Soltec will also showcase the new Centurion+ Reflow Oven. The Centurion+ is a robust upgrade to the Centurion designed for heavy solder paste users with unique features that further minimize maintenance and keep the process chamber cleaner.

ITW EAE will also share advancements they have made on interface solutions for Industry 4.0/MES that will lead to improvements in yield, data collection and overall equipment effectiveness.

OXFORD, CT – MIRTEC, the ‘Global Leader in Inspection Technology’, announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World’s leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC’s Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World’s Most Technologically Advanced 3D AOI System!

MIRTEC’s All-New ART Hybrid 3D AOI System is the World’s first 5 Camera (75 Mega Pixel) / 12 Projection 3D AOI System. This Revolutionary Inspection System combines five (5) 15MP CoaXPress Color Cameras with MIRTEC’s exclusive 12 Projection Digital Blue Moiré Technology for Precision 3D Inspection of finished PCB Assemblies. ART stands for ‘Anti-Reflection Technology’, which is the core technology that is applied to this system. As the name suggests, this system is specifically designed to inspect reflective objects, especially solder joints in high-end electronics manufacturing industries such as Automotive Electronics, Aerospace, and Defense. Since 3D inspection standards for these fields are relatively high, other 3D AOI systems equipped with conventional 3D technology struggle to meet these advanced inspection requirements.

The five 15MP Cameras that are applied to the ART system work complementary to one another. If one of the cameras is unable to capture a clear 3D pattern image due to light saturation, caused by the reflective surface of the solder joint or reflected light from adjacent components, the system can still measure the exact height of the object and successfully restore its precise shape using the 3D pattern images captured by the other four 15MP Cameras. This principle is applied to the projectors as well. Thus, the ART system can provide reliable 3D inspection results every time. This capability cannot be achieved by current 3D AOI systems, regardless of whether they are configured with multi-cameras with a single projector or a single camera with multi-projectors. In short, the ART system can inspect solder joints and other reflective surfaces which other 3D AOI systems simply cannot.

“We are very excited to unveil our latest Technologically Advanced 3D AOI System at Productronica 2023,” stated Wilson BJ Kim, President of MIRTEC’s European Sales and Service Division. “In all, MIRTEC will feature a total of six (6) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry. Most of them are equipped with innovative inspection solutions that are being presented for the first time at this show. We are confident that these systems will give the visitors a stunning impression.”

MIRTEC’s Award-Winning MV-9SIP Hybrid 3D Inspection System features our exclusive Hybrid SiP Inspection Technology which combines MIRTEC’s 3D Digital Blue Moiré Projection Technology with a High-Resolution Blue Laser Scanner. MIRTEC’s proprietary 25MP CoaXPress vision system is designed and manufactured by MIRTEC for precise inspection of semiconductor post-process. With the combination of a 25MP 7.7㎛ ultra-high camera and the blue light digital moiré projectors, the MV-9SIP finds defects among densely bonded, micro-sized components such as 0201(㎜) size chip array. The Blue Laser Scanner applied to MV-9SIP was developed to measure objects that have surfaces with extreme optical properties such as high reflectiveness or very low reflectiveness. The core idea of this system is to use different inspection methodologies for each item that has different characteristics in a single platform. For customers who require faster inspection in the SiP manufacturing process, MIRTEC provides a Dual Blue Laser Scanner option. This system is faster than the 3D Digital Blue Moiré System / Blue Laser Scanner configuration, but slightly less accurate.

MIRTEC’s will display two different configurations of our Award-Winning MV-6 OMNI 3D AOI System. Both machines are configured with a 15MP High-Resolution CoaXPress main camera combined with an 18MP Side-View Camera System, and MIRTEC’s exclusive 3D Digital Blue Moiré Projection Technology. New to Productronica, one of these MV-6 OMNI Machines will be configured with a specialized 3D laser scanner attachment at the first stage of the PCB transport system for precision inspection of tall components. In this setting, the MV-6 OMNI is equipped with three (3) stage conveyors, and while the inspection is in action on the second stage of the conveyor, this specialized 3D laser scanner scans a waiting PCB on the first stage. When the PCB is moved to the second (inspection) stage of the conveyor, the MV-6 OMNI doesn’t measure the tall components. Instead, it loads inspection data from the 3D laser scanner on the attachment to reduce the cycle time. If the PCB has lots of tall components higher than 5㎜, the reduction of the cycle time will be dramatic. The other advantage of this system is height measurement capability. This system can inspect up to 75㎜ components in 3D, which is the widest height measurement range on the market. Furthermore, this is possible without Z-axis movement unlike other 3D AOIs, where there is no slow-down of the inspection time.

The second MV-6 OMNI machine is equipped with a CXP-12 data transfer interface, also known as CoaXPress 2.0. The data transfer rate with this system is twice as fast as standard CXP technology resulting in lightning-fast data processing speeds.

MIRTEC’s conformal coating inspection AOI, GENESYS-CC is configured with a 15MP Camera, 15㎛ Precision Telecentric Lens, and 8 Phase Coaxial Color Lighting System that includes two stages of UV lights. 15MP is the highest resolution amongst the conformal coating AOIs in the market. This allows GENESYS-CC to provide more accurate and faster inspection compared to others. GENESYS-CC is also capable of measuring coating thickness from 10㎛ to 1,000㎛. Considering that the recommended thickness of coating in most acrylic and silicon coating materials is within 30㎛ to 70㎛, it is important to measure under 30㎛ thickness. Also, the optional flip conveyor makes double-sided PCB inspection possible without an external flipper.

MIRTEC’s Award-Winning MS-11 3D SPI features our exclusive 15MP or 25MP CoaXPress camera technology, providing enhanced image quality, superior accuracy, and incredibly fast inspection rates. The MS-11 3D SPI is also available with a cost-effective 4MP Camera Link option. These machines use dual projection shadow-free moiré phase shift imaging technology to inspect solder paste depositions on PCBs post screen print for insufficient/excessive solder, shape deformity, a shift of deposition, and bridging. All MIRTEC 3D SPI machines are IPC CFX compliant and feature upstream and downstream Closed-loop feedback. In addition, if MIRTEC’s 3D SPI is connected to MIRTEC’s 3D AOI system, a new function called ‘Quick Tracker’ is available. This function allows users to check SPI inspection results with 3D images from linked AOI’s GUI.

MIRTEC’s INTELLI-PRO AI-Powered Process Management Software Suite will also be on display at Productronica 2023. MIRTEC’s Award-Winning Total Remote Management System (TRMS) is a fully integrated Industry 4.0 Solution that combines remote management with real-time data monitoring and analysis for each system within the SMT production line. MIRTEC’s TRMS provides real-time remote monitoring of status information and statistical data such as equipment operation status, production yield, PC resources, temperature, humidity, etc. The combination of MIRTEC’s 3D inspection systems and TRMS provides a vast improvement in production process management.

The advanced Remote Debugging System (RDS) provides non-stop debugging from the remote terminal, but more importantly, it is the base application of the Optimum Inspection Tool (OIT), the AI assistant for the debugging process. The user can simply run the inspection on the PCB and review the results to determine if a part is good or defective. The AI-applied software will suggest optimal parameter values. From MIRTEC’s research, it takes approximately ten PCBs to get the optimized result under general conditions. These two software solutions help to reduce teaching time by about 90% compared to manual teaching, and 50% compared to auto teaching tools without Deep Learning. OIT is easy to use and highly accurate, so even a new operator can easily create the optimal inspection recipes.

The post-inspection stage is a process in which inspection results are reviewed and classified. When the AOI finds a defect, the PCB will be sent to an NG buffer. Upon review, an operator will be able to judge if the defect is real or a false call. MIRTEC’s Deep Learning Auto Defect Classification Tool can change that. This software will ‘suggest’ to the user whether the defect on a NG PCB is a real defect or a false call. However, as the software accumulates inspection data, the software will learn to identify real versus false calls. The predictions will become more accurate over time. Eventually, after approximately six months of learning, the software can then ‘judge’ the defect rather than ‘suggest’ to the user.

“AOI and SPI manufacturers continue to launch new features for their machines, however, it is nearly impossible to develop this technology in all directions,” stated Chanwha Pak, CEO of MIRTEC. “Most manufacturers, including MIRTEC, continue to focus heavily on AI as a means of resolving issues such as false call rates, but many vendors have simply lost sight of the fact that that these inspection systems are based on Optical and Vision Technology. If the inspection system is unable to capture clear images for data processing then “all bets are off”. MIRTEC continues to invest heavily in developing state-of-the-art 3D Inspection Technology designed to satisfy the most demanding inspection requirements. We look forward to welcoming visitors to Booth #461 in Hall A2 at Productronica 2023 for a clear understanding of why MIRTEC is regarded as one of the most Progressive and Dynamic Suppliers of Inspection Technology to the Electronics Manufacturing Industry.”

CHINO, CA – Scienscope International is about to make history in Hall A3, Stand 103 at productronica 2023, taking place from Nov. 14-17 at the world renowned Messe München in Munich, Germany. This isn't just any exhibition; it's a mind-blowing journey into the cutting-edge world of inspection technology that will leave you in awe.

Scienscope offers cutting-edge placement automation solutions that have thrived in the European electronics industry for 25 years. They set new standards in technology and service to meet and exceed the needs of their esteemed clientele. Productronica is not just an industry event; it's a global phenomenon and an absolute must-attend. Held biennially in vibrant Munich, Germany, this show transcends conventional trade exhibitions. It's the epicenter where pioneers, visionaries, and innovators converge to redefine electronics manufacturing. Productronica is where innovation, opportunity, and success intersect; missing it is not an option for anyone in electronics manufacturing!

Here is a sneak peek at Scienscope’s groundbreaking systems that are set to redefine the industry:

IMS-200: The Ultimate Component Reels Labeling Dynamo

Forget everything you knew about labeling systems. The IMS-200 is here to redefine the game. It scans component reel barcodes, feeds data into MES systems, generates fresh labels, prints them, and attaches them to the reels – all in an instant. With a 95% success rate reading various barcode types, it's not just the future; it's the NOW!

AXC-800 III: Unleashing the Power of AI in Component Counting

Counting components just got a whole lot smarter. The AXC-800III combines AI algorithms and X-ray tech to achieve an incredible 99.9% accuracy rate. It syncs seamlessly with Manufacturing Execution Systems (MES), providing real-time results and automatic label generation. The future of component counting is here, and it's brilliant.

Smart Rack for Reels and Stencils: Material Management, Elevated

Scienscope's Smart Storage Rack family takes material management to a whole new level. Designed for efficiency, accuracy, and customization, these racks offer features like automatic reel detection and multi-color LEDs for simultaneous multi-kitting. It's material management, but not as you know it.

IMS-100: Automating and Simplifying the Incoming Process

The IMS-100 is all about automation and simplicity. With a high-resolution barcode camera, it reads and stores data for multiple reel sizes, eliminating human errors and maximizing efficiency. Human error? Not with the IMS-100 (T) around.

Xspection 3000: The X-ray Revolution

Scienscope's Xspection 3000 is the flagship of offline X-ray inspection systems, rewriting the book on quality assurance and process stability. With variants including a top-of-the- line 130kV closed-tube technology, it's the ultimate choice for uncompromising quality control.

Scienscope isn't merely a solution; it's your gateway to warehouse automation, state-of-the-art machine vision, and revolutionary X-ray and optical inspection. It's not just a time-saver; it's a game- changer, trimming labor costs, averting production halts, and safeguarding your component supply.

Prepare to be captivated by the forefront of electronics production and innovation at productronica 2023. Join us at Scienscope Hall A3, Stand 103, and embark on a journey into the future of manufacturing."

For further information, please email Scienscope at info@scienscope.com, call 1-909- 590-7273, or visit www.scienscope.com

REDONDO BEACH, CA – Surfx Technologies, LLC, to announce its participation in productronica 2023, one of the industry’s premier trade shows for electronics manufacturing and assembly. The company will be focusing on its revolutionary flux-free flip chip and hybrid wafer bonding technologies, showcasing its commitment to advancing semiconductor manufacturing processes. The event is scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany.

Two distinguished manufacturer representatives will represent Surfx Technologies at productronica this year, providing attendees with valuable insights into the company's cutting- edge solutions.

Novel-Technology Transfer GmbH Hall B1, Stand 916:

Visit the expansive booth of Novel-Technology Transfer GmbH to witness Surfx Technologies' flagship product, the STA-10iL machine, in action. This state- of-the-art machine is configured for cleaning and oxide removal from 300mm wafers, and attendees will have the opportunity to witness live demonstrations, gaining firsthand experience of its capabilities.

The live demonstrations will highlight the effectiveness of the STA-10iL machine in providing flux-free cleaning solutions for semiconductor wafers. Surfx's unique technology ensures a pristine wafer surface, essential for achieving high-yield and high-performance semiconductor devices.

In addition to the live demonstrations, a video reel will be presented, showcasing the STW wafer cleaning tool and various Atmospheric Argon Plasma cleaning applications tailored to the semiconductor industry. This multimedia presentation will provide attendees with a comprehensive understanding of Surfx’s wide-ranging capabilities in surface treatment.

Bentec Hall A3, Stand 120:

Bentec, another respected industry representative, will be featuring a dedicated section of their booth for Surfx Technologies. Attendees can visit this area to learn how Surfx's Atomflo™ technology will revolutionize the PCB manufacturing landscape.

"We are excited to be part of productronica 2023 and to have the opportunity to showcase our flux-free flip chip and hybrid wafer bonding technologies," said Robert Hicks, President & CEO at Surfx Technologies. "Our presence at this event reflects our dedication to advancing semiconductor manufacturing processes and providing our customers with the most reliable and effective surface treatment solutions."

Surfx Technologies invites all productronica attendees to visit the Novel-Technology Transfer GmbH and Bentec booths to witness these groundbreaking innovations in action and learn more about the future of clean surfaces throughout semiconductor manufacturing.

For more information, visit www.surfxtechnologies.com